Abstract: An inspection process before component mounting for all component mounting positions on which components are to be mounted is performed when a reenter mode is not set by operation of a reenter switch, a recognition camera is first caused to recognize the component mounting position and then a component presence inspection process which inspects whether or not the component is mounted on the component mounting position is performed when the reenter mode is set by the reenter switch, and, the inspection process before component mounting is performed for the component mounting position on which the component is not mounted.

Abstract: To provide a substrate transport apparatus and a substrate transport method that enable curtailing of a mounting wait time incidental to movement of support pins. Height data pertaining to components 10 mounted on a back side of a substrate 1 are stored beforehand. During substrate carrying-in operation, support pins 7 are caused to descend according to component height data and wait at a height h1 where to be able to avoid interference with the components 10. During substrate carrying-out operation, the support pins 7 are caused to descend according to the component height data and recede to the height h1 where to be able to avoid interference with the components 10.

Abstract: In an electronic component mounting system constituted by interconnecting a plurality of mounting apparatuses, a board ID code attached by digital data to the board is read in a board supply apparatus located in the uppermost stream and transmitted to the mounting apparatuses on the downstream side via communication means. By comparing the transmitted board ID code with mounting nonrequirement board code data (defective board code, read error code, dummy board code, etc.) preparatorily stored in a storage section in the mounting apparatus, it is determined whether or not execution of mounting operation of the board is required, and the board determined to be not required to be subjected to mounting is unloaded to the downstream side without carrying out mounting works and without line stop.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting system that can provide accurate operation instruction by displaying an operation instruction screen on a display panel in sufficient amount of information and an operation instruction method for use in the electronic component mounting system. In an electronic component mounting system formed by interlinking a plurality of machines in series, a main screen making up an operation instruction screen is displayed on a display panel (20) belonging to an operation target machine (M*) to be operated by a machine operator, and a sub-screen (1) and another sub-screen (2) of the operation instruction screen are displayed in a preset display format on respective display panels (20) belonging to two adjacent machines [M(L) and M(R)] placed adjacently on both sides of the operation target machine (M*) among the plurality of machines.

Abstract: In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.

Abstract: An electronic parts mounting apparatus and an electronic parts mounting method for picking up a plurality of electronic parts simultaneously by a transfer head having a plurality of suction nozzles from a plurality of tape feeders and then mounting the electronic parts on a substrate are provided. Displacement amounts of parts stop positions in respective tape feeders are detected in advance and stored as stop position correction data, and then tape feeding mechanisms are controlled based on the stop position correction data upon picking up the parts by the transfer head to execute such a registration that causes the parts stop positions to coincide with parts suction positions of the suction nozzles in the transfer head.

Abstract: Oscillators have capacitors, respectively, whose capacitances change according to an external force and generate first oscillating signals according to the capacitances. Each of the capacitors is disposed, for example, between a substrate and a mass body that is movably disposed to face the substrate and oscillates in a direction perpendicular to the substrate. A detecting unit detects a relative difference between the capacitances of the capacitors as a difference between frequencies of the first oscillating signals. An angular speed or acceleration applied in a horizontal direction of the substrate is calculated according to the frequency change detected by the detecting unit. Therefore, a capacitance difference detecting circuit and a MEMS sensor that detect a minute change in the capacitances of the two capacitors caused by the external force are formed.

Abstract: Oscillators have capacitors, respectively, whose capacitances change according to an external force and generate first oscillating signals according to the capacitances. Each of the capacitors is disposed, for example, between a substrate and a mass body that is movably disposed to face the substrate and oscillates in a direction perpendicular to the substrate. A detecting unit detects a relative difference between the capacitances of the capacitors as a difference between frequencies of the first oscillating signals. An angular speed or acceleration applied in a horizontal direction of the substrate is calculated according to the frequency change detected by the detecting unit. Therefore, a capacitance difference detecting circuit and a MEMS sensor that detect a minute change in the capacitances of the two capacitors caused by the external force are formed.

Abstract: An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.

Abstract: It is an object to provide an electronic parts mounting apparatus and an electronic parts mounting method capable of extending a target area from which plural parts can be sucked simultaneously and thus improving an efficiency of an operation to pick up electronic parts from a parts supplying portion.

Abstract: In a part-mounting system formed by linking plural part-mounting devices which carry out respective process steps of part-mounting, when a production tact-time of one of the devices varies beyond a given variation range, a tact-time change signal is sent to other devices located at upstream and/or downstream of the device via a communicating section. The other devices receive the tact-time change signal and changes their own work tact-times from the ones corresponding to a productivity-oriented mode to a slower tact-pattern corresponding to a quality-oriented mode. Thus every device constituting the system can accommodate a tact-time variation due to a tact-time delay of any part-mounting device. As a result, the quality appropriate to the tact-time can be secured.

Abstract: When plural board blocks formed in one board undergo sequential part-mountings at plural mounting stages, particular recognition points and recognition points in the board blocks target of a downstream mounting stage are recognized at an upstream mounting stage. Relative positional data of each recognition point of the board block with respect to the particular recognition points are thus obtained at the upstream mounting stage. At the mounting stage on downstream side, only the particular recognition points are recognized thereby detecting a whole position of the board. Based on the whole position and the relative positional data, a positional deviation of the board block at the mounting stage can be detected, so that repeated recognition of the same recognition points is avoided thereby shortening a total time of position recognition.

Abstract: An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.

Abstract: In a part-mounting system formed by linking plural part-mounting devices which carry out respective process steps of part-mounting, when a production tact-time of one of the devices varies beyond a given variation range, a tact-time change signal is sent to other devices located at upstream and/or downstream of the device via a communicating section. The other devices receive the tact-time change signal and changes their own work tact-times from the ones corresponding to a productivity-oriented mode to a slower tact-pattern corresponding to a quality-oriented mode. Thus every device constituting the system can accommodate a tact-time variation due to a tact-time delay of any part-mounting device. As a result, the quality appropriate to the tact-time can be secured.

Abstract: A component mounter which includes a component feeder carriage; mounting head having two or more suction nozzles for picking up a component from the feeder carriage; image capturing means for taking an image of each component held by the suction nozzles; and a recognizer for recognizing each component based on image data obtained by the image capturing means according to a mounting sequence of each component. Each component is immediately and individually mounted on a mounting target after recognition. This configuration allows to eliminate wasteful standby time, thus offering efficient component mounting.

Abstract: When plural board blocks formed in one board undergo sequential part-mountings at plural mounting stages, particular recognition points and recognition points in the board blocks target of a downstream mounting stage are recognized at an upstream mounting stage. Relative positional data of each recognition point of the board block with respect to the particular recognition points are thus obtained at the upstream mounting stage. At the mounting stage on downstream side, only the particular recognition points are recognized thereby detecting a whole position of the board. Based on the whole position and the relative positional data, a positional deviation of the board block at the mounting stage can be detected, so that repeated recognition of the same recognition points is avoided thereby shortening a total time of position recognition.