Abstract: The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Abstract: Provided is an epoxy resin composition capable of reducing the surface roughness of the surface of a roughening-treated cured body. The epoxy resin composition includes an epoxy resin, a curing agent, and a silica component obtained by performing a surface treatment on silica particles using a silane coupling agent; and the epoxy resin composition does not include a curing accelerator, or includes a curing accelerator at a content equal to or less than 3.5 parts by weight to a total of 100 parts by weight of the epoxy resin and the curing agent. Mean particle diameter of the silica particles is equal to or less than 1 ?m. An amount B (g) of the silane coupling agent used for surface treatment, per 1 g of the silica particles in the silica component, is within a range between 10% to 80% with regard to a value C (g) per 1 g of the silica particles, which is calculated by the following formula (X).

Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Abstract: Provided is an epoxy resin composition capable of reducing the surface roughness of the surface of a roughening-treated cured body. The epoxy resin composition includes an epoxy resin, a curing agent, and a silica component obtained by performing a surface treatment on silica particles using a silane coupling agent; and the epoxy resin composition does not include a curing accelerator, or includes a curing accelerator at a content equal to or less than 3.5 parts by weight to a total of 100 parts by weight of the epoxy resin and the curing agent. Mean particle diameter of the silica particles is equal to or less than 1 ?m. An amount B (g) of the silane coupling agent used for surface treatment, per 1 g of the silica particles in the silica component, is within a range between 10% to 80% with regard to a value C (g) per 1 g of the silica particles, which is calculated by the following formula (X).

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of 1.0×10?3 [° C.?1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of up to 17×10?3 [° C.?1 ] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of 1.0×10?3 [° C.?1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of up to 17×10?3 [° C.?1] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.