Patents by Inventor Hideki Toya
Hideki Toya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11505028Abstract: Provided is a vehicular holding device that, in an ON state, holds a vehicle component in a state where displacement of the vehicle component in an axial direction is restrained, and that, in an OFF state, holds the vehicle component in a state where displacement of the vehicle component in the axial direction is possible. The vehicular holding device includes at least one engagement part, a cam mechanism, and an axial direction restraining part. The at least one engagement part is at a position where the engagement part engages with an engaged part in the ON state, and is at a position where the engagement part is separated from the engaged part in the OFF state. The cam mechanism displaces the at least one engagement part from the OFF-state position to the ON-state position. The axial direction restraining part receives axial-direction force acting on the at least one engagement part.Type: GrantFiled: October 12, 2017Date of Patent: November 22, 2022Assignee: CHUO HATSUJO KABUSHIKI KAISHAInventors: Takashi Goto, Hideki Toya, Toshio Kuwayama, Shinsuke Okura
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Patent number: 10876466Abstract: A wave washer according to an aspect of the present disclosure includes an annular body which is formed around an axis into a wave shape and at least one protruding piece which protrudes inward or outward from the body. The at least one protruding piece includes a flat surface which is perpendicular to the axis.Type: GrantFiled: March 7, 2018Date of Patent: December 29, 2020Assignees: IHI Corporation, CHUO HATSUJO KABUSHIKI KAISHAInventors: Yuichiro Akiyama, Satoshi Ohtani, Naotada Ueda, Michihiko Tanigaki, Hideki Toya
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Publication number: 20200347778Abstract: A wave washer according to an aspect of the present disclosure includes an annular body which is formed around an axis into a wave shape and at least one protruding piece which protrudes inward or outward from the body. The at least one protruding piece includes a flat surface which is perpendicular to the axis.Type: ApplicationFiled: March 7, 2018Publication date: November 5, 2020Applicants: IHI Corporation, CHUO HATSUJO KABUSHIKI KAISHAInventors: Yuichiro AKIYAMA, Satoshi OHTANI, Naotada UEDA, Michihiko TANIGAKI, Hideki TOYA
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Publication number: 20190291530Abstract: Provided is a vehicular holding device that, in an ON state, holds a vehicle component in a state where displacement of the vehicle component in an axial direction is restrained, and that, in an OFF state, holds the vehicle component in a state where displacement of the vehicle component in the axial direction is possible. The vehicular holding device includes at least one engagement part, a cam mechanism, and an axial direction restraining part. The at least one engagement part is at a position where the engagement part engages with an engaged part in the ON state, and is at a position where the engagement part is separated from the engaged part in the OFF state. The cam mechanism displaces the at least one engagement part from the OFF-state position to the ON-state position. The axial direction restraining part receives axial-direction force acting on the at least one engagement part.Type: ApplicationFiled: October 12, 2017Publication date: September 26, 2019Inventors: Takashi Goto, Hideki Toya, Toshio Kuwayama, Shinsuke Okura
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Publication number: 20170211288Abstract: Provided is a rubber bearing formed from a polychloroprene composition and having higher ozone resistance. The rubber bearing comprises a laminate prepared by alternately laminating a plurality of soft layers having rubber elasticity and a plurality of hard layers having rigidity, and a covering layer covering an outer peripheral part of the laminate. The soft layer comprises a rubber composition containing a polychloroprene, and the covering layer comprises a blend rubber composition containing 30 to 95 parts by mass of a polychloroprene and 70 to 5 parts by mass of an elastomer other than the polychloroprene.Type: ApplicationFiled: September 29, 2015Publication date: July 27, 2017Applicant: DENKA COMPANY LIMITEDInventors: Yasushi KAMIHIGASHI, Shinichirou KUMAGAI, Takumi NISHIMURA, Koji FUJITA, Takehiro TOMITA, Tatsuji MATSUMOTO, Yasuhiko KONDO, Yasuchika ITO, Takashi SUNADA, Nobuhiko FUJII, Hideki TOYA, Yasushi ABE
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Patent number: 9475925Abstract: Provided are a blended rubber and a blended rubber composition that give a vulcanizate superior in abrasion resistance and ozone resistance, and a vulcanizate prepared by vulcanizing the blended rubber composition. A blended rubber, comprising 30 to 93 mass % of a chloroprene rubber, 5 to 50 mass % of a soft polyvinyl chloride, and 2 to 20 mass % of an acrylonitrile-butadiene rubber. The polyvinyl chloride resin used preferably has a polymerization degree of 300 to 3000 and the acrylonitrile-butadiene rubber preferably has an acrylonitrile content of 18 to 50 mass %.Type: GrantFiled: March 28, 2014Date of Patent: October 25, 2016Assignee: DENKA COMPANY LIMITEDInventors: Uichiro Yamagishi, Hideki Toya, Satoru Ikari, Yasushi Abe
