Abstract: There is provided a robot device including: a head portion coupled to a trunk; four leg portions on a front left, a front right, a rear left, and a rear right coupled to the trunk; a first indirect portion that tilts the head portion left and right; and a second joint portion that rotates, with respect to the trunk, one of the leg portions on the rear left and the rear right to a front side, and the other to a rear side. It is possible to faithfully reproduce the movement of the four-legged animal by providing the first joint portion and the second joint portion.

Abstract: The present technology relates to a camera module, an information processing system, an information processing method, and an information processing apparatus capable of suppressing complication of a system including a camera in a moving device such as a vehicle. A camera module includes a first camera, a second camera, and a housing that stores the first camera and the second camera. In a state where the camera module is installed in a moving device, an optical axis of the first camera faces obliquely rearward of the moving device, and an optical axis of the second camera faces in a lateral direction or obliquely forward of the moving device. The present technology can be applied to, for example, a vehicle that performs automated driving.

Abstract: A semiconductor module includes: a semiconductor element having, on a front face thereof, a signal terminal and a ground terminal; a transmission line body having a signal transmission portion and a ground portion; a signal connection terminal electrically connected to the signal transmission portion of the transmission line body; ground connection terminals arranged to surround the signal connection terminal and electrically connected to the ground portion of the transmission line body, the ground connection terminals and the signal connection terminal constituting a pseudo coaxial line; a heat dissipation plate having a front face in close contact with a back face of the semiconductor element; and an interposer substrate having a semiconductor-element signal pad electrically connected to the signal terminal of the semiconductor element by a conductive adhesive, a transmission-line-body-2 signal pad electrically connected to the signal connection terminal, and a ground portion electrically connected to the g

Abstract: To reliably connect a device to be charged such as a robot and a charging device. There is provided a charging device including a charging stand having a charging terminal to be connected to a device to be charged and an engaging portion that performs positioning with the device to be charged, and a support member that supports the charging stand movably in the horizontal direction. With this configuration, the charging stand can be moved in the horizontal direction. Therefore, it is possible to reliably connect the device to be charged such as a robot and the charging device.

Abstract: A high frequency circuit includes: a first wire provided on a front surface of a board and being in contact with a heat generation part; a second wire provided on the front surface of the board and connected to ground; and a chip resistor connected between the first wire and the second wire and having a thermal conductive characteristic and an electric insulation characteristic, and the first wire includes: a wire part which is disposed between the heat generation part and the chip resistor, and which has a characteristic impedance equal to an impedance as a reference for impedance matching in the first wire; and a wire part which is disposed on a low temperature side with the chip resistor being set as a boundary, and which has a thermal resistance higher than that of the chip resistor.

Abstract: A converter includes an electrical opening which is a loop pattern, at one end of a conductor pattern located immediately above one end of a waveguide with a dielectric substrate interposed therebetween.

Abstract: A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.

Abstract: Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.

Abstract: A cavity is formed in a surface of a dielectric component on the permanent magnet side. The cavity has a bottom surface extending in a direction along one main surface and a side surface extending in a thickness direction crossing the bottom surface. At least a part of the permanent magnet is disposed in the cavity. A surface of at least a part of the permanent magnet disposed in the cavity is fixed to both of the bottom surface and the side surface through an adhesive.

Abstract: A cavity is formed in a surface of a dielectric component on the permanent magnet side. The cavity has a bottom surface extending in a direction along one main surface and a side surface extending in a thickness direction crossing the bottom surface. At least a part of the permanent magnet is disposed in the cavity. A surface of at least a part of the permanent magnet disposed in the cavity is fixed to both of the bottom surface and the side surface through an adhesive.

Abstract: A soundproofing device includes: a first layer (911) having sound absorbing properties; and a second layer (912) including elastic fibers.

Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Abstract: In a non-reciprocal circuit element, a permanent magnet is connected to one main surface of a magnetic plate, and a circuit board is connected to the other main surface of the magnetic plate, with a solder bump lying between the circuit board and the other main surface. The permanent magnet can control the transmission of electrical signal from each of a plurality of signal conductors of circuit board to a corresponding one of a plurality of input/output terminals of the magnetic plate. The non-reciprocal circuit element further includes an underfill material arranged between the magnetic plate and the circuit board. The magnetic plate has a through hole formed therein, the through hole extending from one main surface to the other main surface. The through hole has an empty space in which at least a part of a conductive film arranged in the through hole is exposed.

Abstract: Provided is a power divider/combiner capable of improving reflection characteristics and isolation characteristics. The power divider/combiner is formed by a multilayer board, and a strip conductor is arranged in an inner layer of the multilayer board and a chip resistor is arranged on an outer surface of the multilayer board. The power divider/combiner includes vias, which connect the strip conductor and the chip resistor, and includes stubs mounted between input/output terminals and the vias. With this configuration, it is possible to adjust induction mainly during an odd mode of an even/odd mode operation and to consequently improve reflection characteristics of the input/output terminals and isolation characteristics between the input/output terminals.

Abstract: The movable apparatus includes a holding body and a movable body. The holding body includes a first opening portion and an internal space, and is constituted of one part. The movable body includes an internal body and a first movable shaft portion. The internal body is stored in the internal space of the holding body, and has such a size that the internal body is prevented from exiting the first opening portion even if the first opening portion is elastically deformed. The first movable shaft portion is capable of being moved integrally with the internal body, and is exposed to outside of the holding body from inside of the holding body through the first opening portion.

Abstract: A converter includes an electrical opening which is a loop pattern, at one end of a conductor pattern located immediately above one end of a waveguide with a dielectric substrate interposed therebetween.

Abstract: To reliably connect a device to be charged such as a robot and a charging device. According to the present disclosure, there is provided a charging device including a charging stand having a charging terminal to be connected to a device to be charged and an engaging portion that performs positioning with the device to be charged; and a support member that supports the charging stand movably in the horizontal direction. With this configuration, the charging stand can be moved in the horizontal direction. Therefore, it is possible to reliably connect the device to be charged such as a robot and the charging device.