Abstract: A dielectric strip is located in a space formed by facing grooves in two conductors. A corner of the groove bottom surface Gb has a sectionally substantial arc form. A groove side surface Gs is tapered such that a gap can be provided between the groove side surface Gs and the side surface of the dielectric strip.

Abstract: A dielectric strip is located in a space formed by facing grooves in two conductors. A corner of the groove bottom surface Gb has a sectionally substantial arc form. A groove side surface Gs is tapered such that a gap can be provided between the groove side surface Gs and the side surface of the dielectric strip.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: Pin head mounting members are rotatably mounted on a horizontal spindle above a table which horizontally supports a holding, plate holding chip type electronic components. The spindle is vertically movable by a vertical cylinder. Each pin head mounting member is shaped as a rectangular sleeve. A mounting surface is formed on each side portion of the pin head mounting member. A pin head each having a number of press pin is detachably mounted on each of the mounting surfaces A locking pin is provided on an upper end portion of the spindle for locking the pin head mounting members every 90.degree.. Thus, it is possible to efficiently replace press pins in response to a type change of chip type electronic components, as well as to quickly exchange a broken press pin.

Abstract: A press machine comprises a holding plate provided with a number of receiving holes at constant arrangement pitches and a pin head having a number of press pins at the same arrangement pitches as the receiving holes. A portion provided with the receiving holes is in the form of a square, while a portion provided with the press pins is also in the form of a square, which has a width identical to that of the portion provided with the receiving holes and a depth half that of the portion provided with the receiving holes. The holding plate is placed on a movable table, which in turn is moved to a first working position to insert a first group of chip type electronic components into the receiving holes provided in a first half region of the holding plate by the press pins, and then moved to a second working position to press a second group of chip type electronic components into the receiving holes provided in a second half region of the holding plate by the press pins.