Patents by Inventor Hidenobu Nakagawa
Hidenobu Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10386762Abstract: A heating unit includes a circuit board, heating parts, and electrode parts. The heating parts are arranged in a first direction on a surface of the circuit board. The electrode parts are disposed on the surface of the circuit board, and electrically connected to both sides of the heating parts in a second direction that is orthogonal to the first direction. Each of the heating parts includes a plurality of heating resistors that is arranged in the first direction. Each of the heating resistors has a size ratio of a first length in the second direction to a second length in the first direction is 1 or more and 100 or less.Type: GrantFiled: August 11, 2018Date of Patent: August 20, 2019Assignees: KYOCERA Document Solutions Inc., KYOCERA CorporationInventors: Takashi Eiki, Hiroki Kawasaki, Ryohei Tokunaga, Atsushi Kohama, Yuhiro Sakai, Kotatsu Kawaguchi, Hidenobu Nakagawa
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Publication number: 20190056685Abstract: A heating unit includes a circuit board, heating parts, and electrode parts. The heating parts are arranged in a first direction on a surface of the circuit board. The electrode parts are disposed on the surface of the circuit board, and electrically connected to both sides of the heating parts in a second direction that is orthogonal to the first direction. Each of the heating parts includes a plurality of heating resistors that is arranged in the first direction. Each of the heating resistors has a size ratio of a first length in the second direction to a second length in the first direction is 1 or more and 100 or less.Type: ApplicationFiled: August 11, 2018Publication date: February 21, 2019Applicants: KYOCERA Document Solutions Inc., KYOCERA CorporationInventors: Takashi EIKI, Hiroki KAWASAKI, Ryohei TOKUNAGA, Atsushi KOHAMA, Yuhiro SAKAI, Kotatsu KAWAGUCHI, Hidenobu NAKAGAWA
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Patent number: 9333765Abstract: A thermal head capable of decreasing the possibility of causing a blur in an image printed on a recording medium is provided. A thermal head includes: a substrate; a plurality of heat generating portions disposed aligned on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating portions; a driving IC electrically connected to the electrode; and a covering member which covers the driving IC and makes contact with a recording medium which is being conveyed. The covering member includes: a first protrusion extending in a direction away from the substrate; and a second protrusion which is spaced from the first protrusion, is located between the first protrusion and the heat generating portions, and extends in a direction away from the substrate.Type: GrantFiled: November 15, 2013Date of Patent: May 10, 2016Assignee: Kyocera CorporationInventors: Youichi Moto, Takahiro Murata, Hidenobu Nakagawa, Takahiro Shimozono, Iwao Kobayashi
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Publication number: 20150298464Abstract: A thermal head capable of decreasing the possibility of causing a blur in an image printed on a recording medium is provided. A thermal head includes: a substrate; a plurality of heat generating portions disposed aligned on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating portions; a driving IC electrically connected to the electrode; and a covering member which covers the driving IC and makes contact with a recording medium which is being conveyed. The covering member includes: a first protrusion extending in a direction away from the substrate; and a second protrusion which is spaced from the first protrusion, is located between the first protrusion and the heat generating portions, and extends in a direction away from the substrate.Type: ApplicationFiled: November 15, 2013Publication date: October 22, 2015Applicant: KYOCERA CORPORATIONInventors: Youichi MOTO, Takahiro MURATA, Hidenobu NAKAGAWA, Takahiro SHIMOZONO, Iwao KOBAYASHI
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Patent number: 8587624Abstract: There are provided a recording head capable of reduction of variations in heat-generating temperature among heat-generating elements constituting a heat-generating-element array, and a recording device including the recording head. A recording head includes a heat radiator; a head base body having a substrate placed on or above the heat radiator and a heat-generating-element array composed of a plurality of heat-generating elements arranged on or above the substrate; a bonding layer that is interposed between the heat radiator and the substrate and bonds the heat radiator with the substrate; and a plurality of spacer particles arranged within the bonding layer so as to abut on both of the heat radiator and the substrate. The bonding layer includes a first region situated immediately below the heat-generating-element array and a second region extending in parallel with the first region. The spacer particles are arranged in the second region.Type: GrantFiled: August 26, 2010Date of Patent: November 19, 2013Assignee: Kyocera CorporationInventors: Hidenobu Nakagawa, Yoichi Moto, Makoto Miyamoto
