Abstract: A first circuit outputs first information indicating presence/absence of a magnetic wall between two adjacent portions among portions of a magnetic body, and second information based on the combination of magnetization states of the two portions. A first storage circuit stores first bits corresponding to the portions. A most significant bit of the first bits has a value independent of a magnetization state of a corresponding one of the portions, and the first bits have a value based on the first information. A second storage circuit stores the second information. The second circuit causes the first storage circuit to output the first bits when a value of a least significant bit of the first bits matches a value of the second information, and otherwise third bits having inverse values of the first bits.

Abstract: A radio frequency module comprises a first component, a second component and a pedestal all supported by a first surface. The first component, the second component and pedestal all extend along a first axis perpendicular to the first surface. Along the first axis, the first component is longer than the second component and the pedestal is between the second component and the first surface. A first solder is between the first surface and the first component, a second solder is between the pedestal and the second component, and a third solder is between the first surface and the pedestal. Along a second axis which is parallel to the first surface, a first dimension of the first solder is greater than a second dimension of the second solder, and a third dimension of the third solder is greater than the second dimension.

Abstract: A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.

Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

Abstract: A sub-module includes a plurality of electronic components and a first support. Each of the plurality of electronic components includes a plurality of internal terminals. The first support covers and supports the plurality of electronic components to expose the plurality of internal terminals. A first conductive film is disposed on at least a part of the first support. A second support supports the sub-module and supports an antenna. A plurality of external terminals exposed from the second support are connected to the plurality of internal terminals.

Abstract: Electronic components are included in each one of submodules. Each electronic component includes inner terminals. A first support member covers and supports, the electronic components so as to expose the inner terminals. A second support member supports the submodules. Each one of the submodules includes outer terminals, and the outer terminals are coupled to respective inner terminals and exposed from the second support member. At least one of the submodules has a first conductive film formed on at least part of the first support member.

Abstract: A sensor device includes a conductive layer. The conductive layer is interposed between a first principal surface of an IC chip and a sensor element and faces the sensor element via a resin-based adhesive layer. The sensor element includes: a moving part including a moving electrode; a fixed part including a fixed electrode forming capacitance between the moving electrode and itself; a first terminal connected to the moving electrode; and a second terminal connected to the fixed electrode. The IC chip includes: a signal processor that processes a detection signal from the second terminal; a first voltage generator that generates a first voltage as an operating voltage for the processor; and a second voltage generator that generates a second voltage corresponding to the sensor element's reference potential applied to the first terminal. The conductive layer is electrically connected to the first terminal.

Abstract: An array accommodated in a housing includes multiple antenna elements. The antenna elements face an inside surface of the housing and are arrayed in a first direction at least one-dimensionally. A waveguide is coupled to the antenna elements of the array antenna and extends from the array antenna toward the inside surface of the housing. The waveguide has a housing-side end face facing the inside surface of the housing and an antenna-side end face facing the array antenna. A length from one end to an opposite end of the housing-side end face in the first direction is greater than a length from one end to an opposite end of the antenna-side end face in the first direction. An antenna device that can improve antenna gain without increasing the size of the antenna module is provided.

Abstract: An antenna device includes a casing including an inner surface including connected first and second regions with a corner therebetween. A first antenna opposes the first region with a gap therebetween, and a second antenna opposes the second region with a gap therebetween. A first waveguide extends from the first antenna toward the first region, and a second waveguide extends from the second antenna toward the second region. In a perpendicular projection of an end surface of the first waveguide closest to the first antenna on a plane including the first region, an end surface of the waveguide closest to the inner surface is adjacent to the first corner. In a perpendicular projection of an end surface of the second waveguide closest to the second antenna on a plane including the second region, an end surface of the second waveguide closest to the inner surface is adjacent to the corner.

