Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not melted during thermo-compression bonding, and an adherent insulator melted during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode is made uniform by interposing the dielectric film between the first and second electrodes. A wiring board ensured as to lifetime and improved in reliability, and a simple method of fabricating such a wiring board are achieved.

Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not rendered molten during thermo-compression bonding, and an adherent insulator rendered molten during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator rendered molten in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode can be set constant by interposing the dielectric film between the first and second electrodes. Accordingly, a wiring board ensured in lifetime and improved in reliability, and a fabrication method of such a wiring board can be obtained.

Abstract: The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit print board without electrically connecting with a conductive hole 6. In order to accomplish the above object, a manufacturing method of a circuit print board according the present invention has a thermal diffusive sheet forming step for forming the thermal diffusive sheet 7 by bonding resin 2 to a graphite sheet 1. Next, the method has a through hole making step for making the through hole on the thermal diffusive sheet and an insulator bonding step for forming a core 10 by thermally pressing the insulator to the thermal diffusive sheet having the through hole 3. Through these steps, the graphite sheet 1 can be inserted into the circuit print board without electrically connecting with the conductive hole 6.

Abstract: The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit print board without electrically connecting with a conductive hole 6. In order to accomplish the above object, a manufacturing method of a circuit print board according the present invention has a thermal diffusive sheet forming step for forming the thermal diffusive sheet 7 by bonding resin 2 to a graphite sheet 1. Next, the method has a through hole making step for making the through hole on the thermal diffusive sheet and an insulator bonding step for forming a core 10 by thermally pressing the insulator to the thermal diffusive sheet having the through hole 3. Through these steps, the graphite sheet 1 can be inserted into the circuit print board without electrically connecting with the conductive hole 6.

Abstract: A DC-DC converter comprises a switching element having a rise time t.sub.on and a fall time t.sub.off ; a control device for controlling the switching operation of the switching element; a transformer having a primary winding and a secondary winding, the primary winding being connected to a DC power source through the switching element, and having an open inductance L.sub.M ; an inductance coil having an inductance L connected to the secondary winding of the transformer; and a rectifying device for rectifying the output from the secondary winding of the transformer; assuming that the voltage applied to the primary winding of the transformer is E, the load current flowing through the transformer is I.sub.D, and the sum of the stray capacitance of the switching element and the distributed capacity of the windings of the transformer is C1, the following relational expressions being established:L>(E/I.sub.D)T.sub.onandL.sub.M >t.sub.off.sup.2 /.pi..sup.

Abstract: An area measuring apparatus for measuring the surface area of an object by the use of a TV camera. The apparatus comprises a comparator which separates a component corresponding to the image of the object from the image signal obtained with the TV camera; a gate circuit which allows a clock signal to pass only while the image component is detected; and an arithmetic circuit which counts the pulses of the clock signal allowed to pass the gate circuit and corresponding to a single frame of the image signal and converts the pulse counts into an area.

Abstract: A position control method for aligning a workpiece in a machining apparatus. An alignment pattern, such as a diamond, is provided on the surface of the workpiece. The alignment pattern and the surrounding region are sensed by an image pickup television camera, the output of which is converted to binary form. From the binary data, the central point of the pattern is calculated. The difference between this central point and a reference point is then determined, and the result used to control the position of the workpiece via a positioning mechanism.