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Patent number: 8319809Abstract: A recording head applicable to a recording device is disclosed. The recording head comprises a substrate, a conductive pattern layer, and an electric resistor layer. The conductive pattern layer is formed on the substrate and comprises a first conductive portion, a second conductive portion, and an insulating portion. The second conductive portion is paired with the first conductive portion. The insulating portion insulates the first conductive portion and the second conductive portion. The electrical resistance layer: is formed on the conductive pattern layer; is connected to the first conductive portion and the second conductive portion; and comprises a heat-generating region between the first conductive portion and the second conductive portion.Type: GrantFiled: December 24, 2008Date of Patent: November 27, 2012Assignee: Kyocera CorporationInventors: Hidenobu Nakagawa, Yoichi Moto, Sunao Hashimoto
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Patent number: 8279248Abstract: A thermal head includes heat generating parts and a conductive layer having connecting parts electrically connected to ends of the heat generating parts. The conductive layer has wiring parts whose cross-sectional areas are smaller than cross-sectional areas of the respective connecting parts in directions. The wiring parts has a first upper layer and a second upper layer which have smaller widths in arrow directions than widths of the respective connecting parts as well as a first lower layer and a second lower layer which have lengths not shorter than the widths of the respective connecting parts and greater than the widths of the respective upper layers. The respective upper layers and the respective lower layers are arranged to overlap each other.Type: GrantFiled: September 28, 2008Date of Patent: October 2, 2012Assignee: Kyocera CorporationInventors: Yoichi Moto, Jun Komori, Hidenobu Nakagawa, Kenji Miyamura, Yoshira Niwa, Masaaki Kitado, Ayumi Imamura
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Publication number: 20120125568Abstract: There are provided a recording head capable of reduction of variations in heat-generating temperature among heat-generating elements constituting a heat-generating-element array, and a recording device including the recording head. A recording head includes a heat radiator; a head base body having a substrate placed on or above the heat radiator and a heat-generating-element array composed of a plurality of heat-generating elements arranged on or above the substrate; a bonding layer that is interposed between the heat radiator and the substrate and bonds the heat radiator with the substrate; and a plurality of spacer particles arranged within the bonding layer so as to abut on both of the heat radiator and the substrate. The bonding layer includes a first region situated immediately below the heat-generating-element array and a second region extending in parallel with the first region. The spacer particles are arranged in the second region.Type: ApplicationFiled: August 26, 2010Publication date: May 24, 2012Applicant: KYOCERA CORPORATIONInventors: Hidenobu Nakagawa, Yoichi Moto, Makoto Miyamoto
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Publication number: 20110007121Abstract: A recording head applicable to a recording device is disclosed. The recording head comprises a substrate, a conductive pattern layer, and an electric resistor layer. The conductive pattern layer is formed on the substrate and comprises a first conductive portion, a second conductive portion, and an insulating portion. The second conductive portion is paired with the first conductive portion. The insulating portion insulates the first conductive portion and the second conductive portion. The electrical resistance layer: is formed on the conductive pattern layer; is connected to the first conductive portion and the second conductive portion; and comprises a heat-generating region between the first conductive portion and the second conductive portion.Type: ApplicationFiled: December 24, 2008Publication date: January 13, 2011Applicant: KYOCERA CORPORATIONInventors: Hidenobu Nakagawa, Yoichi Moto, Sunao Hashimoto
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Publication number: 20100271454Abstract: A thermal head includes heat generating parts and a conductive layer having connecting parts electrically connected to ends of the heat generating parts. The conductive layer has wiring parts whose cross-sectional areas are smaller than cross-sectional areas of the respective connecting parts in directions. The wiring parts has a first upper layer and a second upper layer which have smaller widths in arrow directions than widths of the respective connecting parts, as well as a first lower layer and a second lower layer which have lengths not shorter than the widths of the respective connecting parts and greater than the widths of the respective upper layers. The respective upper layers and the respective lower layers are arranged to overlap each other.Type: ApplicationFiled: September 28, 2008Publication date: October 28, 2010Applicant: KYOCERA CORPORATIONInventors: Yoichi Moto, Jun Komori, Hidenobu Nakagawa, Kenji Miyamura, Yoshira Niwa, Masaaki Kitado, Ayumi Imamura