Patents by Inventor Hideki Toya

Hideki Toya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11505028
    Abstract: Provided is a vehicular holding device that, in an ON state, holds a vehicle component in a state where displacement of the vehicle component in an axial direction is restrained, and that, in an OFF state, holds the vehicle component in a state where displacement of the vehicle component in the axial direction is possible. The vehicular holding device includes at least one engagement part, a cam mechanism, and an axial direction restraining part. The at least one engagement part is at a position where the engagement part engages with an engaged part in the ON state, and is at a position where the engagement part is separated from the engaged part in the OFF state. The cam mechanism displaces the at least one engagement part from the OFF-state position to the ON-state position. The axial direction restraining part receives axial-direction force acting on the at least one engagement part.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: November 22, 2022
    Assignee: CHUO HATSUJO KABUSHIKI KAISHA
    Inventors: Takashi Goto, Hideki Toya, Toshio Kuwayama, Shinsuke Okura
  • Patent number: 10876466
    Abstract: A wave washer according to an aspect of the present disclosure includes an annular body which is formed around an axis into a wave shape and at least one protruding piece which protrudes inward or outward from the body. The at least one protruding piece includes a flat surface which is perpendicular to the axis.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: December 29, 2020
    Assignees: IHI Corporation, CHUO HATSUJO KABUSHIKI KAISHA
    Inventors: Yuichiro Akiyama, Satoshi Ohtani, Naotada Ueda, Michihiko Tanigaki, Hideki Toya
  • Publication number: 20200347778
    Abstract: A wave washer according to an aspect of the present disclosure includes an annular body which is formed around an axis into a wave shape and at least one protruding piece which protrudes inward or outward from the body. The at least one protruding piece includes a flat surface which is perpendicular to the axis.
    Type: Application
    Filed: March 7, 2018
    Publication date: November 5, 2020
    Applicants: IHI Corporation, CHUO HATSUJO KABUSHIKI KAISHA
    Inventors: Yuichiro AKIYAMA, Satoshi OHTANI, Naotada UEDA, Michihiko TANIGAKI, Hideki TOYA
  • Publication number: 20190291530
    Abstract: Provided is a vehicular holding device that, in an ON state, holds a vehicle component in a state where displacement of the vehicle component in an axial direction is restrained, and that, in an OFF state, holds the vehicle component in a state where displacement of the vehicle component in the axial direction is possible. The vehicular holding device includes at least one engagement part, a cam mechanism, and an axial direction restraining part. The at least one engagement part is at a position where the engagement part engages with an engaged part in the ON state, and is at a position where the engagement part is separated from the engaged part in the OFF state. The cam mechanism displaces the at least one engagement part from the OFF-state position to the ON-state position. The axial direction restraining part receives axial-direction force acting on the at least one engagement part.
    Type: Application
    Filed: October 12, 2017
    Publication date: September 26, 2019
    Inventors: Takashi Goto, Hideki Toya, Toshio Kuwayama, Shinsuke Okura
  • Publication number: 20170211288
    Abstract: Provided is a rubber bearing formed from a polychloroprene composition and having higher ozone resistance. The rubber bearing comprises a laminate prepared by alternately laminating a plurality of soft layers having rubber elasticity and a plurality of hard layers having rigidity, and a covering layer covering an outer peripheral part of the laminate. The soft layer comprises a rubber composition containing a polychloroprene, and the covering layer comprises a blend rubber composition containing 30 to 95 parts by mass of a polychloroprene and 70 to 5 parts by mass of an elastomer other than the polychloroprene.
    Type: Application
    Filed: September 29, 2015
    Publication date: July 27, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yasushi KAMIHIGASHI, Shinichirou KUMAGAI, Takumi NISHIMURA, Koji FUJITA, Takehiro TOMITA, Tatsuji MATSUMOTO, Yasuhiko KONDO, Yasuchika ITO, Takashi SUNADA, Nobuhiko FUJII, Hideki TOYA, Yasushi ABE
  • Patent number: 9475925
    Abstract: Provided are a blended rubber and a blended rubber composition that give a vulcanizate superior in abrasion resistance and ozone resistance, and a vulcanizate prepared by vulcanizing the blended rubber composition. A blended rubber, comprising 30 to 93 mass % of a chloroprene rubber, 5 to 50 mass % of a soft polyvinyl chloride, and 2 to 20 mass % of an acrylonitrile-butadiene rubber. The polyvinyl chloride resin used preferably has a polymerization degree of 300 to 3000 and the acrylonitrile-butadiene rubber preferably has an acrylonitrile content of 18 to 50 mass %.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: October 25, 2016
    Assignee: DENKA COMPANY LIMITED
    Inventors: Uichiro Yamagishi, Hideki Toya, Satoru Ikari, Yasushi Abe
  • Publication number: 20160039999
    Abstract: Provided are a blended rubber and a blended rubber composition that give a vulcanizate superior in abrasion resistance and ozone resistance, and a vulcanizate prepared by vulcanizing the blended rubber composition. A blended rubber, comprising 30 to 93 mass % of a chloroprene rubber, 5 to 50 mass % of a soft polyvinyl chloride, and 2 to 20 mass % of an acrylonitrile-butadiene rubber. The polyvinyl chloride resin used preferably has a polymerization degree of 300 to 3000 and the acrylonitrile-butadiene rubber preferably has an acrylonitrile content of 18 to 50 mass %.
