Patents by Inventor Hideki Sekine

Hideki Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7991215
    Abstract: An element splitting method to be applied to a finite element analysis. The method includes: splitting the object region by a Delaunay triangulation by using the coordinate of the point on the boundary line, as a nodal point; disposing circles not to intersect with one another, in the object region, by a Monte Carlo method, the Lawson's search algorithm and a predetermined function; provisionally moving the center coordinate of the one circle by specifying six circles having minimum intervals from one circle by the Monte Carlo method, to adopt the center coordinate after movement when the value of the degree of dispersion ? after the movement falls below that before the movement; and splitting the object region by a Delaunay triangulation by using the coordinate of the point on the boundary line and the center coordinate, as nodal points.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: August 2, 2011
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Tomonaga Okabe, Hideki Sekine, Toshimichi Ogisu
  • Patent number: 7522269
    Abstract: A bonded part peeling shape identification device includes: a processor for obtaining measurement value information indicating a spectrum from an output light of an optical fiber sensor arranged in a bonded part, the optical fiber sensor outputting a light in which the spectrum is changed according to a strain; for carrying out a first shape identification calculation using a strain calculated based on the measurement value information, and a second shape identification calculation by a spectral shape of the output light based on the measurement value information; and for identifying a peeling shape of the bonded part based on an identification result of the first shape identification calculation and an identification result of the second shape identification calculation.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: April 21, 2009
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Toshimichi Ogisu, Tomonaga Okabe, Hideki Sekine
  • Publication number: 20080008385
    Abstract: A bonded part peeling shape identification device includes: a processor for obtaining measurement value information indicating a spectrum from an output light of an optical fiber sensor arranged in a bonded part, the optical fiber sensor outputting a light in which the spectrum is changed according to a strain; for carrying out a first shape identification calculation using a strain calculated based on the measurement value information, and a second shape identification calculation by a spectral shape of the output light based on the measurement value information; and for identifying a peeling shape of the bonded part based on an identification result of the first shape identification calculation and an identification result of the second shape identification calculation.
    Type: Application
    Filed: June 12, 2007
    Publication date: January 10, 2008
    Inventors: Toshimichi Ogisu, Tomonaga Okabe, Hideki Sekine
  • Publication number: 20070292016
    Abstract: An element splitting method to be applied to a finite element analysis. The method includes: splitting the object region by a Delaunay triangulation by using the coordinate of the point on the boundary line, as a nodal point; disposing circles not to intersect with one another, in the object region, by a Monte Carlo method, the Lawson's search algorithm and a predetermined function; provisionally moving the center coordinate of the one circle by specifying six circles having minimum intervals from one circle by the Monte Carlo method, to adopt the center coordinate after movement when the value of the degree of dispersion ? after the movement falls below that before the movement; and splitting the object region by a Delaunay triangulation by using the coordinate of the point on the boundary line and the center coordinate, as nodal points.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 20, 2007
    Inventors: Tomonaga Okabe, Hideki Sekine, Toshimichi Ogisu
  • Patent number: 4759214
    Abstract: The disclosed method introduces a pressure effectivity factor h, so as to continuously determine fracture toughness K.sub.IC of rock during core boring by using the equation ofK.sub.IC =0.346.sqroot.N/.epsilon.L.multidot.hQ/B; andhere, N is the revolving speed of a coring bit, Q is the pressure supplied to it, L is its drilling speed, B is the width of its bit face, and .epsilon. is the number of rows of its face stones. The pressure effectivity factor h is predetermined by using both a core whose fracture toughness is measured by the ISRM (International Society for Rock Mechanics) method and the above constants which are used in boring the core.
    Type: Grant
    Filed: February 19, 1987
    Date of Patent: July 26, 1988
    Assignee: Tohoku University
    Inventors: Hideki Sekine, Hideaki Takahashi, Hiroyuki Abe