Patents by Inventor Hidekuni Takao

Hidekuni Takao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115343
    Abstract: Provided is a grip tool that allows detecting a slip of an object. The grip tool includes a pair of grip portions that sandwiches to grip an object; an opening/closing mechanism that opens and closes the pair of grip portions; and at least one sensor unit disposed in one or both of the pair of grip portions. The sensor unit includes a plurality of force sensors disposed in a predetermined distribution. The plurality of force sensors each have a function of measuring forces in triaxial directions received from the object. The sensor unit can measure a load distribution received from the object. The slip of the object is detectable based on the load distribution.
    Type: Application
    Filed: October 2, 2020
    Publication date: April 11, 2024
    Applicant: National University Corporation Kagawa University
    Inventors: Hidekuni TAKAO, Masao FUJIWARA
  • Publication number: 20230366762
    Abstract: Provided is a tactile sensor that allows restraining a decrease in spatial resolution and sensitivity of a sensor element and has waterproof and dust-proof properties. A tactile sensor includes a sensor element and a casing that houses the sensor element. The sensor element includes: a base portion; a contact having a contact end; a support body that supports the contact in a displaceable manner with respect to the base portion; and a displacement detector that detects a displacement of the contact with respect to the base portion. The casing includes a film having flexibility that covers at least the contact end among the sensor element, and the contact end is secured to an inner surface of the film.
    Type: Application
    Filed: October 7, 2021
    Publication date: November 16, 2023
    Applicant: National University Corporation Kagawa University
    Inventor: Hidekuni TAKAO
  • Patent number: 11815411
    Abstract: A tactile sensor includes a base portion, a displacement portion, a displacement portion support body that supports the displacement portion in a displaceable manner in a first direction with respect to the base portion, a hair in a straight line arranged along a second direction, a hair fixing portion to which a base end of the hair is fixed, a hair fixing portion support body that turnably supports the hair fixing portion with respect to the displacement portion, a displacement detector that detects a displacement of the displacement portion with respect to the base portion, and a turn detector that detects a turn of the hair fixing portion with respect to the displacement portion. The sensations specific to the hairy skin, such as perception of a liquid surface and static electricity, can be detected from a shearing force and a moment acting on the hair.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: November 14, 2023
    Assignee: National University Corporation Kagawa University
    Inventor: Hidekuni Takao
  • Publication number: 20210389192
    Abstract: A tactile sensor includes a base portion, a displacement portion, a displacement portion support body that supports the displacement portion in a displaceable manner in a first direction with respect to the base portion, a hair in a straight line arranged along a second direction, a hair fixing portion to which a base end of the hair is fixed, a hair fixing portion support body that turnably supports the hair fixing portion with respect to the displacement portion, a displacement detector that detects a displacement of the displacement portion with respect to the base portion, and a turn detector that detects a turn of the hair fixing portion with respect to the displacement portion. The sensations specific to the hairy skin, such as perception of a liquid surface and static electricity, can be detected from a shearing force and a moment acting on the hair.
