Abstract: The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (?/?) of the maximum value (?) to the minimum value (?) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.

Abstract: A composite member (1) satisfies the following expressions. X/(E×|CTE(B)?CTE(A)|)?50, X/(E×|CTE(B)?CTE(C)|)?50, Y/|CTE(B)?CTE(A)|×L(BA)?50, and Y/|CTE(B)?CTE(C)|×L(BC)?50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.?1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.?1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.

Abstract: A composite member (1) satisfies the following expressions. X/(E×|CTE(B)?CTE(A)|)?50, X/(E×|CTE(B)?CTE(C)|)?50, Y/|CTE(B)?CTE(A)|×L(BA)?50, and Y/|CTE(B)?CTE(C)|×L(BC)?50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.?1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.?1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.

Abstract: The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (?/?) of the maximum value (?) to the minimum value (?) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.

Abstract: A thermosetting resin composition excellent in dimensional stability during curing and adhesiveness, heat resistance, moist heat resistance, electrical insulating properties, flexibility, low dielectric properties and low dissipation factor properties after curing is provided. A thermosetting resin composition according to the present invention is a thermosetting resin composition containing a polyamide (A) made by polymerization of a polybasic acid monomer and a polyamine monomer and having a phenolic hydroxyl group on a side chain, and a compound (B) with a functionality of three or more that can react with the phenolic hydroxyl group. Monomers that form the polyamide (A) include a monomer having a phenolic hydroxyl group and a monomer having a hydrocarbon group with a carbon number of 20 to 60 (excluding an aromatic ring to which the phenolic hydroxyl group bonds) and having a cyclic structure with a carbon number of 5 to 10.

Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

Abstract: The present invention provides a solid catalyst with which to synthesize liquid-phase methanol from carbon monoxide and hydrogen which are under pressure, in a solution such as methanol, without executing separation or recirculation. A solid catalyst, in which an ion-exchange resin anion-exchanged to be an alcoxide type is combined with a transition metal such as a Raney type, powder type or supported type, is used for synthesizing methanol from carbon monoxide and hydrogen in a solution such as methanol.

Abstract: A process for purifying carbon black which contains solid impurities by removing the solid impurities thererom, which process comprises suspending said carbon black uniformly in water to obtain a carbon black aqueous slurry and subjecting the slurry to sieving treatment by an ultrasonic vibration sieving apparatus.