Patents by Inventor Hidenari Tsunemi

Hidenari Tsunemi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7217114
    Abstract: A resin roller (10) is produced by disposing a core body (21) in a forming metal mold (1) having a cylindrical metal mold (13) and core supporting members (14) furnished at both edge parts of the cylindrical metal mold (13) as well as causing the core supporting members (14) to hold said both edge parts, and pouring a forming resin into the metal mold and solidifying it. The resin roller (10) has the core body (21) of the same outer diameter over a full length and a cylindrical resin-formed body (12), sealing members (24, 26) are furnished around the core body (21) in the vicinity of both edge parts of the resin-formed body (12), and the core body (21) is disposed such that the sealing members (24, 26) contact edge faces (14a) at sides of a roller forming space of the core supporting members (14).
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: May 15, 2007
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ohgoshi, Toshiyuki Komatsu, Koji Sezaki, Hidenari Tsunemi, Kenji Kobayashi
  • Publication number: 20060088623
    Abstract: A resin roller (10) is produced by disposing a core body (21) in a forming metal mold (1) having a cylindrical metal mold (13) and core supporting members (14) furnished at both edge parts of the cylindrical metal mold (13) as well as causing the core supporting members (14) to hold said both edge parts, and pouring a farming resin into the metal mold and solidifying it. The resin roller (10) has the core body (21) of the same outer diameter over a full length and a cylindrical resin-formed body (12), sealing members (24, 26) are furnished around the core body (21) in the vicinity of both edge parts of the resin-formed body (12), and the core body (21) is disposed such that the sealing members (24, 26) contact edge faces (14a) at sides of a roller forming space of the core supporting members (14).
    Type: Application
    Filed: December 9, 2005
    Publication date: April 27, 2006
    Applicant: KANEKA CORPORATION
    Inventors: Hiroshi Ohgoshi, Toshiyuki Komatsu, Koji Sezaki, Hidenari Tsunemi, Kenji Kobayashi
  • Publication number: 20050238756
    Abstract: A resin roller (10) is produced by disposing a core body (21) in a forming metal mold (1) having a cylindrical metal mold (13) and core supporting members (14) furnished at both edge parts of the cylindrical metal mold (13) as well as causing the core supporting members (14) to hold said both edge parts, and pouring a forming resin into the metal mold and solidifying it. The resin roller (10) has the core body (21) of the same outer diameter over a full length and a cylindrical resin-formed body (12), sealing members (24, 26) are furnished around the core body (21) in the vicinity of both edge parts of the resin-formed body (12), and the core body (21) is disposed such that the sealing members (24, 26) contact edge faces (14a) at sides of a roller forming space of the core supporting members (14).
    Type: Application
    Filed: April 5, 2005
    Publication date: October 27, 2005
    Inventors: Hiroshi Ohgoshi, Toshiyuki Komatsu, Koji Sezaki, Hidenari Tsunemi, Kenji Kobayashi
  • Patent number: 6953421
    Abstract: An electrophotography roller incorporated in an image creating device by the electrophotography comprising a conductive shaft disposed along the center axis, a conductive elastic layer around the shaft, a surface layer on the conductive elastic layer formed concentrically. The JIS A hardness of the conductive elastic layer is 30° or less. The shear modulus of the conductive elastic layer measured in viscoelasticity under the condition of 20° C., 60% PH and 0.1 Hz is 4 105 Pa or more. The width of contact of the roller with another member is sufficiently ensured even under a low pressing pressure. The compression residual strain is small even after the roller is pressed against another member for a long time. If the roller is used as a development roller, a sharp image with less density unevenness due to the residual strain is created.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: October 11, 2005
    Assignee: Kaneka Corporation
    Inventors: Hidenari Tsunemi, Jun Kamite, Keizo Asaoka, Kenji Kobayashi
  • Patent number: 6915570
    Abstract: A resin roller (10) is produced by disposing a core body (21) in a forming metal mold (1) having a cylindrical metal mold (13) and core supporting members (14) furnished at both edge parts of the cylindrical metal mold (13) as well as causing the core supporting members (14) to hold the both edge parts, and pouring a forming resin into the metal mold and solidifying it. The resin roller (10) has the core body (21) of the same outer diameter over a full length and a cylindrical resin-formed body (12), sealing members (24, 26) are furnished around the core body (21) in the vicinity of both edge parts of the resin-formed body (12), and the core body is disposed such that the sealing members (24, 26) contact edge faces (14a) at sides of a roller forming space of the core supporting members (14).
