Patents by Inventor Hidemi Matsukuma

Hidemi Matsukuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6779702
    Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: August 24, 2004
    Assignee: NEC Electronics Corporation
    Inventors: Naoto Kimura, Hidemi Matsukuma
  • Publication number: 20030106923
    Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration releasing structure for releasing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
    Type: Application
    Filed: January 24, 2003
    Publication date: June 12, 2003
    Inventors: Naoto Kimura, Hidemi Matsukuma
  • Patent number: 6575348
    Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: June 10, 2003
    Assignee: NEC Electronics Corporation
    Inventors: Naoto Kimura, Hidemi Matsukuma
  • Publication number: 20020185518
    Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration releasing structure for releasing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
    Type: Application
    Filed: June 6, 2002
    Publication date: December 12, 2002
    Inventors: Naoto Kimura, Hidemi Matsukuma
  • Patent number: 5535789
    Abstract: First and second dies are movably opposed to each other. The second die is for pinching a package and a lead wire of the package in cooperation with the first die with a portion of the lead wire that protrudes from the first and the second dies. A slidable base is slidably supported on a die surface of the first die and has an inclined surface. A base pushing rod is movable in a direction which is substantially perpendicular to a base surface of the slidable base. The base pushing rod has an inclined rod surface which is opposed to the inclined surface. A spring urges the slidable base to make the inclined base surface be brought into contact with the inclined rod surface. The base pushing rod moves the slidable base towards the package together with one end portion of the lead wire that is supported on the slidable base when the protruded portion of the lead wire is pushed by the wire pushing member. The slidable base may have a cam follower internal surface which defines a cam hole.
    Type: Grant
    Filed: September 2, 1994
    Date of Patent: July 16, 1996
    Assignee: NEC Corporation
    Inventors: Yutaka Takahashi, Junichi Uehara, Hidemi Matsukuma