Patents by Inventor Hidekuni Yokoyama

Hidekuni Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5328566
    Abstract: A process for producing an inorganic fiber-based prepreg sheet, which comprises preparing a slurry containing 35-80% by weight of a phenolic resin powder of 0.01-100 .mu.m in average particle diameter, 65-20% by weight of an inorganic fiber (the amounts are based on the total amount of the two) and a nonionic high-molecular fixing agent, making the slurry into a sheet in the same manner as in the paper making, and allowing the sheet to contain a silane coupling agent; and a process for producing an insulating laminate, which comprises laminating a prepreg sheet produced by the above process.
    Type: Grant
    Filed: January 22, 1992
    Date of Patent: July 12, 1994
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Hidekuni Yokoyama, Setuo Toyoshima, Takamasa Ibaraki