Patents by Inventor Hideki Shirota

Hideki Shirota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6331239
    Abstract: A method of electroplating non-conductive plastic moldings, the method comprising the steps of: applying a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound; forming an electrically conductive coating on the surface of the moldings using an electroless copper plating solution containing a copper compound, a saccharide having a reducing property, a complexing agent and an alkali metal hydroxide; and electroplating the coated moldings. According to the method, an electroplated coating excellent in appearance and properties can be formed on non-conductive plastic moldings by a simple procedure.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: December 18, 2001
    Assignee: Okuno Chemical Industries Co., Ltd.
    Inventors: Hideki Shirota, Jun Okada