Patents by Inventor Hidenori Maeda

Hidenori Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12113089
    Abstract: To prevent leakage of incident light from pixels around a pixel region (11) of a light receiving element. A light receiving element includes a pixel region and an adjacent pixel (400). In the pixel region, a plurality of pixels (100) is arranged, the plurality of pixels including a photodiode formed in a semiconductor substrate (110) in which a charge generated by photoelectric conversion of incident light is multiplied with a high reverse bias voltage, an on-chip lens (160) that focuses the incident light on the photodiode, and a wiring region (120) having a wiring layer (122) connected to the photodiode and an insulating layer (121) that insulates the wiring layer. The adjacent pixel is arranged adjacent to the pixel region and includes the photodiode, an on-chip lens (161) having a curvature different from a curvature of the on-chip lens, and the wiring region.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: October 8, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Daisuke Washio, Masahiko Tsujita, Hidenori Maeda
  • Publication number: 20240332337
    Abstract: To prevent leakage of incident light from pixels around a pixel region of a light receiving element. A light receiving element includes a pixel region and an adjacent pixel. In the pixel region, a plurality of pixels is arranged, the plurality of pixels including a photodiode formed on a semiconductor substrate in which a charge generated by photoelectric conversion of incident light is multiplied with a high reverse bias voltage, an on-chip lens that focuses the incident light on the photodiode, and a wiring region having a wiring layer connected to the photodiode and an insulating layer that insulates the wiring layer. The adjacent pixel is arranged adjacent to the pixel region and includes the photodiode, an on-chip lens having a curvature different from a curvature of the on-chip lens, and the wiring region.
    Type: Application
    Filed: June 11, 2024
    Publication date: October 3, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Daisuke WASHIO, Masahiko TSUJITA, Hidenori MAEDA
  • Publication number: 20230178576
    Abstract: A light receiving element includes pixels, a wiring region, and a separation region. The pixels have photoelectric conversion units, each photoelectric conversion unit being disposed in a semiconductor substrate to perform photoelectric conversion of incident light. The wiring region has a wiring layer that is connected to the photoelectric conversion unit to transmit a signal and an insulating layer that insulates the wiring layer, the wiring region being disposed adjacent to a front surface opposite to a back surface which is a surface on which the incident light is incident in the semiconductor substrate. The separation region is disposed in the semiconductor substrate at a boundary between the pixels, is formed in a shape which penetrates the semiconductor substrate and in which a width on the front surface side is wider than a width on the back surface side, and separates the photoelectric conversion units from each other.
    Type: Application
    Filed: February 8, 2021
    Publication date: June 8, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hidenori MAEDA, Kenzo ISHIBASHI
  • Patent number: 11671726
    Abstract: Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: June 6, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroshi Takahashi, Ryoichi Nakamura, Hidenori Maeda
  • Publication number: 20220399390
    Abstract: To prevent leakage of incident light from pixels around a pixel region (11) of a light receiving element. A light receiving element includes a pixel region and an adjacent pixel (400). In the pixel region, a plurality of pixels (100) is arranged, the plurality of pixels including a photodiode formed in a semiconductor substrate (110) in which a charge generated by photoelectric conversion of incident light is multiplied with a high reverse bias voltage, an on-chip lens (160) that focuses the incident light on the photodiode, and a wiring region (120) having a wiring layer (122) connected to the photodiode and an insulating layer (121) that insulates the wiring layer. The adjacent pixel is arranged adjacent to the pixel region and includes the photodiode, an on-chip lens (161) having a curvature different from a curvature of the on-chip lens, and the wiring region.
