Abstract: A thin-film photovoltaic cell includes a metal substrate; a glass insulating layer formed on the metal substrate; a first electrode layer deposited on the glass insulating layer; a thin-film light absorption layer deposited on the first electrode layer; and a second electrode layer deposited on the thin-film light absorption layer, wherein the coefficient of thermal expansion of the glass insulating layer is larger than the coefficient of thermal expansion of the metal substrate for a predetermined value.

Abstract: A substrate for display device is provided. As a wiring structure of the substrate, the scan line layer and the signal line layer are not connected directly by arranging through-holes between the scan line layer and the signal line layer, but are connected through an ITO layer by arranging through-holes between the scan line layer and the ITO layer and arranging through-holes between the signal line layer and the ITO layer, with an object to reduce the value of the connection resistance between the scan line layer and the signal line layer. Through-holes connecting the scan line layer and the ITO layer and through-holes connecting the signal line layer and the ITO layer are configured in a comb shape respectively and engaged with each other. Thus the length of the ITO connecting the scan line layer and the signal line layer becomes shorter and the value of the connection resistance is reduced.

Abstract: A liquid crystal display (LCD) device has a wiring structure of superfine wiring, wherein it can reduce the occurrence rate of electrostatic discharge (ESD), and the time constant of the scan line can be improved simultaneously. The wiring width in the portions of the scan lines where they intersect the auxiliary capacitance bunching lines is narrowed, so that the area of the intersection and the wiring capacitance is reduced, thus the time constant of the scan line is decreased, meanwhile, the wiring width in portions of the auxiliary capacitance lines where they intersect the auxiliary capacitance bunching line is enlarged, the distance between the adjacent scan line and the nearest portion of the auxiliary capacitance line is shortened, and the ESD occurs at the nearest portion, and the failure products caused by the ESD can be decreased.

Abstract: The present invention relates to a thin film transistor array substrate with multiple chamfers and liquid crystal display device. A wiring structure is provided on the thin film transistor array substrate with multiple chamfers which is used for producing a plurality of thin film transistor arrays from a mother substrate, said wiring structure allows the chamfer quantity to be confirmed easily in the chamfer process for cutting off the corners of the terminal face after the cutting off process for taking out the respective thin film transistor arrays, meanwhile, the OLB pads is not easy to be peeled off from the substrate, and the probability that the OLB pads are peeled off can be reduced.

Abstract: The invention provides wiring, which can form or disconnect freely the adjacent exposure regions by employing the same optical mask under a condition that a plurality of array substrates are produced on one mother glass substrate; and an optical mask, which can be inspected by utilizing the same probe device for inspecting even though under a condition that the same mother glass substrate is used to produce the array substrates with different sizes; array substrates; and the manufacture method of the same.

Abstract: The present invention relates to a thin film transistor array substrate with multiple chamfers and liquid crystal display device. A wiring structure is provided on the thin film transistor array substrate with multiple chamfers which is used for producing a plurality of thin film transistor arrays from a mother substrate, said wiring structure allows the chamfer quantity to be confirmed easily in the chamfer process for cutting off the corners of the terminal face after the cutting off process for taking out the respective thin film transistor arrays, meanwhile, the OLB pads is not easy to be peeled off from the substrate, and the probability that the OLB pads are peeled off can be reduced.

Abstract: A substrate for display device is provided. As a wiring structure of the substrate, the scan line layer and the signal line layer are not connected directly by arranging through-holes between the scan line layer and the signal line layer, but are connected through an ITO layer by arranging through-holes between the scan line layer and the ITO layer and arranging through-holes between the signal line layer and the ITO layer, with an object to reduce the value of the connection resistance between the scan line layer and the signal line layer. Through-holes connecting the scan line layer and the ITO layer and through-holes connecting the signal line layer and the ITO layer are configured in a comb shape respectively and engaged with each other. Thus the length of the ITO connecting the scan line layer and the signal line layer becomes shorter and the value of the connection resistance is reduced.

Abstract: The object of the present invention is to provide a liquid crystal display device, which can be used in the active matrix type liquid crystal display device and has a wiring structure of superfine wiring, and a method for manufacturing the liquid crystal display device, wherein it can reduce the occurrence rate of the failures caused by the static electricity which damages the insulating layer of the electrodes or between the electrodes in the manufacturing process, and the time constant of the scan line can be improved simultaneously.

Abstract: A heating element CVD system wherein one or a plurality of connection terminal holders is placed in the processing container, and each of the connection terminal holders holds a plurality of connection terminals. Each of the connection terminals connects the heating element to the electric power supply mechanism electrically such that a connection region of the heating element connected to the connection terminal is not exposed to a space in the processing container.

Abstract: A heating element CVD system wherein one or a plurality of connection terminal holders is placed in the processing container, and each of the connection terminal holders holds a plurality of connection terminals. Each of the connection terminals connects the heating element to the electric power supply mechanism electrically such that a connection region of the heating element connected to the connection terminal is not exposed to a space in the processing container.

Abstract: A method for the formation of copper wiring films includes the steps of forming a first copper film by a CVD method on a diffusion barrier film, which diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been established; heating the first copper film to a temperature within the range from 200 to 500° C.; and subsequently forming a second copper film on the first copper film by a plating method using the first copper film as an electrode.

Abstract: A material having a titanium dioxide crystalline orientation film oriented in a specific direction on a surface of a substrate is produced by spraying a vaporized titanium alkoxide onto the surface of the substrate heated under atmospheric pressure along with an inert gas as a carrier. The material having the titanium dioxide crystalline orientation film is excellent in properties such as an antimicrobial activity, a stain resistance, an ultra-hydrophilic property and the like, and is widely used as kitchen appliances such as cooking utensils, tableware and a refrigerator, tools for medical care, materials for a toilet or a toilet room, a filter of an air-conditioner, electronic parts, building materials and road-associated materials.

Abstract: A method for the formation of copper wiring films includes the steps of forming a first copper film by means of a CVD method on an insulating diffusion barrier film, which insulating diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been established; heating the first copper film to a temperature within the range from 200 to 500° C.; and subsequently forming a second copper film on the first copper film by a plating method using the first copper film as an electrode.

Abstract: A material having a titanium dioxide crystalline orientation film oriented in a specific direction on a surface of a substrate is produced by spraying a vaporized titanium alkoxide onto the surface of the substrate heated under atmospheric pressure along with an inert gas as a carrier. The material having the titanium dioxide crystalline orientation film is excellent in properties such as an antimicrobial activity, a stain resistance, an ultra-hydrophilic property and the like, and is widely used as kitchen appliances such as cooking utensils, tableware and a refrigerator, tools for medical care, materials for a toilet or a toilet room, a filter of an air-conditioner, electronic parts, building materials and road-associated materials.

Abstract: A material having a titanium dioxide crystalline orientation film oriented in a specific direction on a surface of a substrate is produced by spraying a vaporized titanium alkoxide onto the surface of the substrate heated under atmospheric pressure along with an inert gas as a carrier. The material having the titanium dioxide crystalline orientation film is excellent in properties such as an antimicrobial activity, a stain resistance, an ultra-hydrophilic property and the like, and is widely used as kitchen appliances such as cooking utensils, tableware and a refrigerator, tools for medical care, materials for a toilet or a toilet room, a filter of an air-conditioner, electronic parts, building materials and road-associated materials.