Abstract: A quartz crystal device includes: a crystal unit in which a crystal blank is hermetically encapsulated; and a mounting substrate housing an IC chip on which a circuit using the crystal blank is integrated. By joining an external terminal of the crystal unit and a bonding terminal of the mounting substrate, the mounting substrate is joined to the crystal unit to be integrated, and the quartz crystal device is configured. In the quartz crystal device, a crystal monitor terminal electrically connected to the bonding terminal is provided on an outer side surface of the mounting substrate, and even in a state in which the crystal unit and the mounting terminal are integrated, a vibration characteristic of the crystal blank is measurable by using the crystal monitor terminal.

Abstract: A quartz crystal device includes: a quartz crystal blank having an outer perimeter part and a vibration region partially separated mechanically from the outer perimeter part by a cut-out groove; a first container joined to a first principal surface of the crystal blank by being joined to an entire perimeter of the perimeter part of the crystal blank via a brazing material layer in the first principal surface; and a second container joined to a second principal surface of the crystal blank by being joined to an entire perimeter of the outer perimeter part of the crystal blank via a brazing material layer in the second principal surface. The vibration region of the crystal blank is hermetically encapsulated in a space formed by the first container, the second container and the outer perimeter part of the crystal blank.

Abstract: A method of manufacturing a surface mount type crystal oscillator having a container body including a first recess and a second recess respectively formed in two main surfaces thereof, a crystal blank hermetically sealed in the first recess, an IC chip having an oscillation circuit integrated thereon and secured to the bottom surface of the second recess through thermo-compression bonding using bumps, and a protection resin for protecting a circuit-forming surface of the IC chip comprises the steps of applying a protection resin consisting of a flexible resin along the inner periphery of the second recess, and pressing the IC chip while the outer periphery of the IC chip is brought into contact with the applied protection resin to secure the IC chip to the bottom surface of the second recess.

Abstract: In a surface-mount crystal oscillator, an IC chip having an IC terminal at each of at least four corner portions is housed in a substantially rectangular recess. Circuit terminals to which the IC terminals are fixed via bumps are provided on an inner bottom surface of the recess, and external terminals electrically connected to the circuit terminals are provided at the four corner portions of an opening end surface surrounding the recess. In each of at least three vertices or corners on the inner bottom surface of the recess, an external terminal corresponding to the vertex is formed into an L-shape to be in contact with a longer side and a shorter side of an outer perimeter of the recess, and an exposed part in which the inner bottom surface is exposed is formed between the circuit terminal which is the closest to the vertex and its external terminal.

Abstract: A surface mount type crystal oscillator includes a container main body including a recess on one main surface thereof and hermetically encapsulating an IC (integrated circuit) chip and a quartz crystal blank, and a mounting terminal electrically connected to the IC chip. The container main body includes a laminated ceramic made by laminating a flat layer and a frame wall layer, and a notch portion which is opened to the outer periphery of the container main body is formed on the flat layer within a region where the frame wall layer is laminated to the flat layer. A probe contact terminal electrically connected to the IC chip and/or the crystal blank is provided on the exposed surface of the frame wall layer by the notch portion. The mounting terminal is provided on the outer bottom face of the flat layer.

Abstract: A surface mount crystal oscillator comprises: a crystal unit having a crystal blank hermetically sealed in a package, and first external terminals formed on an outer bottom surface of the package; and a mounting substrate for containing an IC chip which has an oscillation circuit integrated therein, the oscillation circuit using the crystal blank. The mounting substrate includes second external terminals corresponding to the first external terminals on one main surface, and mounting terminals on the other main surface. The mounting substrate comprises a printed wiring board made up of a lower layer, an intermediate frame layer having an opening, and an upper layer laminated one on another. The IC chip is placed in a hollow space defined by the opening. The first external terminals are bonded to the second external terminals to integrate the crystal unit with the mounting substrate.

Abstract: A crystal oscillator for surface-mounting on a circuit board comprises a package body which includes a bottom wall layer, and a frame wall layer having an opening and laminated on the bottom wall layer, where the opening defines a recess in the package body, a crystal blank contained in the recess, an IC chip contained in the recess, and mounting terminals disposed at four corners on an outer bottom surface of the package body for use in mounting the crystal oscillator. An oscillation circuit using the crystal blank is integrated in the IC chip. The package body is formed with a cavity in at least a central region of the outer bottom surface thereof, and no electrode layer is disposed in the cavity.

Abstract: A surface mount crystal oscillator comprises a package body having a first recess, a cover having a second recess, a crystal blank secured to an inner bottom surface of the second recess, and an IC chip secured to a bottom surface of the first recess. The IC chip has an oscillation circuit using the crystal oscillator integrated therein, and has IC terminals on one main surface for connection to the outside. A first and a second annular metal film are disposed to surround open end surfaces of the first recess and second recess, respectively. By bonding the first and second annular metal films with an eutectic alloy, the crystal blank and IC chip are hermetically sealed in a space defined by the integrated first and second recesses.

Abstract: A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Abstract: A method of manufacturing a surface mount type crystal oscillator having a container body including a first recess and a second recess respectively formed in two main surfaces thereof, a crystal blank hermetically sealed in the first recess, an IC chip having an oscillation circuit integrated thereon and secured to the bottom surface of the second recess through thermo-compression bonding using bumps, and a protection resin for protecting a circuit-forming surface of the IC chip comprises the steps of applying a protection resin consisting of a flexible resin along the inner periphery of the second recess, and pressing the IC chip while the outer periphery of the IC chip is brought into contact with the applied protection resin to secure the IC chip to the bottom surface of the second recess.