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Publication number: 20160039999Abstract: Provided are a blended rubber and a blended rubber composition that give a vulcanizate superior in abrasion resistance and ozone resistance, and a vulcanizate prepared by vulcanizing the blended rubber composition. A blended rubber, comprising 30 to 93 mass % of a chloroprene rubber, 5 to 50 mass % of a soft polyvinyl chloride, and 2 to 20 mass % of an acrylonitrile-butadiene rubber. The polyvinyl chloride resin used preferably has a polymerization degree of 300 to 3000 and the acrylonitrile-butadiene rubber preferably has an acrylonitrile content of 18 to 50 mass %.Type: ApplicationFiled: March 28, 2014Publication date: February 11, 2016Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Uichiro YAMAGISHI, Hideki TOYA, Satoru IKARI, Yasushi ABE
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Patent number: 8258236Abstract: The present invention relates to tubular forming material made of a composition comprising block copolymers each made of a vinyl aromatic hydrocarbon and a conjugated diene, which has a uniaxial elongation viscosity at 88° C. at a strain rate of 0.5 sec?1 satisfying the following formula between 1.0 sec and 2.8 sec after initiation of elongation, 0.25<(LOG ?2.8?LOG ?1.0)/(2.8?1.0)<0.4 wherein ?1.0 and ?2.8 represent uniaxial elongation viscosities (Pa·sec) at elongation times of 1.0 sec and 2.8 sec, respectively, when measured by a Meissner model elongation viscometer. The composition contains three block copolymers at a specified blend ratio.Type: GrantFiled: December 21, 2007Date of Patent: September 4, 2012Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tadashi Sawasato, Eiji Sato, Hideki Toya, Hitoshi Nakazawa
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Publication number: 20100105838Abstract: Provided are a material for an MD shrink film with good shrinking performance and thickness accuracy, and a film formed with the material. The material for the MD shrink film is a resin composition comprising a mixture of a block copolymer of a vinyl aromatic hydrocarbon and a conjugated diene and at least one of a vinyl aromatic hydrocarbon polymer, a copolymer of a vinyl aromatic hydrocarbon and (meth)acrylic acid and a copolymer of a vinyl aromatic hydrocarbon and a (meth)acrylate in a mass ratio of from 100/0 to 50/50, and a rubber-modified styrene polymer in an amount of from 0.5 to 3 parts by mass relative to 100 parts by mass of the mixture, wherein a molecular weight distribution (Mw/Mn) of the resin composition exceeds 1.2 and a content of the conjugated diene in monomer units in the resin composition is from 10 to 30% by mass.Type: ApplicationFiled: February 19, 2008Publication date: April 29, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hideki Toya, Eiji Sato, Masamitsu Matsui
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Publication number: 20100022711Abstract: To provide a tubular forming material excellent in bubble formation stability in the case of producing a heat-shrinkable film. To provide a tubular forming material made of a composition comprising block copolymers each made of a vinyl aromatic hydrocarbon and a conjugated diene, which has uniaxial elongation viscosity at 88° C. at a strain rate of 0.5 sec?1 satisfying the following formula between 1.0 sec and 2.8 sec after initiation of elongation, 0.25<(LOG ?2.8?LOG ?1.0)/(2.8?1.0)<0.4 wherein ?1.0 and ?2.8 represent uniaxial elongation viscosities at elongation times of 1.0 sec and 2.8 sec, respectively, when measured by a Meissner model elongation viscometer.Type: ApplicationFiled: December 21, 2007Publication date: January 28, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tadashi Sawasato, Eiji Sato, Hideki Toya, Hitoshi Nakazawa
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Patent number: 7470747Abstract: A block copolymer mixture comprising block copolymers (A), (B) and (C) each block comprising vinyl aromatic hydrocarbon and conjugated diene monomer units: wherein block (A) comprises from 75 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 25 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 30,000 to less than 150,000: block (B) comprises from 50 to 80 mass % of a vinyl aromatic hydrocarbon and from 20 to 50 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 20,000 to less than 120,000, and block (C) comprises from 60 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 40 mass % of a conjugated diene, which has at least one random copolymer block portion comprising, as monomer units, from 55 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 45 mass % of a conjugated dieType: GrantFiled: February 21, 2006Date of Patent: December 30, 2008Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Yoshinari Kurokawa, Hideki Toya, Eiji Sato
