Patents by Inventor Hideki Yonekura

Hideki Yonekura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080279518
    Abstract: An optical waveguide includes an optical waveguide main body and mirrors. The optical waveguide main body includes a first cladding layer, a second cladding layer and a core portion provided between the first cladding layer and the second cladding layer. The optical waveguide main body has a first region in which the core portion and the mirrors are arranged and the light signal is transmitted, and a second region arranged on both sides of the first region and not contributing to a transmission of a light signal. Through vias that pass through the optical waveguide main body is provided in the second region. The first region on a side that faces the light emitting element or the light receiving element is protruded larger than the second region on a side that faces the light emitting element or the light receiving element.
    Type: Application
    Filed: May 9, 2008
    Publication date: November 13, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Hideki YONEKURA, Kazunao Yamamoto, Takanori Yamamoto, Kenji Yanagisawa
  • Publication number: 20080251496
    Abstract: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole, and a connection terminal on which an optical device is mounted and which is connected to an upper end side of the conductor, wherein the connection terminal is embedded in an upper-side portion of the via hole or is projected from the insulating film.
    Type: Application
    Filed: December 20, 2007
    Publication date: October 16, 2008
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Hideki Yonekura, Tadashi Kodaira
  • Publication number: 20080107375
    Abstract: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole, and a connection terminal on which an optical device is mounted and which is connected to an upper end side of the conductor, wherein the connection terminal is embedded in an upper-side portion of the via hole or is projected from the insulating film.
    Type: Application
    Filed: December 20, 2007
    Publication date: May 8, 2008
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Hideki Yonekura, Tadashi Kodaira
  • Patent number: 7340121
    Abstract: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole, and a connection terminal on which an optical device is mounted and which is connected to an upper end side of the conductor, wherein the connection terminal is embedded in an upper-side portion of the via hole or is projected from the insulating film.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: March 4, 2008
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideki Yonekura, Tadashi Kodaira
  • Publication number: 20050190808
    Abstract: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole, and a connection terminal on which an optical device is mounted and which is connected to an upper end side of the conductor, wherein the connection terminal is embedded in an upper-side portion of the via hole or is projected from the insulating film.
    Type: Application
    Filed: February 22, 2005
    Publication date: September 1, 2005
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Hideki Yonekura, Tadashi Kodaira