Abstract: A robotic working apparatus includes: a working robot configured to perform work while autonomously traveling in a set working area; and a controller configured to control motion of the working robot and including a working area setting section configured to partition and set the working area. The working area setting section sets an individual enclosed area overlapping with an existing working area.

Abstract: Provided are: a curable fluoropolyether-based rubber composition from which a cured product having good light transmissivity and excellent rubber strength is produced; and an optical component having a cured product layer of said composition. The curable fluoropolyether-based rubber composition contains: (A) a linear polyfluoro compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure in a main chain; (B) a fluorine-containing organohydrogen siloxane which has at least two hydrogen atoms directly bonded to a silicon atom (SiH group) and has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group or a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group in one molecule; (C) sodium fluoride; and (D) a platinum group metal-based catalyst in an amount of 0.1-2,000 ppm in terms of the mass of a platinum group metal atom with respect to component (A).

Abstract: This perfluoropolyether-based adhesive composition contains: (A) a linear perfluoropolyether compound containing two or more alkenyl groups in one molecule and having a number average molecular weight of 2,000 or more and a weight loss ratio of 1% or less when heated at 150° C. for 1 hour; (B) a fluorine-containing organohydrogenpolysiloxane compound which contains at least one fluorine-containing organic group, and does not contain an epoxy group and a trialkoxysilyl group, and which has a number average molecular weight of 1,000-4,000 and a weight loss ratio of 20% or less when heated at 150° C.

Abstract: A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chain, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluorooxyalkyl group, a perfluoroalkylene group or a perfluorooxyalkylene group and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom, (C) a platinum-group metal catalyst, and (D) a cyclic organopolysiloxane having, per molecule, an SiH group and an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group optionally containing an oxygen atom, and not having fluorine in molecule, and a cured product of which having a thickness of 2 mm shows a transmittance to light with a wavelength of 500 nm of 80% or higher.

Abstract: This curable fluoropolyether adhesive composition contains specific amounts of (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule, and having a perfluoropolyether structure in the main chain thereof, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluoro oxyalkyl group, a perfluoro alkylene group, or perfluoro oxyalkylene group, and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom. (C) sodium fluoride. (D) a platinum-group metal catalyst, and (E) an organopolysiloxane having, per molecule, a SiH group, a perfluoroalkyl group or a perfluoro oxyalkyl group, and an epoxy group and/or a trialkoxysilyl group. A cured product of the composition has good light transmission properties and good adhesion properties, and excellent rubber strength.

Abstract: Provided are: a curable fluoropolyether-based rubber composition from which a cured product having good light transmissivity and excellent rubber strength is produced; and an optical component having a cured product layer of said composition. The curable fluoropolyether-based rubber composition contains: (A) a linear polyfluoro compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure in a main chain; (B) a fluorine-containing organohydrogen siloxane which has at least two hydrogen atoms directly bonded to a silicon atom (SiH group) and has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group or a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group in one molecule; (C) sodium fluoride; and (D) a platinum group metal-based catalyst in an amount of 0.1-2,000 ppm in terms of the mass of a platinum group metal atom with respect to component (A).

Abstract: Provided are a heat-curable fluoropolyether-based adhesive composition capable of being cured and adhering to various kinds of base materials made of, for example, a metal, ceramic and/or plastic in a short period of time; and an electric/electronic component employing the same. The composition is a heat-curable fluoropolyether-based adhesive composition having, as an adhesion imparting agent, an alicyclic epoxy group-containing and fluorine-containing organohydrogensiloxane having in one molecule: a monovalent perfluoroalkyl or perfluorooxyalkyl group(s), or a divalent perfluoroalkylene or perfluorooxyalkylene group(s); and at least one silicon atom-bonded hydrogen atom (SiH group).

Abstract: Provided are a heat-curable fluoropolyether-based adhesive composition capable of being cured and adhering to various kinds of base materials made of, for example, a metal, ceramic and/or plastic in a short period of time; and an electric/electronic component employing the same. The composition is a heat-curable fluoropolyether-based adhesive composition having, as an adhesion imparting agent, an alicyclic epoxy group-containing and fluorine-containing organohydrogensiloxane having in one molecule: a monovalent perfluoroalkyl or perfluorooxyalkyl group(s), or a divalent perfluoroalkylene or perfluorooxyalkylene group(s); and at least one silicon atom-bonded hydrogen atom (SiH group).

Abstract: A heat-conductive fluorinated curable composition is provided comprising (A) an alkenyl-containing linear polyfluoro compound, (B) a fluorinated organohydrogensiloxane having a fluorinated organic group and SiH groups, (C) a platinum catalyst, (D) a heat-conductive filler, and (E) a fluorinated organosilicon compound having a fluorinated organic group and an alkoxy group. The composition allows for heavy loading of the heat-conductive filler and cures into a cured product having improved oil resistance and thermal conductivity.

Abstract: A heat-conductive fluorinated curable composition is provided comprising (A) an alkenyl-containing linear polyfluoro compound, (B) a fluorinated organohydrogensiloxane having a fluorinated organic group and SiH groups, (C) a platinum catalyst, (D) a heat-conductive filler, and (E) a fluorinated organosilicon compound having a fluorinated organic group and an alkoxy group. The composition allows for heavy loading of the heat-conductive filler and cures into a cured product having improved oil resistance and thermal conductivity.

Abstract: The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3.

Abstract: There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.

Abstract: The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3.

Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.

Abstract: A fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane containing at least two SiH groups, but not alkoxy and epoxy groups, (C) a platinum group metal-based catalyst, (D) an organosilicon compound having at least one silicon-bonded alkoxy group, and (E) a hydrolytic catalyst can be cured to metal and plastic substrates through addition reaction.

Abstract: There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.

Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.

Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.

Abstract: A fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane containing at least two SiH groups, but not alkoxy and epoxy groups, (C) a platinum group metal-based catalyst, (D) an organosilicon compound having at least one silicon-bonded alkoxy group, and (E) a hydrolytic catalyst can be cured to metal and plastic substrates through addition reaction.

Abstract: A light-emitting device has a light-emitting diode embedded in a resin encapsulant. The resin encapsulant is obtained by curing a curable composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups in the molecule and a perfluoropolyether structure in the backbone, (B) a fluorinated organohydrogensiloxane having at least two SiH groups in the molecule, (C) a platinum group metal catalyst, and (D) a silica powder. The light-emitting device maintains an emission capability without a loss of intensity even in the presence of corrosive sulfur compound and nitrogen oxide gases.