Patents by Inventor Hideki Yano

Hideki Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10172806
    Abstract: An object of the present invention is to provide a pharmaceutical composition having abuse deterrent properties and thereby prevent the abuse of a pharmacologically active component by an abuser (abuse through snorting, abuse through injection, or abuse through snorting or injection of a temporarily extracted drug). The present invention provides a pharmaceutical composition having abuse deterrent properties that possesses both a physical barrier and a chemical barrier to being abused by an abuser, a method for producing the same and a method for using the same.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: January 8, 2019
    Assignee: Daiichi Sankyo Company, Limited
    Inventors: Shuichi Yada, Ryoichi Hayakawa, Atsutoshi Ito, Hideki Yano
  • Patent number: 9827199
    Abstract: An object is to provide a hydromorphone hydrochloride- or oxycodone hydrochloride hydrate-containing sustained-release pharmaceutical composition for oral administration that reliably exhibits its main pharmacological effect and has excellent formulation stability that avoids dose dumping of the principal drug, such as alcohol resistance. The present invention provides a sustained-release pharmaceutical composition comprising (A) hydromorphone hydrochloride or oxycodone hydrochloride hydrate, (B) hydroxypropyl methylcellulose acetate succinate having a median size (D50) of 40 ?m or smaller, (C) hydroxypropyl cellulose, and (D) a saccharide, wherein the content ratio of the component (C) to the component (B) by weight in the composition, (C)/(B), is 11/3 to 3/11.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: November 28, 2017
    Assignee: Daiichi Sankyo Company, Limited
    Inventors: Shuichi Yada, Hideki Yano, Kazuhiro Yoshida, Sachiko Fukui
  • Publication number: 20170273975
    Abstract: An object of the present invention is to provide a pharmaceutical composition having abuse deterrent properties and thereby prevent the abuse of a pharmacologically active component by an abuser (abuse through snorting, abuse through injection, or abuse through snorting or injection of a temporarily extracted drug). The present invention provides a pharmaceutical composition having abuse deterrent properties that possesses both a physical barrier and a chemical barrier to being abused by an abuser, a method for producing the same and a method for using the same.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 28, 2017
    Applicant: Daiichi Sankyo Company, Limited
    Inventors: Shuichi Yada, Ryoichi Hayakawa, Atsutoshi Ito, Hideki Yano
  • Publication number: 20150231083
    Abstract: An object is to provide a hydromorphone hydrochloride- or oxycodone hydrochloride hydrate-containing sustained-release pharmaceutical composition for oral administration that reliably exhibits its main pharmacological effect and has excellent formulation stability that avoids dose dumping of the principal drug, such as alcohol resistance. The present invention provides a sustained-release pharmaceutical composition comprising (A) hydromorphone hydrochloride or oxycodone hydrochloride hydrate, (B) hydroxypropyl methylcellulose acetate succinate having a median size (D50) of 40 ?m or smaller, (C) hydroxypropyl cellulose, and (D) a saccharide, wherein the content ratio of the component (C) to the component (B) by weight in the composition, (C)/(B), is 11/3 to 3/11.
    Type: Application
    Filed: March 2, 2015
    Publication date: August 20, 2015
    Applicant: Daiichi Sankyo Company, Limited
    Inventors: Shuichi Yada, Hideki Yano, Kazuhiro Yoshida, Sachiko Fukui
  • Publication number: 20140050785
    Abstract: A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. The composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method for treating or preventing hypertension by administering the pharmaceutical tablet to a patient.
    Type: Application
    Filed: October 29, 2013
    Publication date: February 20, 2014
    Applicant: DAIICHI SANKYO COMPANY, LIMITED
    Inventors: Shuichi YADA, Hideki YANO, Tsuyoshi NAGAIKE, Misato YOKOI
  • Patent number: 8652519
    Abstract: A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine besylate by using said composition is also provided.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: February 18, 2014
    Assignee: Daiichi Sankyo Company, Limited
    Inventors: Shuichi Yada, Hideki Yano, Tsuyoshi Nagaike, Misato Yokoi
  • Publication number: 20120064158
    Abstract: A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine besylate by using said composition is also provided.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Applicant: DAIICHI SANKYO COMPANY, LIMITED
    Inventors: Shuichi YADA, Hideki Yano, Tsuyoshi Nagaike, Misato Yokoi
  • Publication number: 20110038898
    Abstract: A pharmaceutical composition containing olmesartan medoxomil and amlodipine, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine by using said composition is also provided.
