Patents by Inventor Hidenobu TAKEMOTO

Hidenobu TAKEMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component package
    Patent number: 9392701
    Abstract: An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: July 12, 2016
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Akio Nakao, Hidenobu Takemoto
  • ELECTRONIC COMPONENT PACKAGE
    Publication number: 20150124417
    Abstract: An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.
    Type: Application
    Filed: May 29, 2014
    Publication date: May 7, 2015
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Akio NAKAO, Hidenobu TAKEMOTO