Patents by Inventor Hideki Yano
Hideki Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10172806Abstract: An object of the present invention is to provide a pharmaceutical composition having abuse deterrent properties and thereby prevent the abuse of a pharmacologically active component by an abuser (abuse through snorting, abuse through injection, or abuse through snorting or injection of a temporarily extracted drug). The present invention provides a pharmaceutical composition having abuse deterrent properties that possesses both a physical barrier and a chemical barrier to being abused by an abuser, a method for producing the same and a method for using the same.Type: GrantFiled: June 14, 2017Date of Patent: January 8, 2019Assignee: Daiichi Sankyo Company, LimitedInventors: Shuichi Yada, Ryoichi Hayakawa, Atsutoshi Ito, Hideki Yano
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Patent number: 9827199Abstract: An object is to provide a hydromorphone hydrochloride- or oxycodone hydrochloride hydrate-containing sustained-release pharmaceutical composition for oral administration that reliably exhibits its main pharmacological effect and has excellent formulation stability that avoids dose dumping of the principal drug, such as alcohol resistance. The present invention provides a sustained-release pharmaceutical composition comprising (A) hydromorphone hydrochloride or oxycodone hydrochloride hydrate, (B) hydroxypropyl methylcellulose acetate succinate having a median size (D50) of 40 ?m or smaller, (C) hydroxypropyl cellulose, and (D) a saccharide, wherein the content ratio of the component (C) to the component (B) by weight in the composition, (C)/(B), is 11/3 to 3/11.Type: GrantFiled: March 2, 2015Date of Patent: November 28, 2017Assignee: Daiichi Sankyo Company, LimitedInventors: Shuichi Yada, Hideki Yano, Kazuhiro Yoshida, Sachiko Fukui
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Publication number: 20170273975Abstract: An object of the present invention is to provide a pharmaceutical composition having abuse deterrent properties and thereby prevent the abuse of a pharmacologically active component by an abuser (abuse through snorting, abuse through injection, or abuse through snorting or injection of a temporarily extracted drug). The present invention provides a pharmaceutical composition having abuse deterrent properties that possesses both a physical barrier and a chemical barrier to being abused by an abuser, a method for producing the same and a method for using the same.Type: ApplicationFiled: June 14, 2017Publication date: September 28, 2017Applicant: Daiichi Sankyo Company, LimitedInventors: Shuichi Yada, Ryoichi Hayakawa, Atsutoshi Ito, Hideki Yano
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Publication number: 20150231083Abstract: An object is to provide a hydromorphone hydrochloride- or oxycodone hydrochloride hydrate-containing sustained-release pharmaceutical composition for oral administration that reliably exhibits its main pharmacological effect and has excellent formulation stability that avoids dose dumping of the principal drug, such as alcohol resistance. The present invention provides a sustained-release pharmaceutical composition comprising (A) hydromorphone hydrochloride or oxycodone hydrochloride hydrate, (B) hydroxypropyl methylcellulose acetate succinate having a median size (D50) of 40 ?m or smaller, (C) hydroxypropyl cellulose, and (D) a saccharide, wherein the content ratio of the component (C) to the component (B) by weight in the composition, (C)/(B), is 11/3 to 3/11.Type: ApplicationFiled: March 2, 2015Publication date: August 20, 2015Applicant: Daiichi Sankyo Company, LimitedInventors: Shuichi Yada, Hideki Yano, Kazuhiro Yoshida, Sachiko Fukui
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Publication number: 20140050785Abstract: A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. The composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method for treating or preventing hypertension by administering the pharmaceutical tablet to a patient.Type: ApplicationFiled: October 29, 2013Publication date: February 20, 2014Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Shuichi YADA, Hideki YANO, Tsuyoshi NAGAIKE, Misato YOKOI
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Patent number: 8652519Abstract: A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine besylate by using said composition is also provided.Type: GrantFiled: November 17, 2011Date of Patent: February 18, 2014Assignee: Daiichi Sankyo Company, LimitedInventors: Shuichi Yada, Hideki Yano, Tsuyoshi Nagaike, Misato Yokoi
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Publication number: 20120064158Abstract: A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine besylate by using said composition is also provided.Type: ApplicationFiled: November 17, 2011Publication date: March 15, 2012Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Shuichi YADA, Hideki Yano, Tsuyoshi Nagaike, Misato Yokoi
