Abstract: A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.

Abstract: The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.

Abstract: A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2.

Abstract: A production method of a suspension board with circuit that can form the ground terminal for connection with the ground, while reducing the number of man-hour and complicated processes, and reduce production cost. After an insulating base layer is formed on a metal supporting board in such a manner that the base opening portion is formed in the metal supporting board, a conductive pattern comprising a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire.

Abstract: A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.

Abstract: The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.

Abstract: A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2.

Abstract: A producing method of a suspension board with circuit that can permit a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and also can reduce the number of processes, and the suspension board with circuit produced by the same producing method. After an insulating base layer 3 is formed on a suspension board 2 in a specific pattern in which a second opening 12 is formed, a thin metal film 13 is formed on an entire surface of the insulating base layer 3 and on a surface of the suspension board 2 including the second opening 12 exposed from the insulating base layer 3.Then, a conductor layer 4 is formed in the form of a wired circuit pattern on the thin metal film 13. Thereafter, the insulating cover layer 10 is formed in such a manner that a pad opening 11 is formed in the insulating cover layer 10 and then a pad portion 16 is formed in the pad opening 11 using the suspension board 2 as a lead portion of the electrolysis plating.

Abstract: The present invention relates to a chemical solution for forming a silver film on a substrate. This chemical solution has (1) an ammoniac silver nitrate solution; (2) a reducing solution containing a reducing agent and a base component; and (3) an additive containing a compound of a polyvalent metal. This additive is contained in at least one of the ammoniac silver nitrate solution and the reducing solution. The present invention further relates to a process for forming a silver film on a substrate, using the chemical solution. This process includes (a) bringing a hydrochloric acid acidified stannous chloride solution into contact with a surface of the substrate, thereby conducting a pretreatment of the surface; (b) bringing another ammoniac silver nitrate solution into contact with the surface of the substrate; and (c) bringing the ammoniac silver nitrate solution into contact with the reducing solution, on the surface of the substrate, thereby forming the silver film.

Abstract: The invention relates to a coating liquid for forming a silver film on a substrate. The coating liquid includes a first ammoniacal aqueous solution containing silver nitrate and a second aqueous solution containing a reducer, a strong alkali, and at least one member selected from the group consisting halides and water-soluble proteins. The first and second aqueous solutions are reacted for forming the silver film on the substrate. The silver film formed from the coating liquid is fine and in texture, is superior in adhesion to the substrate, and enables a precise reflection image.

Abstract: The invention relates to a coating composition for preparing a back coating film of a mirror. The mirror has a glass substrate, a silver mirror film formed on a back surface of the glass substrate, a metallic protective film formed on the silver mirror film, and the back coating film formed on the metallic protective film. The coating composition comprises: a binder consisting of 40 to 85 parts by weight of the total of an epoxy resin and a hardener of the epoxy resin, and 15 to 60 parts by weight of at least one selected from the group consisting of a ketone formaldehyde resin and its derivatives; and a pigment blend containing 7-55 wt % of a corrosion-inhibitive pigment based on the weight of the pigment blend. The weight ratio of the pigment blend to the binder is in the range from 1.2 to 4.0. The back coating film is superior in chemical resistance and corrosion resistance even if a lead-free corrosion-inhibitive pigment is used.