    Type: Application
    Filed: October 21, 2019
    Publication date: December 16, 2021
    Applicant: National University Corporation Kagawa University
    Inventor: Hidekuni TAKAO
  • Patent number: 11039576
    Abstract: To provide a vascular sap measurement sensor in which a flow channel that receives incoming flow of vascular sap is unlikely to be blocked by tissues of a plant. A vascular sap measurement sensor 1 includes: a trapping probe 20 for trapping vascular sap; and a support 10 that supports the trapping probe 20. A trapping flow channel 21 that receives incoming flow of the vascular sap is formed in the trapping probe 20. The trapping flow channel 21 has an inlet opening 24 formed on a side surface of the trapping probe 20. This makes it unlikely that the trapping flow channel 21 will be blocked by tissues of a plant when sticking the trapping probe 20 into the plant.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 22, 2021
    Assignee: NATIONAL UNIVERSITY CORPORATION KAGAWA UNIVERSITY
    Inventors: Fusao Shimokawa, Akihito Ono, Hidekuni Takao, Kyohei Terao, Tsuyoshi Kobayashi, Ikuo Kataoka
  • Patent number: 10935563
    Abstract: To provide a vascular sap flow speed sensor having a size allowing measurement of the flow speed of vascular sap in a part of a plant such as a stem and capable of being manufactured at low cost. A vascular sap flow speed sensor 1 includes a heater sensor HS and a reference sensor RS. The heater sensor HS includes: a first probe unit 10a including a heat transfer plate 11 and a probe 12; a heater 20; a first temperature sensor 30a; and a first housing 40a in which the heat transfer plate 11, the heater 20, and the first temperature sensor 30a are housed. The reference sensor RS includes: a second probe unit 10b including a heat transfer plate 11 and a probe 12; a second temperature sensor 30b; and a second housing 40b in which the heat transfer plate 11 and the second temperature sensor 30b are housed. Each of the first probe unit 10a and the second probe unit 10b is made of a metallic material.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: March 2, 2021
    Assignee: NATIONAL UNIVERSITY CORPORATION KAGAWA UNIVERSITY
    Inventors: Fusao Shimokawa, Kyosuke Nakada, Hidekuni Takao, Kyohei Terao, Hidenori Yoshimura, Hiroki Ishizuka, Tsuyoshi Kobayashi, Ikuo Kataoka
  • Publication number: 20200081026
    Abstract: To provide a vascular sap flow speed sensor having a size allowing measurement of the flow speed of vascular sap in a part of a plant such as a stem and capable of being manufactured at low cost. A vascular sap flow speed sensor 1 includes a heater sensor HS and a reference sensor RS. The heater sensor HS includes: a first probe unit 10a including a heat transfer plate 11 and a probe 12; a heater 20; a first temperature sensor 30a; and a first housing 40a in which the heat transfer plate 11, the heater 20, and the first temperature sensor 30a are housed. The reference sensor RS includes: a second probe unit 10b including a heat transfer plate 11 and a probe 12; a second temperature sensor 30b; and a second housing 40b in which the heat transfer plate 11 and the second temperature sensor 30b are housed. Each of the first probe unit 10a and the second probe unit 10b is made of a metallic material.
    Type: Application
    Filed: March 1, 2018
    Publication date: March 12, 2020
    Inventors: Fusao SHIMOKAWA, Kyosuke NAKADA, Hidekuni TAKAO, Kyohei TERAO, Hidenori YOSHIMURA, Hiroki ISHIZUKA, Tsuyoshi KOBAYASHI, Ikuo KATAOKA
  • Publication number: 20190274259
    Abstract: To provide a vascular sap measurement sensor in which a flow channel that receives incoming flow of vascular sap is unlikely to be blocked by tissues of a plant. A vascular sap measurement sensor 1 includes: a trapping probe 20 for trapping vascular sap; and a support 10 that supports the trapping probe 20. A trapping flow channel 21 that receives incoming flow of the vascular sap is formed in the trapping probe 20. The trapping flow channel 21 has an inlet opening 24 formed on a side surface of the trapping probe 20. This makes it unlikely that the trapping flow channel 21 will be blocked by tissues of a plant when sticking the trapping probe 20 into the plant.
