Patents by Inventor Hidemi Koike
Hidemi Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10955431Abstract: Uneven wear causes degradation of the individual parts of a syringe pump. Specifically, a seal piece composed of a soft material is easily damaged by uneven wear. To solve this problem, an automatic analysis device has a syringe pump that feeds and aspirates a liquid into and from a dispensing unit. The syringe pump has a syringe tube that stores a liquid, a plunger that moves up and down in the syringe tube, a plunger upper pressing component that contacts the plunger, a motive force transmitting part that transmits motive force to the plunger via the plunger upper pressing component, and a plunger lower pressing component that contacts the motive force transmitting part. The plunger upper pressing component and the motive force transmitting part make point contact with each other, and the motive force transmitting part and the plunger lower pressing component make point contact with each other.Type: GrantFiled: July 3, 2018Date of Patent: March 23, 2021Assignee: HITACHI HIGH-TECH CORPORATIONInventors: Kenichi Hirami, Hajime Yamazaki, Hidemi Koike, Eriko Otsu
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Publication number: 20200124632Abstract: Uneven wear causes degradation of the individual parts of a syringe pump. Specifically, a seal piece composed of a soft material is easily damaged by uneven wear. To solve this problem, an automatic analysis device has a syringe pump that feeds and aspirates a liquid into and from a dispensing unit. The syringe pump has a syringe tube that stores a liquid, a plunger that moves up and down in the syringe tube, a plunger upper pressing component that contacts the plunger, a motive force transmitting part that transmits motive force to the plunger via the plunger upper pressing component, and a plunger lower pressing component that contacts the motive force transmitting part. The plunger upper pressing component and the motive force transmitting part make point contact with each other, and the motive force transmitting part and the plunger lower pressing component make point contact with each other.Type: ApplicationFiled: July 3, 2018Publication date: April 23, 2020Inventors: Kenichi HIRAMI, Hajime YAMAZAKI, Hidemi KOIKE, Eriko OTSU
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Patent number: 8796651Abstract: A sample fabricating method of irradiating a sample with a focused ion beam at an incident angle less than 90 degrees with respect to the surface of the sample, eliminating the peripheral area of a micro sample as a target, turning a specimen stage around a line segment perpendicular to the sample surface as a turn axis, irradiating the sample with the focused ion beam while the incident angle on the sample surface is fixed, and separating the micro sample or preparing the micro sample to be separated. A sample fabricating apparatus for forming a sample section in a sample held on a specimen stage by scanning and deflecting an ion beam, wherein an angle between an optical axis of the ion beam and the surface of the specimen stage is fixed and formation of a sample section is controlled by turning the specimen stage.Type: GrantFiled: January 20, 2011Date of Patent: August 5, 2014Assignee: Hitachi, Ltd.Inventors: Hiroyasu Shichi, Tohru Ishitani, Hidemi Koike, Kaoru Umemura, Eiichi Seya, Mitsuo Tokuda, Satoshi Tomimatsu, Hideo Kashima, Muneyuki Fukuda
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Patent number: 8618520Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: GrantFiled: July 12, 2012Date of Patent: December 31, 2013Assignee: Hitachi, Ltd.Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Publication number: 20120273692Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: ApplicationFiled: July 12, 2012Publication date: November 1, 2012Applicant: HITACHI, LTD.Inventors: Mitsuo TOKUDA, Muneyuki FUKUDA, Yasuhiro MITSUI, Hidemi KOIKE, Satoshi TOMIMATSU, Hiroyasu SHICHI, Hideo KASHIMA, Kaoru UMEMURA
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Patent number: 8222618Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: GrantFiled: January 14, 2011Date of Patent: July 17, 2012Assignee: Hitachi, Ltd.Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Patent number: 8156852Abstract: A cut target medium driving type cutting plotter, where a cut target medium to be cut is driven in a first direction and a cutting unit is driven in a second direction perpendicular to the first direction, thereby moving the cutting unit in a two-dimensional direction relative to the cut target medium to make the cutting unit to be selectively brought into press contact with and separated from the cut target medium to cut the cut target medium in a desired shape, the cut target medium driving type cutting plotter includes a cut target medium supporting sheet to removably support the cut target medium on a surface opposite to the cutting unit. Preferably, the cut target medium is driven in the first direction together with the cut target medium supporting sheet, and the cut target medium supported on the cut target medium supporting sheet is cut by the cutting unit.Type: GrantFiled: January 18, 2005Date of Patent: April 17, 2012Assignee: Graphtec Kabushiki KaishaInventors: Takeya Shibata, Yuzuru Sekiguchi, Michiharu Nishijima, Tsutomu Tsuji, Hidemi Koike, Yutaka Saegusa, Kousuke Watanabe, Takayuki Tanigawa, Toshihiro Houhara, Shinichi Mukasa, Kenji Yamamoto
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Publication number: 20110174974Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: ApplicationFiled: January 14, 2011Publication date: July 21, 2011Applicant: HITACHI, LTD.Inventors: Mitsuo TOKUDA, Muneyuki FUKUDA, Yasuhiro MITSUI, Hidemi KOIKE, Satoshi TOMIMATSU, Hiroyasu SHICHI, Hideo KASHIMA, Kaoru UMEMURA
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Publication number: 20110114476Abstract: A sample fabricating method of irradiating a sample with a focused ion beam at an incident angle less than 90 degrees with respect to the surface of the sample, eliminating the peripheral area of a micro sample as a target, turning a specimen stage around a line segment perpendicular to the sample surface as a turn axis, irradiating the sample with the focused ion beam while the incident angle on the sample surface is fixed, and separating the micro sample or preparing the micro sample to be separated. A sample fabricating apparatus for forming a sample section in a sample held on a specimen stage by scanning and deflecting an ion beam, wherein an angle between an optical axis of the ion beam and the surface of the specimen stage is fixed and formation of a sample section is controlled by turning the specimen stage.Type: ApplicationFiled: January 20, 2011Publication date: May 19, 2011Inventors: Hiroyasu Shichi, Tohru Ishitani, Hidemi Koike, Kaoru Umemura, Eiichi Seya, Mitsuo Tokuda, Satoshi Tomimatsu, Hideo Kashima, Muneyuki Fukuda
