Abstract: A first portion and a second portion are connected to a first surface of a connection portion having the first surface and a second surface opposite to the first surface. A first radiating element is disposed on the first portion, and a second radiating element is disposed on the second portion. The connection portion includes a first flat board portion, a bent portion extending from the first flat board portion, and bent to have the first surface facing outward, and a second flat board portion further extended from the bent portion.

Abstract: An antenna device comprises a substrate including a planar first region and a planar second region; at least one first radiating element, arranged in the first region, that communicates a radio wave of a first frequency; and at least one second radiating element, arranged in the second region, that communicates a radio wave of a second frequency. A separation direction is a direction of a straight line connecting a first geometric center position of the at least one first radiating element and a second geometric center position of the at least one second radiating element, and in a case that the second region is viewed along a normal direction of the second region, an angle formed by the separation direction and a polarization direction of the at least one second radiating element is equal to or greater than 45° and equal to or less than 90°.

Abstract: In a multilayer board, conductor layers include a first conductor layer including a mounting electrode on a positive main surface of an insulator layer located farthest in a Z-axis positive direction of insulator layers. One or more first interlayer connection conductors connect two of the conductor layers located on a positive main surface and a negative main surface of a first insulator layer. The one or more first interlayer connection conductors each include a first region and a second region with a lower thermal conductivity than the first region and located on a Z-axis negative direction side of the first region. The one or more first interlayer connection conductors include one or more large-area first interlayer connection conductors with a larger area than a second interlayer connection conductor when viewed in a Z-axis direction.

Abstract: An antenna module includes radiating elements including a first element and a second element and an RFIC and exchanges signals with a BBIC. The RFIC includes a transmission circuit that supplies radio frequency signals to the radiating elements and a reception circuit that receives radio frequency signals from the radiating elements. The RFIC exchanges intermediate frequency signals with the BBIC. A first intermediate frequency signal is used for communication between the transmission circuit and the BBIC. A second intermediate frequency signal is used for communication between the reception circuit and the BBIC. Assuming a variation in the reception level of a radio frequency signal received by the reception circuit during transmission of a radio frequency signal from the transmission circuit exceeds a predetermined value, the RFIC stops emission of radio waves from the first element.

Abstract: In a circuit module, a mounting electrode is located on a positive main surface of a resin layer positioned farther toward a positive side of a Z axis than other resin layers. An inner conductive layer overlaps the mounting electrode. An end of a first interlayer connection conductor on the positive side contacts the mounting electrode. An end of the first interlayer connection conductor on a negative side of the Z axis contacts the inner conductive layer. A product includes a connector bonded to the mounting electrode. The first interlayer connection conductor includes first and second regions provided in a direction toward the negative side in this order. A material of the first region is the same as that of the mounting electrode. A Young's modulus of the second region is lower than that of the first region.

Abstract: A radio frequency module comprises a first component, a second component and a pedestal all supported by a first surface. The first component, the second component and pedestal all extend along a first axis perpendicular to the first surface. Along the first axis, the first component is longer than the second component and the pedestal is between the second component and the first surface. A first solder is between the first surface and the first component, a second solder is between the pedestal and the second component, and a third solder is between the first surface and the pedestal. Along a second axis which is parallel to the first surface, a first dimension of the first solder is greater than a second dimension of the second solder, and a third dimension of the third solder is greater than the second dimension.

Abstract: A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.

Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

Abstract: Electronic components are included in each one of submodules. Each electronic component includes inner terminals. A first support member covers and supports, the electronic components so as to expose the inner terminals. A second support member supports the submodules. Each one of the submodules includes outer terminals, and the outer terminals are coupled to respective inner terminals and exposed from the second support member. At least one of the submodules has a first conductive film formed on at least part of the first support member.

Abstract: A sub-module includes a plurality of electronic components and a first support. Each of the plurality of electronic components includes a plurality of internal terminals. The first support covers and supports the plurality of electronic components to expose the plurality of internal terminals. A first conductive film is disposed on at least a part of the first support. A second support supports the sub-module and supports an antenna. A plurality of external terminals exposed from the second support are connected to the plurality of internal terminals.