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Publication number: 20110038898Abstract: A pharmaceutical composition containing olmesartan medoxomil and amlodipine, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine by using said composition is also provided.Type: ApplicationFiled: March 2, 2009Publication date: February 17, 2011Inventors: Shuichi Yada, Hideki Yano, Tsuyoshi Nagaike, Misato Yokoi
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Patent number: 7067265Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl?/HCO3? exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl?/HCO3? exchanger, and cells in which the proteins exogenously expressed.Type: GrantFiled: August 14, 2003Date of Patent: June 27, 2006Assignees: JCR Pharmaceuticals Co., Ltd.Inventors: Susumu Seino, Hideki Yano, Changzheng Wang
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Publication number: 20040063125Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl-/HCO3- exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl-/HCO3- exchanger, and cells in which the proteins exogenously expressed.Type: ApplicationFiled: August 14, 2003Publication date: April 1, 2004Applicants: JCR Pharmaceuticals Co., Ltd., Susumu SEINOInventors: Susumu Seino, Hideki Yano, Changzheng Wang
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Patent number: 6673899Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl—/HCO3— exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl—/HCO3— exchanger, and cells in which the proteins exogenously expressed.Type: GrantFiled: August 3, 2001Date of Patent: January 6, 2004Assignees: JCR Pharmaceuticals Co., Ltd., Susumu SeinoInventors: Susumu Seino, Hideki Yano, Changzheng Wang
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Publication number: 20020064846Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO: 1 or NO: 3 encoding Na+-driven Cl—/HCO3— exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO: 2 or NO: 4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl—/HCO3— exchanger, and cells in which the proteins exogenously expressed.Type: ApplicationFiled: August 3, 2001Publication date: May 30, 2002Applicant: JCR PHARMACEUTICALS CO.,Ltd.Inventors: Susumu Seino, Hideki Yano, Changzheng Wang
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Patent number: 6251502Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.Type: GrantFiled: July 20, 1999Date of Patent: June 26, 2001Assignee: Ibiden Co., Ltd.Inventors: Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase, Ayumi Suzuki, Masato Kawade, Motoo Asai
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Patent number: 6217988Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.Type: GrantFiled: November 2, 1999Date of Patent: April 17, 2001Assignee: Ibiden Co., Ltd.Inventors: Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase, Ayumi Suzuki, Masato Kawade, Motoo Asai
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Patent number: 6010768Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.Type: GrantFiled: May 12, 1997Date of Patent: January 4, 2000Assignee: Ibiden Co., Ltd.Inventors: Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase, Ayumi Suzuki, Masato Kawade, Motoo Asai
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Patent number: 5346952Abstract: Disclosed is a thermoplastic resin composition comprised of (A) 10-60 weight parts of a polyphenylene ether resin, (B) 20-70 weight parts of (b-1) an aromatic vinyl resin and/or (b-2) a copolymer of an aromatic vinyl monomer with a heterocyclic compound having a vinyl group and containing nitrogen as the hetero atom and (C) 10-60 weight parts of (c-1) a graft copolymer obtained by polymerizing an aromatic vinyl monomer, optionally with other vinyl monomer, in the presence of a butadiene type rubbery polymer or (c-2) a graft copolymer obtained by polymerizing an aromatic vinyl monomer and a heterocyclic compound having a vinyl group and containing nitrogen as the hereto atom, optionally with other ethylenically unsaturated compound, in the presence of a butadiene type rubbery polymer, wherein at least one of the components (B) and (C) is a polymer of the nitrogen-containing heterocyclic compound, and the total amount of the components (A), (B) and (C) is 100 parts by weight.Type: GrantFiled: April 30, 1993Date of Patent: September 13, 1994Assignee: Mitsubishi Rayon Company Ltd.Inventors: Masafumi Hongo, Hideki Yano, Hideyuki Shigemitsu
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Patent number: D401260Type: GrantFiled: February 10, 1998Date of Patent: November 17, 1998Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Ryo Kodama, Hideki Yano