    Type: Application
    Filed: March 2, 2009
    Publication date: February 17, 2011
    Inventors: Shuichi Yada, Hideki Yano, Tsuyoshi Nagaike, Misato Yokoi
  • Patent number: 7067265
    Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl?/HCO3? exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl?/HCO3? exchanger, and cells in which the proteins exogenously expressed.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: June 27, 2006
    Assignees: JCR Pharmaceuticals Co., Ltd.
    Inventors: Susumu Seino, Hideki Yano, Changzheng Wang
  • Publication number: 20040063125
    Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl-/HCO3- exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl-/HCO3- exchanger, and cells in which the proteins exogenously expressed.
    Type: Application
    Filed: August 14, 2003
    Publication date: April 1, 2004
    Applicants: JCR Pharmaceuticals Co., Ltd., Susumu SEINO
    Inventors: Susumu Seino, Hideki Yano, Changzheng Wang
  • Patent number: 6673899
    Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl—/HCO3— exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl—/HCO3— exchanger, and cells in which the proteins exogenously expressed.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: January 6, 2004
    Assignees: JCR Pharmaceuticals Co., Ltd., Susumu Seino
    Inventors: Susumu Seino, Hideki Yano, Changzheng Wang
  • Publication number: 20020064846
    Abstract: The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO: 1 or NO: 3 encoding Na+-driven Cl—/HCO3— exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO: 2 or NO: 4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl—/HCO3— exchanger, and cells in which the proteins exogenously expressed.
    Type: Application
    Filed: August 3, 2001
    Publication date: May 30, 2002
    Applicant: JCR PHARMACEUTICALS CO.,Ltd.
    Inventors: Susumu Seino, Hideki Yano, Changzheng Wang
  • Patent number: 6251502
    Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.
    Type: Grant
    Filed: July 20, 1999
    Date of Patent: June 26, 2001
    Assignee: Ibiden Co., Ltd.
    Inventors: Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase, Ayumi Suzuki, Masato Kawade, Motoo Asai
  • Patent number: 6217988
    Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.
    Type: Grant
    Filed: November 2, 1999
    Date of Patent: April 17, 2001
    Assignee: Ibiden Co., Ltd.
    Inventors: Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase, Ayumi Suzuki, Masato Kawade, Motoo Asai
  • Patent number: 6010768
    Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.
    Type: Grant
    Filed: May 12, 1997
    Date of Patent: January 4, 2000
    Assignee: Ibiden Co., Ltd.
    Inventors: Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase, Ayumi Suzuki, Masato Kawade, Motoo Asai
  • Patent number: 5346952
    Abstract: Disclosed is a thermoplastic resin composition comprised of (A) 10-60 weight parts of a polyphenylene ether resin, (B) 20-70 weight parts of (b-1) an aromatic vinyl resin and/or (b-2) a copolymer of an aromatic vinyl monomer with a heterocyclic compound having a vinyl group and containing nitrogen as the hetero atom and (C) 10-60 weight parts of (c-1) a graft copolymer obtained by polymerizing an aromatic vinyl monomer, optionally with other vinyl monomer, in the presence of a butadiene type rubbery polymer or (c-2) a graft copolymer obtained by polymerizing an aromatic vinyl monomer and a heterocyclic compound having a vinyl group and containing nitrogen as the hereto atom, optionally with other ethylenically unsaturated compound, in the presence of a butadiene type rubbery polymer, wherein at least one of the components (B) and (C) is a polymer of the nitrogen-containing heterocyclic compound, and the total amount of the components (A), (B) and (C) is 100 parts by weight.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: September 13, 1994
    Assignee: Mitsubishi Rayon Company Ltd.
    Inventors: Masafumi Hongo, Hideki Yano, Hideyuki Shigemitsu
  • Patent number: D401260
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: November 17, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Ryo Kodama, Hideki Yano