Abstract: A sensor device includes a conductive layer. The conductive layer is interposed between a first principal surface of an IC chip and a sensor element and faces the sensor element via a resin-based adhesive layer. The sensor element includes: a moving part including a moving electrode; a fixed part including a fixed electrode forming capacitance between the moving electrode and itself; a first terminal connected to the moving electrode; and a second terminal connected to the fixed electrode. The IC chip includes: a signal processor that processes a detection signal from the second terminal; a first voltage generator that generates a first voltage as an operating voltage for the processor; and a second voltage generator that generates a second voltage corresponding to the sensor element's reference potential applied to the first terminal. The conductive layer is electrically connected to the first terminal.

Abstract: An array accommodated in a housing includes multiple antenna elements. The antenna elements face an inside surface of the housing and are arrayed in a first direction at least one-dimensionally. A waveguide is coupled to the antenna elements of the array antenna and extends from the array antenna toward the inside surface of the housing. The waveguide has a housing-side end face facing the inside surface of the housing and an antenna-side end face facing the array antenna. A length from one end to an opposite end of the housing-side end face in the first direction is greater than a length from one end to an opposite end of the antenna-side end face in the first direction. An antenna device that can improve antenna gain without increasing the size of the antenna module is provided.

Abstract: An antenna device includes a casing including an inner surface including connected first and second regions with a corner therebetween. A first antenna opposes the first region with a gap therebetween, and a second antenna opposes the second region with a gap therebetween. A first waveguide extends from the first antenna toward the first region, and a second waveguide extends from the second antenna toward the second region. In a perpendicular projection of an end surface of the first waveguide closest to the first antenna on a plane including the first region, an end surface of the waveguide closest to the inner surface is adjacent to the first corner. In a perpendicular projection of an end surface of the second waveguide closest to the second antenna on a plane including the second region, an end surface of the second waveguide closest to the inner surface is adjacent to the corner.

Abstract: A radio-frequency integrated circuit processes a radio-frequency signal to be transmitted or received by an antenna. The radio-frequency integrated circuit is implemented on a first substrate. The first substrate is implemented on a second substrate. A connector for connection with a cable through which a modulation signal is transferred to the radio-frequency integrated circuit is implemented on the second substrate. A first shield structure covers the connector. An antenna module in which noise due to the connector is less likely to influence antenna characteristics is provided.

Abstract: A dielectric block includes a bottom surface that includes a conductive ground member including an antenna ground surface inclined with respect to the bottom surface. A feed element is disposed at a distance from the antenna ground surface, and constitutes a patch antenna together with the antenna ground surface. A feed line is connected to a feed point of the feed element, and a dielectric member that supports the feed element with respect to the ground member. The ground member is exposed to the bottom surface, on both a lower side and a higher side of a contour line passing through an intersection point of a perpendicular line from the feed point to a virtual plane including the bottom surface and a plane including the antenna ground surface, using the bottom surface as a height reference.

Abstract: A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.

Abstract: An antenna module includes a first sub array to a fourth sub array. The first sub array to the fourth sub array have a rectangular substrate. Each of the first sub array to the fourth sub array includes a plurality of radiation electrodes disposed along an extending direction of a long side. The first sub array to the fourth sub array are configured to radiate radio waves of the first polarized wave to the fourth polarized wave, respectively. The first polarized wave is different from the second polarized wave, and the third polarized wave is different from the fourth polarized wave. The first polarized wave is the same as the third polarized wave, and the second polarized wave is the same as the fourth polarized wave.

Abstract: A ground plane, at least one composite antenna, and a power feeding line configured to supply power to the at least one composite antenna are provided in or on a substrate. The composite antenna includes a power feeding element configuring a patch antenna together with the ground plane, and at least one linear antenna configured to flow an electric current having a component in a vertical direction with respect to the ground plane. The power feeding line includes a main line connected to the power feeding element, and a branch line branched from the main line and connected to the linear antenna.

Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

Abstract: A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.