    Type: Application
    Filed: March 28, 2014
    Publication date: February 11, 2016
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Uichiro YAMAGISHI, Hideki TOYA, Satoru IKARI, Yasushi ABE
  • Patent number: 8258236
    Abstract: The present invention relates to tubular forming material made of a composition comprising block copolymers each made of a vinyl aromatic hydrocarbon and a conjugated diene, which has a uniaxial elongation viscosity at 88° C. at a strain rate of 0.5 sec?1 satisfying the following formula between 1.0 sec and 2.8 sec after initiation of elongation, 0.25<(LOG ?2.8?LOG ?1.0)/(2.8?1.0)<0.4 wherein ?1.0 and ?2.8 represent uniaxial elongation viscosities (Pa·sec) at elongation times of 1.0 sec and 2.8 sec, respectively, when measured by a Meissner model elongation viscometer. The composition contains three block copolymers at a specified blend ratio.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: September 4, 2012
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tadashi Sawasato, Eiji Sato, Hideki Toya, Hitoshi Nakazawa
  • Publication number: 20100105838
    Abstract: Provided are a material for an MD shrink film with good shrinking performance and thickness accuracy, and a film formed with the material. The material for the MD shrink film is a resin composition comprising a mixture of a block copolymer of a vinyl aromatic hydrocarbon and a conjugated diene and at least one of a vinyl aromatic hydrocarbon polymer, a copolymer of a vinyl aromatic hydrocarbon and (meth)acrylic acid and a copolymer of a vinyl aromatic hydrocarbon and a (meth)acrylate in a mass ratio of from 100/0 to 50/50, and a rubber-modified styrene polymer in an amount of from 0.5 to 3 parts by mass relative to 100 parts by mass of the mixture, wherein a molecular weight distribution (Mw/Mn) of the resin composition exceeds 1.2 and a content of the conjugated diene in monomer units in the resin composition is from 10 to 30% by mass.
    Type: Application
    Filed: February 19, 2008
    Publication date: April 29, 2010
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Toya, Eiji Sato, Masamitsu Matsui
  • Publication number: 20100022711
    Abstract: To provide a tubular forming material excellent in bubble formation stability in the case of producing a heat-shrinkable film. To provide a tubular forming material made of a composition comprising block copolymers each made of a vinyl aromatic hydrocarbon and a conjugated diene, which has uniaxial elongation viscosity at 88° C. at a strain rate of 0.5 sec?1 satisfying the following formula between 1.0 sec and 2.8 sec after initiation of elongation, 0.25<(LOG ?2.8?LOG ?1.0)/(2.8?1.0)<0.4 wherein ?1.0 and ?2.8 represent uniaxial elongation viscosities at elongation times of 1.0 sec and 2.8 sec, respectively, when measured by a Meissner model elongation viscometer.
    Type: Application
    Filed: December 21, 2007
    Publication date: January 28, 2010
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tadashi Sawasato, Eiji Sato, Hideki Toya, Hitoshi Nakazawa
  • Patent number: 7470747
    Abstract: A block copolymer mixture comprising block copolymers (A), (B) and (C) each block comprising vinyl aromatic hydrocarbon and conjugated diene monomer units: wherein block (A) comprises from 75 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 25 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 30,000 to less than 150,000: block (B) comprises from 50 to 80 mass % of a vinyl aromatic hydrocarbon and from 20 to 50 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 20,000 to less than 120,000, and block (C) comprises from 60 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 40 mass % of a conjugated diene, which has at least one random copolymer block portion comprising, as monomer units, from 55 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 45 mass % of a conjugated die
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: December 30, 2008
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshinari Kurokawa, Hideki Toya, Eiji Sato
  • Publication number: 20070196604
    Abstract: A block copolymer mixture comprising block copolymers (A), (B) and (C) each block comprising vinyl aromatic hydrocarbon and conjugated diene monomer units: wherein block (A) comprises from 75 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 25 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 30,000 to less than 150,000: block (B) comprises from 50 to 80 mass % of a vinyl aromatic hydrocarbon and from 20 to 50 mass % of a conjugated diene, and which has a block portion composed mainly of a vinyl aromatic hydrocarbon having a number average molecular weight of from 20,000 to less than 120,000, and block (C) comprises from 60 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 40 mass % of a conjugated diene, which has at least one random copolymer block portion comprising, as monomer units, from 55 to 95 mass % of a vinyl aromatic hydrocarbon and from 5 to 45 mass % of a conjugated diene.
