Abstract: A power QFN package includes signal leads, a die pad, support leads, and an adhesive for die bonding. These elements are encapsulated with a resin encapsulant. The lower parts of the signal leads are exposed from the resin encapsulant to function as external electrodes. A middle part of the die pad is formed at a higher level than a peripheral part thereof. This permits the formation of through holes in a thin part of the die pad. This enhances the degree of flexibility in the size of a semiconductor chip and the moisture resistance thereof.

Abstract: A semiconductor device includes a die pad of a conductive material, a quadrilateral semiconductor element mounted on the die pad, a plurality of suspension members of the conductive material extending outward from the die pad, a plurality of leads of the conductive material provided between adjacent two of the suspension members and each having a lead end opposed to the semiconductor element, a plurality of thin conductive wires through which the semiconductor element is connected to the leads, respectively, an encapsulant for encapsulating the die pad, the semiconductor element, the suspension members, parts of the leads and the thin conductive wires, and a grounding lead of the conductive material extending from at least one of the suspension members and provided, in part, between one and another of the leads.

Abstract: A power QFN package includes signal leads, a die pad, support leads, and an adhesive for die bonding. These elements are encapsulated with a resin encapsulant. The lower parts of the signal leads are exposed from the resin encapsulant to function as external electrodes. A middle part of the die pad is formed at a higher level than a peripheral part thereof. This permits the formation of through holes in a thin part of the die pad. This enhances the degree of flexibility in the size of a semiconductor chip and the moisture resistance thereof.

Abstract: A semiconductor device includes a die pad of a conductive material, a quadrilateral semiconductor element mounted on the die pad, a plurality of suspension members of the conductive material extending outward from the die pad, a plurality of leads of the conductive material provided between adjacent two of the suspension members and each having a lead end opposed to the semiconductor element, a plurality of thin conductive wires through which the semiconductor element is connected to the leads, respectively, an encapsulant for encapsulating the die pad, the semiconductor element, the suspension members, parts of the leads and the thin conductive wires, and a grounding lead of the conductive material extending from at least one of the suspension members and provided, in part, between one and another of the leads.