Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

Abstract: A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.

Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

Abstract: A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.

Abstract: Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased.

Abstract: A printed wiring board for a ball grid array type semiconductor plastic package which has excellent heat diffusibility and causes no popcorn phenomenon, and a metal-plate-inserted printed wiring board having wire bonding pads formed at two levels, for use in the ball grid array type semiconductor plastic package.

Abstract: Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased.

Abstract: Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package. The distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The board has at least two blind via holes in one solder-balls-fixing pad.

Abstract: A method of drilling a through-hole in a printed circuit board panel, which comprises placing a water-soluble lubricant sheet on one surface or each of two surfaces of a printed circuit board panel and drilling a through-hole through the printed circuit board panel, the water-soluble lubricant sheet being composed of a mixture of 20 to 90% by weight of a polyethylene glycol having a weight average molecular weight of not less than 10,000 with 10 to 80% by weight of a water-soluble lubricant and having a thickness of 0.05 to 3 mm.

Abstract: An asbestos-free disc brake pad is provided by employing a cyanate ester-based resin composition as binder. The disc brake pad exhibits consistent braking properties over a wide range of operating temperatures and an improved service life. Also the serious pollution problem due to use of asbestos in the conventional brake pads is removed.

Abstract: A thermosetting resin composition polyfunctional cyanate ester resin composition comprising:(I) a cyanate ester compound selected from the group consisting of a polyfunctional cyanate ester having at least two cyanate esters in its molecule, a prepolymer of such a cyanate ester and mixtures thereof; and(II) at least one non-branched aromatic compound in an amount of 5-40% by weight of the total resin composition, said aromatic compound having a number-average molecular weight of 178-800, an average number of aromatic nuclei of 2-6, and a boiling point of more than 300.degree. C., and in which the portion having aromatic nuclei of 2-6 constitutes more than 50% is disclosed.

Abstract: A process for producing a polyfunctional cyanate ester polymer which comprises heating at least one polyfunctional cyanate ester compound having the formula:R--OCN).sub.mwherein m is an integer of at least 2 and R is one or more aromatic organic groups, and the cyanato groups are bonded to the arylene ring, in the presence of a catalytic amount of a dialkyl tin oxide having the formula:R.sup.1 R.sup.2 SnOwherein each of R.sup.1 and R.sup.2 is C.sub.1 -C.sub.30 alkyl is disclosed.

Abstract: A stabilized polyolefin resin composition in which (a) 0.005-5% by weight of at least one monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in its molecule, (b) 0.01-5% by weight of at least one hindered amine ultraviolet absorber and (c) 0.005-2% by weight of at least one hindered phenolic antioxidant are incorporated into a polyolefin resin is disclosed. The resin composition has excellent heat stability and resistance to weathering.

Abstract: There is disclosed a thermosetting resin composition comprising a thermosetting cyanate ester resin composition (A) and a butadiene based copolymer (B)(i) or an epoxy resin-modified butadiene based copolymer (B)(ii), in which said component (B)(i) or (B)(ii) are used for modifying said component (A), component (A) and (B) being as follows;(A) a cyanate ester thermosetting resin composition comprising a cyanate ester compound selected from the group consisting of,(i) a polyfunctional cyanate ester having at least two cyanate group in its molecule,(ii) prepolymer of the cyanate ester of (i),(iii) coprepolymer of the cyanate ester of (i) and an amine, and(iv) mixtures thereof, and optionally adding another thermosetting resin,(B)(i) a butadiene based copolymer comprising a butadienaromatic vinytl monomer copolymer having 0.

Abstract: A method for producing a rigid resin mold for preparing plastic moldings which comprises:(1) preparing a composition (I) consisting essentially of(A) a cyanate ester resin composition, and(B-1) a metallic substance which does not substantially accelerate gelation of the cyanate ester resin composition (A),(2) preparing a composition (II) consisting essentially of(C) epoxy resin, and(B-2) a metallic substance which accelerates gelation of the cyanate ester resin composition (A) and does not substantially accelerate gelation of the epoxy resin (C) at temperatures below or equal to 100.degree. C.,(3) mixing composition (I) of step (1) and composition (II) of step (2) to form composition (III),(4) casting composition (III) of step (3) into a mold(5) and gelling the cast resin.

Abstract: An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.nwherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

Abstract: An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.nwherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

Abstract: A process for producing a curable resin liquid comprising: (a) at least one cyanate ester compound and (b) at least one polyfunctional maleimide compound, characterized in that the process comprises:(A) reacting at least one said maleimide compound with said diamine in the presence of a diluent at a temperature of 60.degree.-200.degree. C., the ratio of the maleimide group to the amine group being in the range of from 1:0.0015 to 1:0.3 to form a preliminary reaction product substantially free from amine group; and(B) mixing said preliminary reaction product with at least one cyanate ester compound ratio by weight of said preliminary reaction product to said cyanate ester compound is disclosed.

Abstract: A process for producing a curable resin which comprises reacting (a) at least one cyanate ester compound selected from the group consisting of polyfunctional cyanate esters having two or more cyanato groups per one molecule, prepolymers of the cyanate esters or mixtures thereof with (b) at least one compound having hydroxy group(s) and radical-polymerizable unsaturated double bond(s) in its molecule, the cyanate ester compound (a) and the compound (b) being used so that the ratio of the cyanato group to the hydroxy is in the range of from about 1:0.1 to about 1:2, in the presence of (c) a radical polymerization inhibitor at a temperature of about 80.degree.-about 140.degree. C.The curable resin produced according to the present invention is capable of giving cured products having excellent heat resistance and electrical properties.