Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface, the first surface including a first mounting area and a second mounting area, the second surface including a first area and a second area, the first area facing the first mounting area, the second area facing the second mounting area; a plurality of circuit parts that includes a first circuit part and a second circuit part, the first circuit part being mounted on the first mounting area, the second circuit part being mounted on the second mounting area; a sealing layer that is provided on the first surface and covers the plurality of circuit parts; and an electrode layer that includes a first electrode group and a second electric group, the first electrode group including a plurality of first electrode terminals that covers substantially the entire area of the first area and is to be electrically connected to the first circuit part, the second electrode group including a plurality of

Abstract: In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.

Abstract: The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

Abstract: A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

Abstract: Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is characterized in that an insulation layer 16 is formed on either the top or bottom side of a metal core 11, while an opening 12 formed in the metal core 11 is used as a cavity area 15a for mounting a component, wherein a reinforcement pattern 30 is formed on the surface of an insulation layer facing the bottom of the cavity area 15a in the insulation layer 16. The reinforcement pattern 30 is made of the same material as the wiring patterns 28c, 29c formed on the insulation layer 16, and also formed simultaneously with these wiring patterns 28c, 29c.

Abstract: The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

Abstract: A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

Abstract: In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.

Abstract: An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.

Abstract: An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.

Abstract: Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is characterized in that an insulation layer 16 is formed on either the top or bottom side of a metal core 11, while an opening 12 formed in the metal core 11 is used as a cavity area 15a for mounting a component, wherein a reinforcement pattern 30 is formed on the surface of an insulation layer facing the bottom of the cavity area 15a in the insulation layer 16. The reinforcement pattern 30 is made of the same material as the wiring patterns 28c, 29c formed on the insulation layer 16, and also formed simultaneously with these wiring patterns 28c, 29c.

Abstract: An apparatus for thermal development of thermal fixation of a flexible sheet of photosensitive material. The apparatus includes a heating roller provided with a heating lamp inside said heating roller, a plurality of conveyance rollers disposed in pressure contact with the heating roller, so that when the sheet is put in between the heating roller and the conveyance rollers, the sheet is heated to undergo the processing, and guides, provided in pressure contact with the peripheral surface of the heating roller, for holding the sheet against the peripheral surface of the heating roller.