Abstract: An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.

Abstract: A module (101) is provided with a substrate including a principal surface (1u), a plurality of electronic components (41, 42, and 43) arranged on the principal surface (1u), a sealing resin (3) covering the principal surface (1u), a ground electrode arranged on the principal surface (1u), a conductive layer (6) covering the sealing resin (3), and a magnetic member (5). The conductive layer (6) is electrically connected to the ground electrode by a plurality of connecting conductors (62) arranged so as to penetrate the sealing resin (3), and the magnetic member (5) includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin (3) and a magnetic member wall-shaped portion (52) arranged in a wall shape in the sealing resin (3). The magnetic member wall-shaped portion (52) is longer than each of the connecting conductors (62).

Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

Abstract: An electronic component module includes a substrate, a connector, an electronic component, a conductor wall, an insulating resin, and a conductive shield film. The connector and the electronic component are mounted on a first main surface of the substrate. The conductor wall has a cylindrical shape, is mounted on the first main surface of the substrate, and includes an interior space in which the connector is disposed. The insulating resin is provided on the first main surface. The conductive shield film is provided on a surface of the insulating resin. The insulating resin covers the electronic component and is disposed outside the conductor wall except the interior space of the conductor wall.

Abstract: An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.

Abstract: A circuit module (100) includes a substrate (10) having a plurality of internal conductors (2), a first electronic component disposed on one principal surface (S1) of the substrate (10), a first resin layer (40) provided on the one principal surface (S1) and sealing the first electronic component, a plurality of outer electrodes (B1) provided on the other principal surface (S2) of the substrate (10) and including a ground electrode, a conductor film (50) at least provided on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode via at least one of the plurality of internal conductors (2), and a resin film (60).

Abstract: A module (101) is provided with a substrate including a principal surface (1u), a plurality of electronic components (41, 42, and 43) arranged on the principal surface (1u), a sealing resin (3) covering the principal surface (1u), a ground electrode arranged on the principal surface (1u), a conductive layer (6) covering the sealing resin (3), and a magnetic member (5). The conductive layer (6) is electrically connected to the ground electrode by a plurality of connecting conductors (62) arranged so as to penetrate the sealing resin (3), and the magnetic member (5) includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin (3) and a magnetic member wall-shaped portion (52) arranged in a wall shape in the sealing resin (3). The magnetic member wall-shaped portion (52) is longer than each of the connecting conductors (62).

Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

Abstract: A circuit module (100) includes a substrate (10) having a plurality of internal conductors (2), a first electronic component disposed on one principal surface (S1) of the substrate (10), a first resin layer (40) provided on the one principal surface (S1) and sealing the first electronic component, a plurality of outer electrodes (B1) provided on the other principal surface (S2) of the substrate (10) and including a ground electrode, a conductor film (50) at least provided on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode via at least one of the plurality of internal conductors (2), and a resin film (60).

Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.

Abstract: A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.