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: July 12, 2005
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ohgoshi, Toshiyuki Komatsu, Koji Sezaki, Hidenari Tsunemi, Kenji Kobayashi
  • Publication number: 20040030032
    Abstract: The technique of preparing a semiconductive rubber by adding a conductivity imparting agent to resin matrix is so general but controlling the exhibiting conductive properties to a semiconductive range is difficult and in the technique of imparting conductivity by using an electronic conductive agent such as carbon black, uniform dispersion within the system is difficult and this often causes the problems of the sample fluctuation of the electric properties and voltage dependency of the obtained semiconductive rubber. The semiconductive resin composition of the present invention comprises (A) an oxyalkylene polymer having at least one hydrosilylizable alkenyl group in each molecule, (B) a compound having at least two hydrosilyl groups in each molecule, (C) a hydrosilylizing catalyst, and (D) an ionic conductivity imparting agent or (E) a nonionic surfactant.
    Type: Application
    Filed: June 6, 2003
    Publication date: February 12, 2004
    Inventors: Takao Manabe, Keizo Asaoka, Nagahiro Masuda, Hidenari Tsunemi
  • Publication number: 20030119639
    Abstract: A curable composition which comprises as essential ingredients (A) an organic polymer having per molecule at least one alkenyl group capable of undergoing hydrosilylation, (B) a compound having at least two hydrosilyl groups per molecule, (C) a hydrosilylation catalyst, (D) carbon black, (E) at least one compound selected from the group consisting of epoxidized compounds, acid anhydride compounds, and ester compounds, and (F) an organotitanium compound and/or an organoaluminum compound. In the composition, the carbon black serving as a conductivity imparter has been surface-treated with the ingredients (E) and (F) by the integral blending method. The conductive material obtained by heat-curing the curable composition has regulated conductivity.
    Type: Application
    Filed: August 5, 2002
    Publication date: June 26, 2003
    Inventors: Takao Manabe, Jun Kamite, Hidenari Tsunemi
  • Publication number: 20030022775
    Abstract: An electrophotography roller incorporated in an image creating device by the electrophotography comprising a conductive shaft disposed along the center axis, a conductive elastic layer around the shaft, a surface layer on the conductive elastic layer formed concentrically. The JIS A hardness of the conductive elastic layer is 30° or less. The shear modulus of the conductive elastic layer measured in viscoelasticity under the condition of 20° C., 60% PH and 0.1 Hz is 4 105 Pa or more. The width of contact of the roller with another member is sufficiently ensured even under a low pressing pressure. The compression residual strain is small even after the roller is pressed against another member for a long time. If the roller is used as a development roller, a sharp image with less density unevenness due to the residual strain is created.
    Type: Application
    Filed: June 13, 2002
    Publication date: January 30, 2003
    Inventors: Hidenari Tsunemi, Jun Kamite, Keizo Asaoka, Kenji Kobayashi
  • Patent number: 6320010
    Abstract: By incorporating (A) a saturated hydrocarbon polymer having more than one alkenyl group capable of being hydrosilylated in each molecule and having a molecular weight of 2,000 to 50,000, (B) a component comprising a compound containing more than two silicon atom-bound hydrogen atoms, on average, in each molecule, (C) a compound having, within the molecule, one alkenyl group capable of being hydrosilylated, (D) a compound having, within the molecule, at least two alkenyl groups capable of being hydrosilylated and having a molecular weight less than 2,000, and (E) a hydrosilylation catalyst, a composition having good mechanical characteristics, a high gel fraction and a small heating loss can be obtained. As a result, the invention can provide a composition to secure the uniformity within a wide range of selection not depending on its viscosity, because it is markedly relaxed the restriction on SiH-containing compounds that are curing agents possibly becoming a cause of said insufficient curing.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: November 20, 2001
    Assignee: Kaneka Corporation
    Inventors: Masashi Sakaguchi, Yoshimichi Yamanaka, Hidenari Tsunemi
  • Patent number: 5550282
    Abstract: Dislcosed is a curable composition of a partially trimerized prepolymer of the dicyanate ester of the formula ##STR1## wherein R.sub.1 and R.sub.2 are the same or different and each is alkyl, perfluoroalkyl, aryl or halogen; and A is a bridge selected from the group consisting of a direct bond, methylene optionally mono- or disubstituted by alkyl, perfluoroalkyl and/or aryl, a five or six membered cycloalkylene, sulfonyl, thio, oxy, carbonyl, phenylene, and xylylene optionally substituted by alkyl at on or both methylene carbon atoms is useful in the manufacture of electrical laminates having excellent dielectric properties in the GHz region.