    Type: Application
    Filed: September 29, 2017
    Publication date: September 12, 2019
    Inventors: Fusao SHIMOKAWA, Akihito ONO, Hidekuni TAKAO, Kyohei TERAO, Tsuyoshi KOBAYASHI, Ikuo KATAOKA
  • Patent number: 10190927
    Abstract: To provide a tactile sensor that allows a contact to be displaced largely and can detect fine ruggedness, flexibility, and other features of a surface of a measuring object. A sensor part S includes a frame 10 that includes a side part of a substrate B, a contact 20 that is disposed in parallel to the substrate B so that a tip of the contact 20 projects from a side face of the substrate B, a suspension 30 that supports the contact 20 to the frame 10, and displacement detectors 41 and 42 each of which detects displacement of the contact 20. The side face of the substrate B functions as a sensing surface. The contact 20 coming in contact with a measuring object O is displaced on a level parallel to the substrate B. Since the sensor part S can be configured widely in a planar manner along the substrate B, the structure has higher flexibility of design.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: January 29, 2019
    Assignee: NATIONAL UNIVERSITY CORPORATION KAGAWA UNIVERSITY
    Inventor: Hidekuni Takao
  • Patent number: 9857391
    Abstract: A plant water dynamics sensor usable for measuring the dynamics of water flowing in a fine point of a plant such as a distal end of a new branch or a pedicel comprises a heater-equipped temperature probe including a temperature sensor and a heater; a temperature probe including a temperature sensor; an electrical resistance probe including an electrical resistance measurement electrode; and a support that supports the probes while the probes are aligned parallel to each other. The position of a xylem XY can be detected based on an electrical resistance measured at the electrical resistance probe, so that each of the temperature sensors can be arranged correctly in a position at a phloem PH or at the xylem XY. This facilitates attachment of a plant water dynamics sensor and water dynamics in a plant can be measured with high accuracy.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: January 2, 2018
    Assignee: NATIONAL UNIVERSITY CORPORATION KAGAWA UNIVERSITY
    Inventors: Fusao Shimokawa, Hidekuni Takao, Takaaki Suzuki, Tsuyoshi Kobayashi, Ikuo Kataoka
  • Publication number: 20170067789
    Abstract: To provide a tactile sensor that allows a contact to be displaced largely and can detect fine ruggedness, flexibility, and other features of a surface of a measuring object. A sensor part S includes a frame 10 that includes a side part of a substrate B, a contact 20 that is disposed in parallel to the substrate B so that a tip of the contact 20 projects from a side face of the substrate B, a suspension 30 that supports the contact 20 to the frame 10, and displacement detectors 41 and 42 each of which detects displacement of the contact 20. The side face of the substrate B functions as a sensing surface. The contact 20 coming in contact with a measuring object O is displaced on a level parallel to the substrate B. Since the sensor part S can be configured widely in a planar manner along the substrate B, the structure has higher flexibility of design.
    Type: Application
    Filed: March 2, 2015
    Publication date: March 9, 2017
    Inventor: Hidekuni TAKAO
  • Publication number: 20170010296
    Abstract: To provide a plant water dynamics sensor usable for measuring the dynamics of water flowing in a fine point of a plant such as a distal end of a new branch or a pedicel. The plant water dynamics sensor comprises: a heater-equipped temperature probe 10 including a temperature sensor 11 and a heater 12; a temperature probe 20 including a temperature sensor 21; an electrical resistance probe 30 including an electrical resistance measurement electrode 33; and a support 80 that supports the probes 10, 20, and 30 while the probes are aligned parallel to each other. The position of a xylem XY can be detected based on an electrical resistance measured at the electrical resistance probe 30, so that each of the temperature sensors 11 and 21 can be arranged correctly in a position at a phloem PH or at the xylem XY. This facilitates attachment of a plant water dynamics sensor 1 and water dynamics in a plant can be measured with high accuracy.
    Type: Application
    Filed: January 26, 2015
    Publication date: January 12, 2017
    Inventors: Fusao SHIMOKAWA, Hidekuni TAKAO, Takaaki SUZUKI, Tsuyoshi KOBAYASHI, Ikuo KATAOKA
  • Publication number: 20140088890
    Abstract: Temperature compensation is performed using a computation program for temperature compensation, a computation processing, and a sensor. Deformation in a diaphragm caused by a pressure change due to the temperature of the gas in a cavity is cancelled out, and deformation of the diaphragm is minimized within the target temperature range, thereby allowing an optimum temperature compensation to be performed. The temperature compensation in a capacitance-type sensor executes calculation steps which include including a calculation step (S17) of acquiring the amount of change ?C? in capacitance. A parameter ?C? is obtained, through which it is possible to determine the degree of compensation for the deformation in the diaphragm section caused by a pressure change due to the temperature changes of the gas in the hermetically sealed space.
