Patents by Inventor Hidenori Akatani

Hidenori Akatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tape
    Patent number: 5930654
    Abstract: A method of producing semiconductor devices includes the steps of disposing an adhesive tape over a wafer such that an adhesive surface of said tape faces a top surface of said wafer, disposing a flexible urging member over the tape in a state that the flexible urging member causes a deformation by a gravity such that the flexible urging member causes a bulging in a downward direction toward the adhesive tape, moving the flexible urging member relatively to the adhesive tape in engagement with the adhesive tape such that the adhesive tape is deformed in conformity with the flexible urging member and the adhesive tape causes a bulging in a downward direction toward the wafer, and contacting the deformed adhesive tape on the top surface of the wafer.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: July 27, 1999
    Assignee: Fujitsu Limited
    Inventors: Yoshihiro Tohyama, Takanori Muramoto, Akihisa Hayashida, Hidenori Akatani