Patents by Inventor Hideki SAIJO

Hideki SAIJO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11260635
    Abstract: A resin composition resulting in a cured article which is excellent in balance among mechanical strength, surface smoothness, and light transmittance, a method for producing a cured article, a cured article, and a flexible substrate or flexible display including the cured article. The resin composition includes a polyamic acid having a structural unit represented by the following formula (1), a cellulose compound having a weight average molecular weight of 60,000 or less, and an organic solvent. In the formula (1), A is a tetravalent organic group and B is a divalent organic group.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 1, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hideki Saijo, Hiroyuki Kikuchi, Jiro Hikida, Dai Shiota
  • Publication number: 20180230330
    Abstract: A resin composition resulting in a cured article which is excellent in balance among mechanical strength, surface smoothness, and light transmittance, a method for producing a cured article, a cured article, and a flexible substrate or flexible display including the cured article. The resin composition includes a polyamic acid having a structural unit represented by the following formula (1), a cellulose compound having a weight average molecular weight of 60,000 or less, and an organic solvent. In the formula (1), A is a tetravalent organic group and B is a divalent organic group.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 16, 2018
    Inventors: Hideki SAIJO, Hiroyuki KIKUCHI, Jiro HIKIDA, Dai SHIOTA