Patents by Inventor Hideki Sugahara
Hideki Sugahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170051165Abstract: A conductive paste includes electrically conductive particles, a binder, an organic solvent, a glass powder, and a specific amount of inorganic oxide particles that are at least partially surface-coated with an organophosphorus compound and have a specific average particle size. Solar cell electrodes formed by firing the conductive paste have increased bond strength with a substrate.Type: ApplicationFiled: August 12, 2016Publication date: February 23, 2017Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Hiroto Ohwada, Kazuyuki Matsumura, Hideki Sugahara, Yoshiteru Sakatume
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Patent number: 7875695Abstract: A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa-s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).Type: GrantFiled: October 14, 2008Date of Patent: January 25, 2011Assignees: GC Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Kamohara, Toshiyuki Ozai, Hideki Sugahara
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Patent number: 7704607Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.Type: GrantFiled: October 2, 2008Date of Patent: April 27, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
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Publication number: 20100069525Abstract: A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa·s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).Type: ApplicationFiled: October 14, 2008Publication date: March 18, 2010Applicants: GC Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Kamohara, Toshiyuki Ozai, Hideki Sugahara
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Patent number: 7501183Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.Type: GrantFiled: September 24, 2002Date of Patent: March 10, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
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Publication number: 20090043029Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.Type: ApplicationFiled: October 2, 2008Publication date: February 12, 2009Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
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Patent number: 6613440Abstract: An addition reaction curing type silicone rubber composition comprising (A) an alkenyl-containing diorganopolysiloxane, (B) an alkaline earth metal carbonate powder surface treated with a diorganopolysiloxane, (C) an organohydrogenpolysiloxane, and (D) a platinum group metal catalyst has improved storage stability in that it gives off little or no hydrogen gas during storage. The composition has improved adhesion and a good ability to protect electric or electronic parts from corrosion and finds typical use in the sealing of electric or electronic parts.Type: GrantFiled: July 17, 2001Date of Patent: September 2, 2003Assignee: Shin-Etsy Cgenucak Ci, M KtdInventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue, Takashi Aketa
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Publication number: 20030105206Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 &OHgr;·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.Type: ApplicationFiled: September 24, 2002Publication date: June 5, 2003Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
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Publication number: 20020037963Abstract: An addition reaction curing type silicone rubber composition comprising (A) an alkenyl-containing diorganopolysiloxane, (B) an alkaline earth metal carbonate powder surface treated with a diorganopolysiloxane, (C) an organohydrogenpolysiloxane, and (D) a platinum group metal catalyst has improved storage stability in that it gives off little or no hydrogen gas during storage. The composition has improved adhesion and a good ability to protect electric or electronic parts from corrosion and finds typical use in the sealing of electric or electronic parts.Type: ApplicationFiled: July 17, 2001Publication date: March 28, 2002Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue, Takashi Aketa
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Patent number: 5945466Abstract: A room temperature curable organopolysiloxane composition including: (A) 100 parts by weight of a diorganopolysiloxane represented by the general formula (1):HO?Si(R.sup.1).sub.2 O!.sub.n H (1)wherein R.sup.1 represents a substituted or unsubstituted monovalent hydrocarbon group, and n is an integer of 15 or more;(B) from 0.1 part by weight to 20 parts by weight of an organosilane, or a partially hydrolyzed product thereof, represented by the general formula (2):(R.sup.2).sub.m S(OR.sup.2).sub.4-m (2)wherein R.sup.2 's each independently represent a substituted or unsubstituted monovalent hydrocarbon group, and m is 0, 1 or 2;(C) from 0.01 part by weight to 10 parts by weight of a curing catalyst;(D) from 20 parts by weight to 600 parts by weight of a magnesium silicate; and(E) from 5 parts by weight to 80 parts by weight of a paraffin type aliphatic hydrocarbon which is liquid or semi-solid at room temperature. This composition can be rapidly cured, even after a long-term storage.Type: GrantFiled: May 21, 1997Date of Patent: August 31, 1999Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masayuki Ikeno, Hideki Sugahara
