Patents by Inventor Hideki Tsutsumi

Hideki Tsutsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6231706
    Abstract: Substrates to be paired are alternately aligned. One substrate of a pair of substrates adjacent to each other is turned over thereby to face the other substrate, and the substrates held in a state facing each other are sent to a bonding position. An adhesive is supplied annularly into an interval of the substrates, and the substrates are rotated in a planar direction to thereby narrow the interval and eventually spread the adhesive in a radial direction to form an adhesive layer. The lower substrate is supported from below and carried from the bonding position to a setting position, and the adhesive layer is set, whereby an optical disk is obtained. The optical disk is taken out from the setting position.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: May 15, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Norihide Higaki, Keinosuke Kanashima, Katsuhiro Kida, Hideki Tsutsumi
  • Patent number: 5689964
    Abstract: When a defrosting requiring signal is outputted, the opening of a motor-operated expansion valve (5) is fully closed in a heating cycle so that refrigerant is recovered into a receiver (4). In addition, when the defrosting requiring signal is outputted, an indoor fan (6f) is deactivated so that heat is stored. Further, when the completion of the recovery of refrigerant is determined, defrosting operation is executed. The recovery of refrigerant is completed when an outdoor heat-exchange temperature Tc at the present time drops to or below a specified temperature, when the outdoor heat-exchange temperature Tc at the present time drops to or more than a specified difference from a reference outdoor heat-exchange temperature Tcl at the time before the motor-operated expansion valve (5) is fully closed, when an indoor heat-exchange temperature Te at the present time rises to or above a specified temperature, or when a set time passes.
    Type: Grant
    Filed: June 15, 1995
    Date of Patent: November 25, 1997
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiroyuki Kawakita, Satoshi Takagi, Hideki Tsutsumi
  • Patent number: 5247733
    Abstract: A component assembling apparatus includes an intermittently rotatable index table for holding a plurality of positioning tools for use in positioning components to be assembled, and an index table driving mechanism for intermittently rotating the index table. The apparatus also includes a component feeding device for feeding one of the components and holding the component at a removal position of the device, a tool container for storing the plurality of assembling tools for assembling the components, and an arm robot for removably securing one of the assembling tools at its end. The arm robot is operable to move the component from the removal position of the component feeding device to a predetermined position of the positioning tool on the table, and to assemble the component on the positioning tool. An arm robot driving mechanism is provided for actuating the arm robot and the assembling tool.
    Type: Grant
    Filed: August 5, 1992
    Date of Patent: September 28, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hitoshi Kubota, Hiroshi Nakagawa, Toshitsugu Inoue, Akiyoshi Nakada, Manabu Yamane, Hideki Tsutsumi