Patents by Inventor Hideki Terasawa

Hideki Terasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11691869
    Abstract: An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: July 4, 2023
    Assignee: DENSO CORPORATION
    Inventors: Suguru Hochi, Hideki Terasawa, Shigeki Sakurai
  • Publication number: 20220369463
    Abstract: An electronic device includes a mounting member having a surface, an electronic component, a solder and a sidefill. The electronic component has a plurality of electrodes on a surface and is mounted on the surface of the mounting member so that the surface of the electronic component having the electrodes faces the surface of the mounting member. The solder is disposed between the mounting member and at least one of the electrodes of the electronic component to electrically and mechanically connect between the at least one of the electrodes and the mounting member. The sidefill is disposed on a periphery of the solder and mechanically connects between the electronic component and the mounting member.
    Type: Application
    Filed: August 1, 2022
    Publication date: November 17, 2022
    Inventors: Keitaro ITO, Teruhisa AKASHI, Hideki TERASAWA, Suguru HOUCHI, Naoki YOSHIDA
  • Publication number: 20220081283
    Abstract: An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 17, 2022
    Inventors: Suguru HOCHI, Hideki TERASAWA, Shigeki SAKURAI
  • Patent number: 11066078
    Abstract: A vehicle position attitude calculation apparatus includes: a road structure recognition portion that acquires information, calculate a road structure shape, calculate a relative road structure lateral position, and calculate a relative road structure yaw angle; a storage portion that stores the road structure shape, the relative road structure lateral position, and the relative road structure yaw angle, an autonomous navigation portion that calculates a relative trajectory; a virtual road structure recognition portion that calculates a virtual relative road structure lateral position and a virtual relative road structure yaw angle; and an output switching portion that outputs the relative road structure lateral position and the relative road structure yaw angle, while the road structure recognition portion can recognize the road structure, and output the virtual relative road structure lateral position and the virtual relative road structure yaw angle, while the road structure recognition portion cannot reco
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: July 20, 2021
    Assignee: DENSO CORPORATION
    Inventor: Hideki Terasawa
  • Publication number: 20190185016
    Abstract: A vehicle position attitude calculation apparatus includes: a road structure recognition portion that acquires information, calculate a road structure shape, calculate a relative road structure lateral position, and calculate a relative road structure yaw angle; a storage portion that stores the road structure shape, the relative road structure lateral position, and the relative road structure yaw angle, an autonomous navigation portion that calculates a relative trajectory; a virtual road structure recognition portion that calculates a virtual relative road structure lateral position and a virtual relative road structure yaw angle; and an output switching portion that outputs the relative road structure lateral position and the relative road structure yaw angle, while the road structure recognition portion can recognize the road structure, and output the virtual relative road structure lateral position and the virtual relative road structure yaw angle, while the road structure recognition portion cannot reco
    Type: Application
    Filed: April 4, 2017
    Publication date: June 20, 2019
    Inventor: Hideki TERASAWA
  • Patent number: 7333228
    Abstract: One of printers linked with each other by way of a network is selected according to a printing condition for a given printing job. System information on whether the selected printer makes print in a plate printing system or in a non-plate printing system is obtained. The given printing job is output to the selected printer so that the selected printer makes copies by page when the selected printer makes print in a plate printing system.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: February 19, 2008
    Assignee: Riso Kagaku Corporation
    Inventors: Hong Yang, Hideki Terasawa, Noriaki Nagao
  • Publication number: 20030214672
    Abstract: One of printers linked with each other by way of a network is selected according to a printing condition for a given printing job. System information on whether the selected printer makes print in a plate printing system or in a non-plate printing system is obtained. The given printing job is output to the selected printer so that the selected printer makes copies by page when the selected printer makes print in a plate printing system.
    Type: Application
    Filed: May 19, 2003
    Publication date: November 20, 2003
    Applicant: RISO KAGAKU CORPORATION
    Inventors: Hong Yang, Hideki Terasawa, Noriaki Nagao
  • Patent number: 6025066
    Abstract: The present invention provides a stencil sheet roll formed by winding up a stencil sheet to form a roll, the sheet including a thermoplastic resin film and a porous support laminated thereto, wherein the compression elastic modulus of the sheet is not less than 32 kg/cm.sup.2. The invention also provides a stencil sheet roll formed by winding up a stencil sheet to form a roll, the sheet including a thermoplastic resin film and a porous support laminated thereto and having been subjected to calender treatment. Also disclosed is a method for manufacturing a stencil sheet roll comprising laminating a thermoplastic resin film to a porous support to form a stencil sheet, subjecting the stencil sheet to calender treatment, and winding up the calender-treated stencil sheet to form a roll.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: February 15, 2000
    Assignee: Riso Kagaku Corporation
    Inventors: Hideki Terasawa, Hiroyo Kikuchi, Takayuki Kurosaki, Mitsuru Ujiie