Abstract: A surface-mount crystal oscillator includes a quartz crystal unit, a mounting substrate on which an IC (Integrated Circuit) chip is mounted and which is bonded to the rear surface of the crystal unit, and an electronic components which is mounted on one end of the surface of the mounting substrate on which the crystal unit is bonded. The crystal unit includes a planar substrate, a quartz crystal blank held on one principal surface of the planar substrate, a metal film formed along the outer periphery of the principal surface, and a concave metal cover having an open-ended face. In the crystal unit, the open-ended face of the metal cover is brazed to the metal film, whereby the crystal blank is hermetically sealed between the metal cover and the planar substrate.

Abstract: A surface-mounted crystal oscillator has a quartz crystal unit and a receptacle which is joined to the rear surface of the crystal unit for accommodating an IC (Integrated Circuit) chip. The receptacle has a bottom wall and sidewalls, and further, a concavity formed in at least one of its principal surfaces. The sidewalls surrounding the concavity are opened on at least one end of the receptacle, and at this opened end, the bottom wall is exposed and a notch portion is formed in the bottom wall.

Abstract: A surface-mount quartz crystal oscillator has a quartz crystal unit, a mounting substrate joined to a reverse surface of the crystal unit, an IC (Integrated Circuit) chip accommodated in the mounting substrate and electrically connected to the crystal unit in providing an oscillating circuit, and a chip device such as a bypass capacitor mounted on the mounting substrate. The mounting substrate has a bottom wall, a frame wall mounted on the bottom wall, and a recess defined in at least one principal surface thereof and surrounded by the frame wall, with the IC chip being disposed in the recess. The frame wall has at least one opening defined therein, and the bottom wall has a smaller thickness at a position aligned with the opening than other positions on the bottom wall. The chip device is disposed in the position on the bottom wall.

Abstract: A surface-mount crystal oscillator includes a crystal unit housing and an element housing which is provided on the base side of the crystal unit housing. A crystal blank is accommodated and hermetically sealed in the crystal unit housing. A concavity having an open side is formed in the element housing, and an IC chip is secured to the bottom surface of the concavity by means of face-down bonding. Notch portions or recess portions which are adjoining and connecting to the concavity and which are used for injecting fluid resin are formed in the frame portion at the periphery of the concavity. Fluid resin is injected to the bottom surface of the concavity by way of the notch portions and cured to form a protective resin layer of the IC chip.

Abstract: A sheet substrate for use in manufacturing surface-mount crystal oscillators has a plurality of container bodies fabricated thereon. Each of the container bodies is capable of accommodating at least one IC chip, and has a bottom face formed with a plurality of mount terminals and a top face which is capable of forming a crystal unit thereto. On the sheet substrate, each of the container bodies has a conductive path extending from the container body to an adjacent container body and connected to a mount terminal of the adjacent container body, and a chip carrying terminal connected to one end of the conductive path for use in electric connection with the IC chip.

Abstract: A surface-mounted crystal oscillator has a quartz crystal unit and a receptacle which is joined to the rear surface of the crystal unit for accommodating an IC (Integrated Circuit) chip. The receptacle has a bottom wall and sidewalls, and further, a concavity formed in at least one of its principal surfaces. The sidewalls surrounding the concavity are opened on at least one end of the receptacle, and at this opened end, the bottom wall is exposed and a notch portion is formed in the bottom wall.

Abstract: A surface-mount crystal oscillator includes a quartz crystal unit, a mounting substrate on which an IC (Integrated Circuit) chip is mounted and which is bonded to the rear surface of the crystal unit, and an electronic components which is mounted on one end of the surface of the mounting substrate on which the crystal unit is bonded. The crystal unit includes a planar substrate, a quartz crystal blank held on one principal surface of the planar substrate, a metal film formed along the outer periphery of the principal surface, and a concave metal cover having an open-ended face. In the crystal unit, the open-ended face of the metal cover is brazed to the metal film, whereby the crystal blank is hermetically sealed between the metal cover and the planar substrate.

Abstract: A surface-mount quartz crystal oscillator has a quartz crystal unit, a mounting substrate joined to a reverse surface of the crystal unit, an IC (Integrated Circuit) chip accommodated in the mounting substrate and electrically connected to the crystal unit in providing an oscillating circuit, and a chip device such as a bypass capacitor mounted on the mounting substrate. The mounting substrate has a bottom wall, a frame wall mounted on the bottom wall, and a recess defined in at least one principal surface thereof and surrounded by the frame wall, with the IC chip being disposed in the recess. The frame wall has at least one opening defined therein, and the bottom wall has a smaller thickness at a position aligned with the opening than other positions on the bottom wall. The chip device is disposed in the position on the bottom wall.

Abstract: A surface-mount crystal oscillator includes a crystal unit housing and an element housing which is provided on the base side of the crystal unit housing. A crystal blank is accommodated and hermetically sealed in the crystal unit housing. A concavity having an open side is formed in the element housing, and an IC chip is secured to the bottom surface of the concavity by means of face-down bonding. Notch portions or recess portions which are adjoining and connecting to the concavity and which are used for injecting fluid resin are formed in the frame portion at the periphery of the concavity. Fluid resin is injected to the bottom surface of the concavity by way of the notch portions and cured to form a protective resin layer of the IC chip.

Abstract: A sheet substrate for use in manufacturing surface-mount crystal oscillators has a plurality of container bodies fabricated thereon. Each of the container bodies is capable of accommodating at least one IC chip, and has a bottom face formed with a plurality of mount terminals and a top face which is capable of forming a crystal unit thereto. On the sheet substrate, each of the container bodies has a conductive path extending from the container body to an adjacent container body and connected to a mount terminal of the adjacent container body, and a chip carrying terminal connected to one end of the conductive path for use in electric connection with the IC chip.