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Patent number: 5792723Abstract: A platinum catalyst containing (A) a platinum complex having a vinyl-containing organosiloxane ligand and (B) a vinyl-containing organopolysiloxane is prepared by mixing components (A) and (B) such that at least 2 mol of vinyl group in component (B) is available per mol of platinum atom in component (A) and heating the mixture at 40.degree.-100.degree. C. for at least 1 hour. When blended in an addition reaction curing type organosiloxane composition, the platinum catalyst has the advantage that even after long-term storage at elevated temperatures, it remains stable and active enough to cause the organosiloxane composition to cure.Type: GrantFiled: November 20, 1996Date of Patent: August 11, 1998Assignee: Shin-Estu Chemical Co., Ltd.Inventors: Masayuki Ikeno, Hideki Sugahara, Hironao Fujiki
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Patent number: 5631320Abstract: The present invention relates to a soft lining material composition for dentures, which comprises, at specific ratios, an organopolysiloxane having a specific structure and a viscosity lying in a specific range, an organohydrogenpolysiloxane having another specific structure, a platinum compound soluble in silicone, a finely divided silica having a BET specific surface area lying in a specific range and subjected to a hydrophobic treatment on the surface, and a molten quartz powder having an average particle size lying in a specific range, such soft lining material composition providing a cured soft lining material composition which undergoes a little hardness change upon inserted in the mouth over an extended period of time, does not separate away from a denture, and being satisfactory in terms of the ability to be cut and polished.Type: GrantFiled: April 8, 1996Date of Patent: May 20, 1997Assignees: GC Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Kamohara, Shunichi Futami, Masayuki Ikeno, Hideki Sugahara
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Patent number: 5342983Abstract: Organic silicon compounds which are expressed by the general chemical formulae (I) or (II): ##STR1## wherein R.sup.1 is a monovalent organic group with 1 to 8 carbon atoms; R.sup.2, R.sup.3 and R.sup.4 in each equation are independent and either a monovalent organic group with 1 to 8 carbon atoms or a siloxyl group expressed by ##STR2## wherein R.sup.5, R.sup.6 and R.sup.7 are independent in each equation and they are a monovalent organic group with 1 to 8 carbon atoms; and a is either 0, 1 or 2. The novel organic silicon compounds possess both a polymerizable double bond and organopolysiloxane within the same molecule. These compounds are superior in their polymerizability and copolymerizability and are useful as polymer reforming agents.Type: GrantFiled: March 5, 1993Date of Patent: August 30, 1994Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Yamazaki, Hideki Sugahara, Shoji Ichinohe, Toshinobu Ishihara, Tohru Kubota
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Patent number: 4774278Abstract: An improved coating composition is proposed which comprises a conventional resin component for coating admixed with a silicone resin in combination with an organopolysiloxane having specified substituent groups in an object of forming non-skid coating films imparted with non-blocking property at the same time.Type: GrantFiled: September 25, 1986Date of Patent: September 27, 1988Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Yoshioka, Ichiro Ono, Hideki Sugahara
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Patent number: 4722951Abstract: The coating composition, e.g. paints and lacquers, prepared according to the invention is imparted with greatly improved surface properties of the coating film formed therefrom in respect of the resistance against peeling of the coating film and decreased blocking by virtue of the unique additive which is an organopolysiloxane having, in a molecule, at least one organosiloxane unit having a 2,3-dihydroxypropylamino-substituted group such as --C.sub.3 H.sub.6 --NH--CH.sub.2 --CHOH--CH.sub.2 OH and --C.sub.3 H.sub.6 --NH--CH.sub.2 CH.sub.2 --NH--CH.sub.2 --CHOH--CH.sub.2 OH bonded to the silicon atom.Type: GrantFiled: August 19, 1986Date of Patent: February 2, 1988Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroshi Yoshioka, Ichiro Ono, Hideki Sugahara