Patents by Inventor Hidemitsu Ishida

Hidemitsu Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation-sensitive resin composition
    Publication number: 20070254247
    Abstract: A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound. The resin composition is used as a chemically-amplified resist for microfabrication utilizing deep UV rays.
    Type: Application
    Filed: November 9, 2005
    Publication date: November 1, 2007
    Inventors: Masafumi Yamamoto, Hidemitsu Ishida, Hiroyuki Ishii, Toru Kajita
  • Radiation-sensitive resin composition
    Patent number: 7005230
    Abstract: A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: February 28, 2006
    Assignee: JSR Corporation
    Inventors: Masafumi Yamamoto, Hidemitsu Ishida, Hiroyuki Ishii, Toru Kajita
  • Radiation-sensitive resin composition
    Patent number: 6800419
    Abstract: A radiation-sensitive resin composition comprising: (A) an alkali insoluble or scarcely alkali-soluble resin having an acid-dissociable protecting group of the following formula [I], wherein R1 groups are monovalent alicyclic hydrocarbon groups or alkyl groups, provided that at least one of the R1 groups is the monovalent alicyclic hydrocarbon group, or any two of the R1 groups and the carbon atom form a divalent alicyclic hydrocarbon group, (B) a photoacid generator, and (C) propylene glycol monomethyl ether acetate, &ggr;-butyrolactone, and cyclohexanone as solvents. The resin composition is useful as a chemically-amplified resist for microfabrication utilizing deep ultraviolet rays and exhibits excellent film thickness uniformity and storage stability.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: October 5, 2004
    Assignee: JSR Corporation
    Inventors: Akimasa Soyano, Hiroyuki Ishii, Hidemitsu Ishida, Motoyuki Shima, Yukio Nishimura
  • Radiation-sensitive resin composition
    Publication number: 20040146802
    Abstract: A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound. The resin composition is used as a chemically-amplified resist for microfabrication utilizing deep UV rays.
    Type: Application
    Filed: January 16, 2003
    Publication date: July 29, 2004
    Inventors: Masafumi Yamamoto, Hidemitsu Ishida, Hiroyuki Ishii, Toru Kajita
  • Radiation-sensitive resin composition
    Publication number: 20030203307
    Abstract: A radiation-sensitive resin composition comprising: (A) an alkali insoluble or scarcely alkali-soluble resin having an acid-dissociable protecting group of the following formula [I], 1
    Type: Application
    Filed: February 21, 2003
    Publication date: October 30, 2003
    Inventors: Akimasa Soyano, Hiroyuki Ishii, Hidemitsu Ishida, Motoyuki Shima, Yukio Nishimura