Patents by Inventor Hideki Tokuyama

Hideki Tokuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090102093
    Abstract: A molded product (consisting of resin compact and substrate) is formed by sealing and molding an electronic component mounted on a substrate in a resin compact by injecting/charging a heated/molten resin material into a cavity. Then, when a pressing member presses an ejector plate urged in a return direction (downward) in an ejective direction (upward) through a presser, a return pin guides mold releasing pins fixedly provided on the ejector plate, thereby ejecting and releasing the molded product from a mold with the mold releasing pins. Upon defective sliding of the mold releasing pins, the mold releasing pins can be returned to return positions by pressing the return pin with an upper mold section.
    Type: Application
    Filed: October 7, 2008
    Publication date: April 23, 2009
    Inventors: Hideki TOKUYAMA, Yohei ONISHI
  • Patent number: 7333972
    Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: February 19, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Chikashi Okamoto, Kazuo Takaragi, Yasuko Fukuzawa, Hideki Tokuyama, Mitsuo Usami
  • Patent number: 7173515
    Abstract: A RFID tag structure determining the authenticity of an article, and an information processing system for reading RFID tags, enable authenticity determinations of articles using read only RFID tags. A plurality of RFID tags, each holding tag information inside ROM (read-only memory) and responding to tag information via a radio wave received from a reader, are designed to have a service identifier which designates a common utilization goal for which the same value is set, and service data which sets different values for the respective RFID tags, as tag information. By dividing the data structure of a RFID tag having a read-only memory into a service identifier, which is common to a certain product, and sequential data for managing individual products, it is possible to confirm that an article is authentic by simply confirming the service identifier.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: February 6, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Masaru Ohki, Hideki Tokuyama, Rei Itsuki, Shojiro Asai, Kazuo Takaragi, Atsushi Tanaka
  • Patent number: 7056770
    Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: June 6, 2006
    Assignees: Towa Corporation, Fujitsu Limited
    Inventors: Hiroshi Uragami, Osamu Nakagawa, Kinya Fujino, Shinji Takase, Hideki Tokuyama, Koichi Meguro, Toru Nishino, Noboru Hayasaka
  • Publication number: 20060004800
    Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat
    Type: Application
    Filed: July 11, 2005
    Publication date: January 5, 2006
    Inventors: Chikashi Okamoto, Kazuo Takaragi, Yasuko Fukuzawa, Hideki Tokuyama, Mitsuo Usami
  • Patent number: 6922686
    Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: July 26, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Chikashi Okamoto, Kazuo Takaragi, Yasuko Fukuzawa, Hideki Tokuyama, Mitsuo Usami
  • Publication number: 20040101631
    Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.
    Type: Application
    Filed: November 20, 2003
    Publication date: May 27, 2004
    Applicants: TOWA CORPORATION, FUJITSU LIMITED
    Inventors: Hiroshi Uragami, Osamu Nakagawa, Kinya Fujino, Shinji Takase, Hideki Tokuyama, Koichi Meguro, Toru Nishino, Noboru Hayasaka
  • Publication number: 20040002977
    Abstract: A small-sized ID chip is attached onto an article, which may be imitated or counterfeited, such as an identify certificate and/or valuable securities, etc., for example. From the small-sized ID chip can be read out an ID through a readout device for exclusive use thereof, and is provided means for memorizing the ID of the small-sized ID chip in relation to information described on a certificate or the like, wherein the ID is read out from the small-sized ID chip attached thereon with using the readout device for exclusive use thereof, thereby to be compared with, by referring to the information in relation to that ID, when determination is made upon verification of the identify certificate, for example.
    Type: Application
    Filed: November 7, 2002
    Publication date: January 1, 2004
    Inventors: Hideki Tokuyama, Katsuya Yokomura, Takao Yoden
  • Publication number: 20030169149
    Abstract: The present invention provides a RFID tag structure suited to determining the authenticity of an article or part, and also provides an information processing system for reading RFID tags, which enables authenticity determinations of articles or parts to be carried out with accuracy using Read only RFID tags.
    Type: Application
    Filed: March 5, 2003
    Publication date: September 11, 2003
    Inventors: Masaru Ohki, Hideki Tokuyama, Rei Itsuki, Shojiro Asai, Kazuo Takaragi, Atsushi Tanaka
  • Publication number: 20020052877
    Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat
    Type: Application
    Filed: August 17, 2001
    Publication date: May 2, 2002
    Inventors: Chikashi Okamoto, Kazuo Takaragi, Yasuko Fukuzawa, Hideki Tokuyama, Mitsuo Usami