Patents by Inventor Hideki Tabei

Hideki Tabei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the preparation of a hot-melt adhesive interconnector
    Patent number: 5041183
    Abstract: The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition.
    Type: Grant
    Filed: January 9, 1990
    Date of Patent: August 20, 1991
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Akio Nakamura, Osami Hayashi, Hideki Tabei