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Publication number: 20070196604Abstract: A block copolymer mixture comprising block copolymers (A), (B) and (C) each block comprising vinyl aromatic hydrocarbon and conjugated diene monomer units: wherein block (A) comprises from 75 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 25 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 30,000 to less than 150,000: block (B) comprises from 50 to 80 mass % of a vinyl aromatic hydrocarbon and from 20 to 50 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 20,000 to less than 120,000, and block (C) comprises from 60 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 40 mass % of a conjugated diene, which has at least one random copolymer block portion comprising, as monomer units, from 55 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 45 mass % of a conjugated diene.Type: ApplicationFiled: February 21, 2006Publication date: August 23, 2007Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Yoshinari Kurokawa, Hideki Toya, Eiji Sato
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Publication number: 20070026175Abstract: To provide a foamed film or multilayer foamed film excellent in heat insulating properties, a heat shrinkable foamed film or heat shrinkable multilayer foamed film made thereof, a heat shrinkable label, and a container covered therewith. A styrene foamed film characterized by having at least one foamed layer which contains a resin composition comprising from 20 to 100 parts by mass of the following (a) and from 0 to 80 parts by mass of the following (b) and which has a thickness of from 30 to 200 ?m and a specific gravity of from 0.3 to 0.Type: ApplicationFiled: July 15, 2004Publication date: February 1, 2007Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hideki Toya, Eiji Sato, Yuji Shima
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Patent number: 6700198Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.Type: GrantFiled: October 5, 2001Date of Patent: March 2, 2004Assignees: Shinko Electric Industries Co., Ltd., Fujitsu LimitedInventors: Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa, Toshiyuki Motooka, Hideharu Sakoda, Muneharu Morioka
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Patent number: 6664133Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.Type: GrantFiled: October 8, 2002Date of Patent: December 16, 2003Assignee: Shinko Electric Industries Co., Ltd.Inventors: Akinobu Abe, Tatsuya Inatsugu, Hiroyuki Komatsu, Hideki Matsuzawa, Hideki Toya
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Publication number: 20030067058Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.Type: ApplicationFiled: October 8, 2002Publication date: April 10, 2003Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Akinobu Abe, Tatsuya Inatsugu, Hiroyuki Komatsu, Hideki Matsuzawa, Hideki Toya
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Patent number: 6410649Abstract: A resin composition characterized by comprising from 5 to 95 wt % of an aromatic vinyl compound/olefin random copolymer (A) which has an aromatic vinyl compound content of from 1 to 99 mol % and has a head-to-tail chain structure composed of two or more aromatic vinyl compound units, and from 95 to 5 wt % of an &agr;-olefin type polymer (B) and/or an aromatic vinyl compound type polymer (C) (provided that it is neither a medical material nor a medical device), which contains substantially no chlorine and is excellent in the impact resistance, moldability, weather resistance and chemical resistance and which is useful for an injection molded product, an extrusion molded product, a film, a sheet, etc. Further, it provides an excellent damping material.Type: GrantFiled: September 22, 2000Date of Patent: June 25, 2002Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Takeshi Oda, Shigeru Suzuki, Toru Arai, Akio Okamoto, Masataka Nakajima, Hideki Toya
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Patent number: 6348416Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.Type: GrantFiled: December 6, 1999Date of Patent: February 19, 2002Assignees: Shinko Electric Industries Co., Ltd, Fujitsu LimitedInventors: Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa, Toshiyuki Motooka, Hideharu Sakoda, Muneharu Morioka
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Publication number: 20020019133Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.Type: ApplicationFiled: October 5, 2001Publication date: February 14, 2002Applicant: Shinko Electric Industries Co., LtdInventors: Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa, Toshiyuki Motooka, Hideharu Sakoda, Muneharu Morioka
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Patent number: 6107411Abstract: A block copolymer (hereinafter referred to as the block copolymer (I)), consisting essentially of a vinyl aromatic hydrocarbon and a conjugated diene and satisfying the following conditions (1) to (5):(1) the weight ratio of vinyl aromatic hydrocarbon units to conjugated diene units is from 60:40 to 90:10,(2) the number average molecular weight of the block copolymer is from 40,000 to 500,000,(3) the ratio of E'30/E'10, where E'30 is the storage modulus at a temperature of 30.degree. C. and E'10 is the storage modulus at a temperature of 10.degree. C., is from 0.75 to 1,(4) the block proportion of a vinyl aromatic hydrocarbon polymer contained in the block copolymer is from 70 to 100%, provided the block proportion=W1/W0.times.Type: GrantFiled: January 5, 1998Date of Patent: August 22, 2000Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hideki Toya, Masayoshi Nakazato, Hiroshi Suzuki