    Type: Grant
    Filed: July 13, 1994
    Date of Patent: August 27, 1996
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hidenari Tsunemi, Toshinobu Nakata
  • Patent number: 5488144
    Abstract: A novel dicyanate ester of the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and each is hydrogen, alkyl, perfluoroalkyl, aryl or halogen; A is a bridge selected from the group consisting of direct bond, methylene optionally mono- or di-substituted by alkyl, perfluoroalkyl and/or aryl, a five or six membered cycloalkylene, sulfonyl, thio, oxy, carbonyl, phenylene, and xylylene optionally substituted by alkyl at one or both methylene carbon atoms; with the proviso that when the cyanato group is at the para-position relative to the bridge A, both R.sub.1 and R.sub.2 are not hydrogen, and its prepolymer are useful in the manufacture of electrical laminates having excellent dielectric properties in GHz region.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: January 30, 1996
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hidenari Tsunemi, Toshinobu Nakata
  • Patent number: 5360887
    Abstract: A flame-retarded thermosetting resin composition is provided by blending about 5 to 45 mole % of a phenylcyanate having at least one halogen substituent at the ortho or para position relative to the cyanato group, and about 55 to 95 mole % of a halogen-free bis-4-phenylcyanate. A flame retardancy of V-O grade of UL94 is achieved in the thermoset resin of the composition without compromising dielectric, heat resistance, moisture absorption and other properties.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: November 1, 1994
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hidenari Tsunemi, Toshinobu Nakata, Koyoyuki Namura
  • Patent number: 4990397
    Abstract: An unsaturated polyester composition is provided comprising an unsaturate polyester component, a cross-linking monomer and as a modifier of the resin a polyoxyalkylene alcohol at least partially esterified with a polymerizable unsaturated carboxylic acid. The modifier is produced by esterifying the hydroxy group of a polyoxyalkylene mono- or polyalcohol at least partially with a polymerizable carboxylic acid such as a maleic acid.
    Type: Grant
    Filed: May 3, 1990
    Date of Patent: February 5, 1991
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hidenari Tsunemi, Yasuo Fushiki, Asaichi Nishimura, Yousuke Kawai
  • Patent number: 4943474
    Abstract: An unsaturated polyester composition is provided comprising an unsaturate polyester component, a cross-linking monomer and as a modifier of the resin a polyoxyalkylene alcohol at least partially esterified with a polymerizable unsaturated carboxylic acid. The modifier is produced by esterifying the hydroxy group of a polyoxyalkylene mono- or polyalcohol at least partially with a polymerizable carboxylic acid such as maleic acid.
    Type: Grant
    Filed: January 12, 1989
    Date of Patent: July 24, 1990
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hidenari Tsunemi, Yasuo Fushiki, Asaichi Nishimura, Yousuke Kawai
  • Patent number: 4710420
    Abstract: An unsaturated polyester resin composition is provided comprising a hard unsaturated polyester component, a soft unsaturated polyester component and a cross-linking monomer. The soft polyester component contains a polyoxyalkylene segment having a molecular weight from 600 to 6000 in the backbone thereof and is dispersed in the hard polyester component forming fine particles having a particle size not greater than 4 microns. The resin composition, when cured, exhibits a Tg corresponding to the hard polyester component from 100.degree. C. to 200.degree. C. and another Tg corresponding to the soft polyester component from -100.degree. C. to 0.degree. C.
    Type: Grant
    Filed: December 20, 1985
    Date of Patent: December 1, 1987
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Satoshi Tonoki, Hidenari Tsunemi, Asaichi Nishimura, Kunihisa Abe