    Type: Application
    Filed: February 21, 2006
    Publication date: August 23, 2007
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshinari Kurokawa, Hideki Toya, Eiji Sato
  • Publication number: 20070026175
    Abstract: To provide a foamed film or multilayer foamed film excellent in heat insulating properties, a heat shrinkable foamed film or heat shrinkable multilayer foamed film made thereof, a heat shrinkable label, and a container covered therewith. A styrene foamed film characterized by having at least one foamed layer which contains a resin composition comprising from 20 to 100 parts by mass of the following (a) and from 0 to 80 parts by mass of the following (b) and which has a thickness of from 30 to 200 ?m and a specific gravity of from 0.3 to 0.
    Type: Application
    Filed: July 15, 2004
    Publication date: February 1, 2007
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Toya, Eiji Sato, Yuji Shima
  • Patent number: 6700198
    Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: March 2, 2004
    Assignees: Shinko Electric Industries Co., Ltd., Fujitsu Limited
    Inventors: Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa, Toshiyuki Motooka, Hideharu Sakoda, Muneharu Morioka
  • Patent number: 6664133
    Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: December 16, 2003
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Akinobu Abe, Tatsuya Inatsugu, Hiroyuki Komatsu, Hideki Matsuzawa, Hideki Toya
  • Publication number: 20030067058
    Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.
    Type: Application
    Filed: October 8, 2002
    Publication date: April 10, 2003
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Akinobu Abe, Tatsuya Inatsugu, Hiroyuki Komatsu, Hideki Matsuzawa, Hideki Toya
  • Patent number: 6410649
    Abstract: A resin composition characterized by comprising from 5 to 95 wt % of an aromatic vinyl compound/olefin random copolymer (A) which has an aromatic vinyl compound content of from 1 to 99 mol % and has a head-to-tail chain structure composed of two or more aromatic vinyl compound units, and from 95 to 5 wt % of an &agr;-olefin type polymer (B) and/or an aromatic vinyl compound type polymer (C) (provided that it is neither a medical material nor a medical device), which contains substantially no chlorine and is excellent in the impact resistance, moldability, weather resistance and chemical resistance and which is useful for an injection molded product, an extrusion molded product, a film, a sheet, etc. Further, it provides an excellent damping material.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: June 25, 2002
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Oda, Shigeru Suzuki, Toru Arai, Akio Okamoto, Masataka Nakajima, Hideki Toya
  • Patent number: 6348416
    Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: February 19, 2002
    Assignees: Shinko Electric Industries Co., Ltd, Fujitsu Limited
    Inventors: Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa, Toshiyuki Motooka, Hideharu Sakoda, Muneharu Morioka
  • Publication number: 20020019133
    Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.
    Type: Application
    Filed: October 5, 2001
    Publication date: February 14, 2002
    Applicant: Shinko Electric Industries Co., Ltd
    Inventors: Hideki Toya, Mitsuyoshi Imai, Masaki Sakaguchi, Naoki Yamabe, Mamoru Suwa, Toshiyuki Motooka, Hideharu Sakoda, Muneharu Morioka
  • Patent number: 6107411
    Abstract: A block copolymer (hereinafter referred to as the block copolymer (I)), consisting essentially of a vinyl aromatic hydrocarbon and a conjugated diene and satisfying the following conditions (1) to (5):(1) the weight ratio of vinyl aromatic hydrocarbon units to conjugated diene units is from 60:40 to 90:10,(2) the number average molecular weight of the block copolymer is from 40,000 to 500,000,(3) the ratio of E'30/E'10, where E'30 is the storage modulus at a temperature of 30.degree. C. and E'10 is the storage modulus at a temperature of 10.degree. C., is from 0.75 to 1,(4) the block proportion of a vinyl aromatic hydrocarbon polymer contained in the block copolymer is from 70 to 100%, provided the block proportion=W1/W0.times.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: August 22, 2000
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Toya, Masayoshi Nakazato, Hiroshi Suzuki