Patents by Inventor Hideki Sakota

Hideki Sakota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor-element mounting substrate, semiconductor device, and electronic equipment
    Patent number: 7816777
    Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: October 19, 2010
    Assignee: Panasonic Corporation
    Inventors: Masanori Minamio, Noboru Takeuchi, Kenichi Itou, Toshiyuki Fukuda, Hideki Sakota
  • Semiconductor-element mounting substrate, semiconductor device, and electronic equipment
    Publication number: 20070158855
    Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.
    Type: Application
    Filed: December 1, 2006
    Publication date: July 12, 2007
    Inventors: Masanori Minamio, Noboru Takeuchi, Kenichi Itou, Toshiyuki Fukuda, Hideki Sakota