Abstract: A radio-frequency integrated circuit processes a radio-frequency signal to be transmitted or received by an antenna. The radio-frequency integrated circuit is implemented on a first substrate. The first substrate is implemented on a second substrate. A connector for connection with a cable through which a modulation signal is transferred to the radio-frequency integrated circuit is implemented on the second substrate. A first shield structure covers the connector. An antenna module in which noise due to the connector is less likely to influence antenna characteristics is provided.

Abstract: A dielectric block includes a bottom surface that includes a conductive ground member including an antenna ground surface inclined with respect to the bottom surface. A feed element is disposed at a distance from the antenna ground surface, and constitutes a patch antenna together with the antenna ground surface. A feed line is connected to a feed point of the feed element, and a dielectric member that supports the feed element with respect to the ground member. The ground member is exposed to the bottom surface, on both a lower side and a higher side of a contour line passing through an intersection point of a perpendicular line from the feed point to a virtual plane including the bottom surface and a plane including the antenna ground surface, using the bottom surface as a height reference.

Abstract: A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.

Abstract: An antenna module includes a first sub array to a fourth sub array. The first sub array to the fourth sub array have a rectangular substrate. Each of the first sub array to the fourth sub array includes a plurality of radiation electrodes disposed along an extending direction of a long side. The first sub array to the fourth sub array are configured to radiate radio waves of the first polarized wave to the fourth polarized wave, respectively. The first polarized wave is different from the second polarized wave, and the third polarized wave is different from the fourth polarized wave. The first polarized wave is the same as the third polarized wave, and the second polarized wave is the same as the fourth polarized wave.

Abstract: A ground plane, at least one composite antenna, and a power feeding line configured to supply power to the at least one composite antenna are provided in or on a substrate. The composite antenna includes a power feeding element configuring a patch antenna together with the ground plane, and at least one linear antenna configured to flow an electric current having a component in a vertical direction with respect to the ground plane. The power feeding line includes a main line connected to the power feeding element, and a branch line branched from the main line and connected to the linear antenna.

Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

Abstract: A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.

Abstract: A ground plane is disposed in a dielectric substrate or on the top surface of the dielectric substrate. A high-frequency semiconductor device is mounted on the bottom surface of the dielectric substrate. A shield structure that is provided in a space closer to the bottom surface than the ground plane is surrounds the high-frequency semiconductor device from below and sideways of the high-frequency semiconductor device and is connected to the ground plane. An opening is formed in the shield structure. A radiation-structure portion causes a high-frequency signal output by the high-frequency semiconductor device to be radiated through the opening.

Abstract: A plurality of segments each include one input-output port and a plurality of antenna ports. A plurality of subarrays each include a plurality of elements connected to any of the plurality of antenna ports. The plurality of elements constitute a sequential array for each subarray. Each of the plurality of segments includes a distribution-combination circuit that distributes a signal input to a first port to the plurality of antenna ports and that combines signals input to the respective plurality of antenna ports to output a combined signal from the first port, and a first amplifier connected between the input-output port and the first port. In the plurality of subarrays, the plurality of antenna ports to which the respective plurality of elements included in one subarray are connected are included in one segment.

Abstract: A plurality of segments each include one input-output port and a plurality of antenna ports. A plurality of subarrays each include a plurality of elements connected to any of the plurality of antenna ports. The plurality of elements constitute a sequential array for each subarray. Each of the plurality of segments includes a distribution-combination circuit that distributes a signal input to a first port to the plurality of antenna ports and that combines signals input to the respective plurality of antenna ports to output a combined signal from the first port, and a first amplifier connected between the input-output port and the first port. In the plurality of subarrays, the plurality of antenna ports to which the respective plurality of elements included in one subarray are connected are included in one segment.

Abstract: The antenna module includes a first substrate and a second substrate on each of which a radiating element is arranged, a third substrate, and a switch circuit. An RFIC for supplying a radio frequency signal to the first substrate and the second substrate is arranged on the third substrate. The switch circuit is configured to change over a connection between the RFIC and the radiating element on the first substrate and a connection between the RFIC and the radiating element on the second substrate.