Patents by Inventor Hideki Sagano
Hideki Sagano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230386965Abstract: The present invention provides a heat sink unit that has a small mounting area and high radiating efficiency without breaking or damaging the IC package. The heat sink unit includes a base, a heat sink, a unit base, a heat sink mount, a frame member, a first lever, and a second lever. When the frame member 6 reaches a confronting position, further rocking is restricted, the heat sink mount supported by the frame member moves downward, and the end surface of the heat sink supported by the heat sink mount comes into contact with the IC package.Type: ApplicationFiled: October 7, 2021Publication date: November 30, 2023Inventors: Koichi MIWA, Hideki SAGANO, Masaru SATO
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Patent number: 10044124Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.Type: GrantFiled: February 14, 2017Date of Patent: August 7, 2018Assignee: YAMAICHI ELECTRONICS CO., LTD.Inventors: Hideki Sagano, Hideki Sato
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Publication number: 20170250484Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.Type: ApplicationFiled: February 14, 2017Publication date: August 31, 2017Applicant: YAMAICHI ELECTRONICS CO., LTD.Inventors: Hideki SAGANO, Hideki SATO
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Patent number: 7871283Abstract: A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.Type: GrantFiled: December 3, 2007Date of Patent: January 18, 2011Assignee: Yamaichi Electronics Co., Ltd.Inventors: Eiichi Murakoshi, Hideki Sato, Hideki Sagano
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Publication number: 20100261370Abstract: A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.Type: ApplicationFiled: December 3, 2007Publication date: October 14, 2010Applicant: YAMAICHI ELECTRONICS CO., LTD.Inventors: Eiichi Murakoshi, Hideki Sato, Hideki Sagano
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Patent number: 6602084Abstract: An open top IC socket according to the present invention includes a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the contact sections, a socket base for containing and holding the IC package mounting units in an aligned state, a coupling member for mutually coupling the individual slide blocks of the IC package mounting units, and a block operation element mounted on the socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks. According to the present invention, the mounting and detaching of the plurality of the IC packages can be achieved simultaneously.Type: GrantFiled: March 18, 2002Date of Patent: August 5, 2003Assignee: Yamaichi Electronics Co., Ltd.Inventors: Hideki Sagano, Noriyuki Matsuoka
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Publication number: 20020151203Abstract: An open top IC socket according to the present invention includes a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the contact sections, a socket base for containing and holding the IC package mounting units in an aligned state, a coupling member for mutually coupling the individual slide blocks of the IC package mounting units, and a block operation element mounted on the socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks. According to the present invention, the mounting and detaching of the plurality of the IC packages can be achieved simultaneously.Type: ApplicationFiled: March 18, 2002Publication date: October 17, 2002Inventors: Hideki Sagano, Noriyuki Matsuoka
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Patent number: 5573427Abstract: An IC socket includes a socket body, an IC receiving portion formed in the socket body, an engagement members for engaging an upper edge or upper surface of an IC package received in the IC receiving portion and applying a push-down force thereto, and a support members for elastically supporting the lower surface or lower edge of the IC package and applying a push-up force thereto. The IC package is held between the support members and the engagement members.Type: GrantFiled: January 21, 1994Date of Patent: November 12, 1996Assignee: Yamaichi Electronics Co., Ltd.Inventor: Hideki Sagano
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Patent number: 5437557Abstract: An IC socket comprising an IC platform and a restriction wall formed on the IC platform and adapted to restrict distal ends of leads on an IC or a side surface of the IC. The restriction wall includes a slant surface for guiding the IC when the IC is loaded on the IC socket. The slant surface is oriented such that the IC is turned in a horizontal direction in order to correct the horizontal inclination of the IC.Type: GrantFiled: December 23, 1993Date of Patent: August 1, 1995Assignee: Yamaichi Electronics Co., Ltd.Inventor: Hideki Sagano
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Patent number: 5395260Abstract: An IC socket has a plurality of contacts arranged so as to be subjected to pressing contact with terminal members of an IC package loaded on an IC loading portion. An elastic sheet, whose base material itself has compressibility and restorability, is disposed on the IC loading portion. The IC package loaded on the IC loading portion is supported on the elastic sheet.Type: GrantFiled: December 28, 1993Date of Patent: March 7, 1995Assignee: Yamaichi Electronics Co., Ltd.Inventors: Nanahiro Hayakawa, Hideki Sagano
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Patent number: 5348483Abstract: An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on the IC platform, the contacts being inserted into corresponding slits formed between adjacent the partition walls so that the contacts are orderly arranged with respect to the leads of the IC package, a foremost end face of each of the leads of the IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating the slits so that the leads are correctly positioned.Type: GrantFiled: January 11, 1994Date of Patent: September 20, 1994Assignee: Yamaichi Electronics Co., Ltd.Inventor: Hideki Sagano
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Patent number: 5304072Abstract: To shift contacts of a socket for an electric part rearwardly, there is provided a slider for sliding the contacts. The slider is slid in the same direction that it moves the contacts. The slider and the contacts are engaged with each other in such a manner as to cooperatively act such that the contacts are shifted rearwardly by sliding the slider rearwardly.Type: GrantFiled: October 15, 1992Date of Patent: April 19, 1994Assignee: Yamaichi Electronics Co., Ltd.Inventors: Shuuji Kunioka, Hideki Sagano, Kazumi Uratsuji