Abstract: An image reading apparatus includes: a light source that irradiates light; a switching unit that switches a direction of the light irradiated by the light source to one of a plurality of predetermined directions; a light guiding unit that guides the light whose direction is switched by the switching unit and that travels in one of the plurality of directions to a position predetermined for each of the directions; and a light sensor that, in a case where an object is in the predetermined position, measures light reflect by the object out of the light guided to the position by the light guiding unit.

Abstract: A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.

Abstract: An image reading apparatus includes: a light source that irradiates light; a switching unit that switches a direction of the light irradiated by the light source to one of a plurality of predetermined directions; a light guiding unit that guides the light whose direction is switched by the switching unit and that travels in one of the plurality of directions to a position predetermined for each of the directions; and a light sensor that, in a case where an object is in the predetermined position, measures light reflect by the object out of the light guided to the position by the light guiding unit.

Abstract: A image reading apparatus includes an pointing part that points a position on a medium that has an image to be read formed thereon, an irradiating unit that irradiates light onto the medium on which the position was pointed by the pointing part, an imaging unit that forms an image of light reflected from the medium irradiated with light by the irradiating unit, a generating unit that generates a signal representing the image to be read that depends on the reflected light whose image is formed by the imaging unit, and a changing unit that varies an direction of the imaging unit, and changes the position on the image that is imaged by the generating unit, within an irradiation range irradiated with light by the irradiating unit.

Abstract: First and second semiconductor chips are arranged side by side on a package base. A plurality of electrode pads with exposed Al films are formed at regular intervals on the first and second semiconductor chips. An Au bump is formed on each electrode pad of the second semiconductor chip. Each electrode pad of the first semiconductor chip is paired with each electrode pad of the second semiconductor chip. The electrode pads of each pair are equally spaced, and interconnected with a gold wire by wire bonding. In the wire bonding process, ball bonding is performed to the electrode pad of the first semiconductor chip as a first target, and stitch bonding is performed to the Au bump on the electrode pad of the second semiconductor chip as a second target.

Abstract: A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.

Abstract: A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.

Abstract: A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.