    Type: Application
    Filed: May 31, 2012
    Publication date: March 27, 2014
    Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Xiuchun Hao, Yonggang Jiang, Takayuki Fujita, Kohei Higuchi, Kazusuke Maenaka, Hidekuni Takao
  • Patent number: 8513927
    Abstract: A power generation circuit has one of an antenna or a coil that receives an ambient radio wave. A rectifying circuit is connected to the antenna or the coil for rectifying a signal from the antenna or the coil receiving the ambient radio wave. A booster circuit is connected to and boosts an output of the rectifying circuit. A storage circuit is connected to the booster circuit and stores an output power obtained from the rectifying circuit for driving a load without the use of a power source or a battery. A switching circuit is operable in an ON-state thereof to connect the storage circuit to the load when a voltage of the storage circuit is equal to or greater than a preselected voltage.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: August 20, 2013
    Assignees: Seiko Instruments Inc.
    Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
  • Publication number: 20110193420
    Abstract: A power generation circuit using an electromagnetic wave which does not require any additional energy is provided. Power generation is performed by utilizing the electromagnetic wave existing in a space for living.
    Type: Application
    Filed: April 14, 2011
    Publication date: August 11, 2011
    Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
  • Patent number: 7956593
    Abstract: A power generation circuit generates and stores electric power utilizing electromagnetic wave energy. The power generation circuit has one of an antenna or a coil that receives an electromagnetic wave. A rectifying circuit is formed on a silicon substrate and rectifies a signal from the antenna or the coil. A storage circuit stores an output power obtained from the rectifying circuit for driving a load. A MOS transistor has a source and a drain connected to an output of the storage circuit and the load, respectively, so that the load is connected to the storage circuit in accordance with a threshold voltage of the MOS transistor.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: June 7, 2011
    Assignees: Seiko Instruments Inc.
    Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
  • Patent number: 7855429
    Abstract: An electronic circuit device comprises a silicon substrate having front and rear surfaces, a semiconductor element formed on the front surface, and at least one through-hole penetrating through the front surface and the rear surface. At least one passive element is supported by the silicon substrate. At least one connecting element is disposed in the through-hole of the silicon substrate for electrically connecting the semiconductor element to the passive element.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: December 21, 2010
    Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
  • Publication number: 20090065894
    Abstract: An electronic circuit device comprises a silicon substrate having front and rear surfaces, a semiconductor element formed on the front surface, and at least one through-hole penetrating through the front surface and the rear surface. At least one passive element is supported by the silicon substrate. At least one connecting element is disposed in the through-hole of the silicon substrate for electrically connecting the semiconductor element to the passive element.
    Type: Application
    Filed: October 23, 2008
    Publication date: March 12, 2009
    Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
  • Publication number: 20050254183
    Abstract: A power generation circuit using an electromagnetic wave which does not require any additional energy is provided. Power generation is performed by utilizing the electromagnetic wave existing in a space for living.
    Type: Application
    Filed: May 3, 2005
    Publication date: November 17, 2005
    Inventors: Makota Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
  • Publication number: 20050233518
    Abstract: An electronic circuit device having a silicon substrate is provided comprising: a silicon substrate having a semiconductor element and a recess; and at least one passive element which is formed by a process different from a silicon planar process by which the semiconductor element is formed. In the electronic circuit device, the passive element is entrenched in the recess of the silicon substrate, and the semiconductor element formed on the silicon substrate is electrically connected to the passive element.
    Type: Application
    Filed: March 30, 2005
    Publication date: October 20, 2005
    Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo