Patents by Inventor Hideki Shibutani

Hideki Shibutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having complimentary bonding pads
    Patent number: 5455460
    Abstract: Among a plurality of pads disposed along four sides of a semiconductor chip, complementary pads connected to individual pads by conductors are provided for the pads situated near the corners of the semiconductor chip to allow different types of packages to be used with the single semiconductor chip.
    Type: Grant
    Filed: January 6, 1994
    Date of Patent: October 3, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Katsunobu Hongo, Hideki Shibutani