Patents by Inventor Hidemi Doi

Hidemi Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two part type acrylic adhesives
    Patent number: 4596857
    Abstract: A two part type acrylic adhesive composed of liquid I comprising an acrylate ester monomer, a polymer soluble in the acrylate ester monomer, and an organic peroxide and liquid II containing a hardening accelerator capable of hardening said liquid I by polymerization at a temperature lower than room temperature, wherein at least liquid I contains 0.005 to 0.1% by weight polyphosphoric acid.
    Type: Grant
    Filed: November 19, 1984
    Date of Patent: June 24, 1986
    Assignee: Okura Kogyo Kabushiki Kaisha
    Inventors: Hidemi Doi, Hideaki Matsuda
  • Two-part type adhesives
    Patent number: 4548992
    Abstract: There is provided a novel acrylic two-part adhesive suitable for structural uses composed of a liquid I comprising an acrylic monomer and an organic peroxide and a liquid II comprising an acrylic monomer and a curing accelerator. At least one of the liquid I and II further contains a diene-elastomer, and the liquid I or both the liquids further contain an ion-containing unsaturated polyester. The unsaturated polyester is further characterized in that it has one or more polymerizable or copolymerizable double bonds and its remaining carboxylic group is neutralized with a metal compound, ammonia or an amine.
    Type: Grant
    Filed: July 18, 1984
    Date of Patent: October 22, 1985
    Assignee: Okura Koygo Kabushiki Kisha
    Inventors: Hidemi Doi, Takanori Okamoto, Hideaki Matsuda