Abstract: A scintillator panel that converts radiation into scintillation light includes a substrate that includes a principal surface, a scintillator layer that is disposed on the principal surface, and a reflective layer that is disposed on the scintillator layer and reflects the scintillation light. The scintillator layer includes a plurality of scintillator portions which are arranged with a predetermined pitch on the principal surface. Each scintillator portion includes a side face that extends in a direction crossing the principal surface. The reflective layer includes a plurality of metal particles with a foil shape extending along the side faces and is disposed so as to cover the side faces.

Abstract: A method of manufacturing a radiation detector includes a first step of forming a scintillator layer including a plurality of columnar crystals on a main surface of a sensor panel including a plurality of photoelectric converting elements by a vapor phase deposition method, a second step of forming a resin frame on the main surface to surround the scintillator layer and disposing a frame member made of an inorganic solid material to be in contact with the resin frame along an outer circumference of the resin frame, a third step of sealing the scintillator layer by bonding a protective plate to the resin frame, and a fourth step of curing the resin frame.

Abstract: A radiation detector includes a sensor panel that includes a main surface and a plurality of photoelectric converting elements formed on the main surface, a scintillator layer that includes a plurality of columnar crystals in a scintillator material and is formed on the main surface, an intermediate layer that covers a front surface and a side surface of the scintillator layer, a resin frame that is formed on the main surface to surround the scintillator layer, and a protective plate that is bonded to the resin frame to seal the scintillator layer. The scintillator layer extends along the main surface to come into contact with the resin frame with the intermediate layer interposed therebetween.

Abstract: A scintillator panel that converts radiation into scintillation light includes a substrate that includes a principal surface, a scintillator layer that is disposed on the principal surface, and a reflective layer that is disposed on the scintillator layer and reflects the scintillation light. The scintillator layer includes a plurality of scintillator portions which are arranged with a predetermined pitch on the principal surface. Each scintillator portion includes a side face that extends in a direction crossing the principal surface. The reflective layer includes a plurality of metal particles with a foil shape extending along the side faces and is disposed so as to cover the side faces.

Abstract: A scintillator panel includes: a substrate that includes a principal surface and has transparency to the scintillation light; a scintillator layer that is disposed on the principal surface; a frame member that is disposed on the principal surface so as to surround the scintillator layer when viewed in a direction intersecting the principal surface; a protective layer that is disposed on the principal surface and the scintillator layer and is fixed to the frame member so as to seal the scintillator layer; a sheet-shaped optical functional layer that is disposed between the scintillator layer and the protective layer; and an elastic member that is interposed between the optical functional layer and the protective layer and is elastically deformed.

Abstract: In a scintillator panel, a glass substrate with the thickness of not more than 150 ?m serves as a support body, thereby achieving excellent radiotransparency and flexibility and also relieving a problem of thermal expansion coefficient. Furthermore, in this scintillator panel, an organic resin layer is formed so as to cover a one face side and a side face side of the glass substrate and an organic resin layer is formed so as to cover an other face side and the side face side of the glass substrate on which the organic resin layer is formed. This effectively prevents the edge part from chipping or cracking. Furthermore, stray light can be effectively prevented from entering the side face of the glass substrate and, the entire surface thereof is covered by the organic resin layers, so that warping of the glass substrate can be suppressed.

Abstract: In a scintillator panel, a glass substrate with the thickness of not more than 150 ?m serves as a support body, thereby achieving excellent radiotransparency and flexibility and also relieving a problem of thermal expansion coefficient. Furthermore, in this scintillator panel, an organic resin layer is formed so as to cover a one face side and a side face side of the glass substrate. This reinforces the glass substrate, whereby the edge part thereof can be prevented from chipping or cracking. Furthermore, stray light can be prevented from entering the side face of the glass substrate, while transparency is ensured for light incident to the other face side of the glass substrate because the organic resin layer is not formed on the other face side of the glass substrate.

Abstract: In a scintillator panel, a glass substrate with the thickness of not more than 150 ?m serves as a support body, thereby achieving excellent radiotransparency and flexibility. Furthermore, in this scintillator panel, an organic resin layer is formed so as to cover the entire surface of the glass substrate. This reinforces the glass substrate, whereby the edge part thereof can be prevented from chipping or cracking. Furthermore, stray light can be prevented from entering a side face of the glass substrate and, since the organic resin layer is formed on the entire surface, it becomes feasible to suppress warping of the glass substrate due to internal stress after formation of a scintillator layer.

Abstract: In a scintillator panel, a glass substrate with the thickness of not more than 150 ?m serves as a support body, thereby achieving excellent radiotransparency and flexibility and also relieving a problem of thermal expansion coefficient. Furthermore, in this scintillator panel, an organic resin layer is formed so as to cover a one face side and a side face side of the glass substrate and an organic resin layer is formed so as to cover an other face side and the side face side of the glass substrate on which the organic resin layer is formed. This effectively prevents the edge part from chipping or cracking. Furthermore, stray light can be effectively prevented from entering the side face of the glass substrate and, the entire surface thereof is covered by the organic resin layers, so that warping of the glass substrate can be suppressed.

Abstract: In a scintillator panel, a glass substrate with the thickness of not more than 150 ?m serves as a support body, thereby achieving excellent radiotransparency and flexibility. Furthermore, in this scintillator panel, an organic resin layer is formed so as to cover the entire surface of the glass substrate. This reinforces the glass substrate, whereby the edge part thereof can be prevented from chipping or cracking. Furthermore, stray light can be prevented from entering a side face of the glass substrate and, since the organic resin layer is formed on the entire surface, it becomes feasible to suppress warping of the glass substrate due to internal stress after formation of a scintillator layer.

Abstract: In a scintillator panel, a glass substrate with the thickness of not more than 150 ?m serves as a support body, thereby achieving excellent radiotransparency and flexibility and also relieving a problem of thermal expansion coefficient. Furthermore, in this scintillator panel, an organic resin layer is formed so as to cover a one face side and a side face side of the glass substrate. This reinforces the glass substrate, whereby the edge part thereof can be prevented from chipping or cracking. Furthermore, stray light can be prevented from entering the side face of the glass substrate, while transparency is ensured for light incident to the other face side of the glass substrate because the organic resin layer is not formed on the other face side of the glass substrate.