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Patent number: 7897936Abstract: A sample fabricating method of irradiating a sample with a focused ion beam at an incident angle less than 90 degrees with respect to the surface of the sample, eliminating the peripheral area of a micro sample as a target, turning a specimen stage around a line segment perpendicular to the sample surface as a turn axis, irradiating the sample with the focused ion beam while the incident angle on the sample surface is fixed, and separating the micro sample or preparing the micro sample to be separated. A sample fabricating apparatus for forming a sample section in a sample held on a specimen stage by scanning and deflecting an ion beam, wherein an angle between an optical axis of the ion beam and the surface of the specimen stage is fixed and formation of a sample section is controlled by turning the specimen stage.Type: GrantFiled: July 5, 2007Date of Patent: March 1, 2011Assignee: Hitachi, Ltd.Inventors: Hiroyasu Shichi, Tohru Ishitani, Hidemi Koike, Kaoru Umemura, Eiichi Seya, Mitsuo Tokuda, Satoshi Tomimatsu, Hideo Kashima, Muneyuki Fukuda
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Patent number: 7888639Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: GrantFiled: October 31, 2007Date of Patent: February 15, 2011Assignee: Hitachi, Ltd.Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Patent number: 7550750Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: GrantFiled: February 15, 2007Date of Patent: June 23, 2009Assignee: Hitachi, Ltd.Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Patent number: 7470918Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: GrantFiled: February 15, 2007Date of Patent: December 30, 2008Assignee: Hitachi Ltd.Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Patent number: 7465945Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: GrantFiled: April 5, 2007Date of Patent: December 16, 2008Assignee: Hitachi, Ltd.Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Publication number: 20080191151Abstract: A sample fabricating method of irradiating a sample with a focused ion beam at an incident angle less than 90 degrees with respect to the surface of the sample, eliminating the peripheral area of a micro sample as a target, turning a specimen stage around a line segment perpendicular to the sample surface as a turn axis, irradiating the sample with the focused ion beam while the incident angle on the sample surface is fixed, and separating the micro sample or preparing the micro sample to be separated. A sample fabricating apparatus for forming a sample section in a sample held on a specimen stage by scanning and deflecting an ion beam, wherein an angle between an optical axis of the ion beam and the surface of the specimen stage is fixed and formation of a sample section is controlled by turning the specimen stage.Type: ApplicationFiled: July 5, 2007Publication date: August 14, 2008Inventors: Hiroyasu Shichi, Tohru Ishitani, Hidemi Koike, Kaoru Umemura, Eiichi Seya, Mitsuo Tokuda, Satoshi Tomimatsu, Hideo Kashima, Muneyuki Fukuda
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Publication number: 20080067385Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: ApplicationFiled: October 31, 2007Publication date: March 20, 2008Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Patent number: 7301146Abstract: A probe driving method and a probe apparatus for bringing a probe into contact with the surface of a sample in a safe and efficient manner by monitoring the probe height. Information about the height of the probe from the sample surface is obtained by detecting a probe shadow (54) appearing immediately before the probe contacts the sample, or based on a change in relative positions of a probe image and a sample image that are formed as an ion beam is irradiated diagonally.Type: GrantFiled: August 11, 2005Date of Patent: November 27, 2007Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Satoshi Tomimatsu, Hidemi Koike, Junzo Azuma, Tohru Ishitani, Aritoshi Sugimoto, Yuichi Hamamura, Isamu Sekihara, Akira Shimase
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Patent number: 7268356Abstract: A sample fabricating method of irradiating a sample with a focused ion beam at an incident angle less than 90 degrees with respect to the surface of the sample, eliminating the peripheral area of a micro sample as a target, turning a specimen stage around a line segment perpendicular to the sample surface as a turn axis, irradiating the sample with the focused ion beam while the incident angle on the sample surface is fixed, and separating the micro sample or preparing the micro sample to be separated. A sample fabricating apparatus for forming a sample section in a sample held on a specimen stage by scanning and deflecting an ion beam, wherein an angle between an optical axis of the ion beam and the surface of the specimen stage is fixed and formation of a sample section is controlled by turning the specimen stage.Type: GrantFiled: July 26, 2004Date of Patent: September 11, 2007Assignee: Hitachi, Ltd.Inventors: Hiroyasu Shichi, Tohru Ishitani, Hidemi Koike, Kaoru Umemura, Eiichi Seya, Mitsuo Tokuda, Satoshi Tomimatsu, Hideo Kashima, Muneyuki Fukuda
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Publication number: 20070181831Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: ApplicationFiled: April 5, 2007Publication date: August 9, 2007Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasuhiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, Hideo Kashima, Kaoru Umemura
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Publication number: 20070158591Abstract: An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.Type: ApplicationFiled: February 15, 2007Publication date: July 12, 2007Inventors: Mitsuo Tokuda, Muneyuki Fukuda, Yasahiro Mitsui, Hidemi Koike, Satoshi Tomimatsu, Hiroyasu Shichi, HIdeo Kashima, Kaoru Umemura