    Type: Application
    Filed: April 6, 2020
    Publication date: December 15, 2022
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Daisuke WASHIO, Masahiko TSUJITA, Hidenori MAEDA
  • Publication number: 20220337773
    Abstract: Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: HIROSHI TAKAHASHI, RYOICHI NAKAMURA, HIDENORI MAEDA
  • Patent number: 11405569
    Abstract: Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: August 2, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroshi Takahashi, Ryoichi Nakamura, Hidenori Maeda
  • Publication number: 20210280622
    Abstract: Providing a SPAD photodiode that accurately captures a subject regardless of long distance or short distance. A solid-state imaging apparatus (1000) according to the present disclosure includes: a pixel isolator (100) that defines a photoelectric conversion region (200) for each pixel; a first semiconductor layer (106) provided in the photoelectric conversion region; and a second semiconductor layer (108) to which a voltage for electron multiplication is applied, specifically between the first semiconductor layer and the second semiconductor layer, in which the sensitivities of the plurality of pixels are varied. With this configuration, it is possible to accurately capture a subject in the SPAD photodiode regardless of long distance or short distance.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 9, 2021
    Inventors: HIDENORI MAEDA, TOSHIFUMI WAKANO, YUSUKE OTAKE
  • Publication number: 20200177829
    Abstract: [Problem] Provided is a solid-state imaging device with a higher degree of freedom of the size and layout of chips to be laminated. [Solution] The solid-state imaging device includes: a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed; a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided; and at least one sub-chip which is provided inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
    Type: Application
    Filed: June 21, 2018
    Publication date: June 4, 2020
    Inventors: HIROSHI TAKAHASHI, RYOICHI NAKAMURA, HIDENORI MAEDA
  • Patent number: 7613331
    Abstract: A server unit (400) recognizes a travel route search request together with a current position information and a destination information from a terminal unit (300) over a network (200) and searches for a travel route with use of a matching data of a map information. The server unit (400) sends a matching mesh information including a node and link that represent a road corresponding to the travel route and a display mesh information for areas other than the areas represented by the matching mesh information together with the information for the travel route to the terminal unit (300) over the network (200). The terminal unit (300) displays a road based on the matching mesh information and the information excluding the road based on the display mesh information on a terminal display. Thus, the information amount of the map information to be processed can be reduced thereby improving the processing efficiency.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: November 3, 2009
    Assignee: Increment P Corporation
    Inventor: Hidenori Maeda
  • Patent number: 7136744
    Abstract: Provided is a navigation system that can realize preferable navigation. A server unit (400) recognizes current position information and destination information sent from a terminal unit (300) over a network (200) and searches for a travel route utilizing matching data in map information. The server unit (400) sends matching mesh information and a travel route to the terminal unit (300), the matching mesh information including nodes and links that represent a road corresponding to the travel route. The terminal unit (300) navigates a vehicle on the basis of the current position information, the matching mesh information, and information on the travel route. When the current position is off the travel route, the terminal unit (300) performs rerouting on the basis of the matching mesh information that has been acquired. If the terminal unit (300) can not perform rerouting, the server unit (400) performs rerouting. Thus, prompt and smooth navigation based on a new travel route can be achieved.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: November 14, 2006
    Assignee: Increment P Corporation
    Inventor: Hidenori Maeda
  • Publication number: 20040172189
    Abstract: Provided is a navigation system that can realize preferable navigation. A server unit (400) recognizes current position information and destination information sent from a terminal unit (300) over a network (200) and searches for a travel route utilizing matching data in map information. The server unit (400) sends matching mesh information and a travel route to the terminal unit (300), the matching mesh information including nodes and links that represent a road corresponding to the travel route. The terminal unit (300) navigates a vehicle on the basis of the current position information, the matching mesh information, and information on the travel route. When the current position is off the travel route, the terminal unit (300) performs rerouting on the basis of the matching mesh information that has been acquired. If the terminal unit (300) can not perform rerouting, the server unit (400) performs rerouting. Thus, prompt and smooth navigation based on a new travel route can be achieved.
    Type: Application
    Filed: December 17, 2003
    Publication date: September 2, 2004
    Applicant: INCREMENT P CORPORATION
    Inventor: Hidenori Maeda
  • Publication number: 20040151388
    Abstract: A server unit (400) recognizes a travel route search request together with a current position information and a destination information from a terminal unit (300) over a network (200) and searches for a travel route with use of a matching data of a map information. The server unit (400) sends a matching mesh information including a node and link that represent a road corresponding to the travel route and a display mesh information for areas other than the areas represented by the matching mesh information together with the information for the travel route to the terminal unit (300) over the network (200). The terminal unit (300) displays a road based on the matching mesh information and the information excluding the road based on the display mesh information on a terminal display. Thus, the information amount of the map information to be processed can be reduced thereby improving the processing efficiency.
    Type: Application
    Filed: January 21, 2004
    Publication date: August 5, 2004
    Applicant: INCREMENT P CORPORATION
    Inventor: Hidenori Maeda
  • Patent number: 5402283
    Abstract: A hand mechanism of an accessor, capable of gripping a recording medium cartridge in a horizontal condition thereof. The accessor automatically exchanges the recording medium cartridge between a cell unit having a plurality of cells each accommodating the recording medium cartridge and a recording medium drive unit for performing read/write of data from/to the recording medium cartridge. The hand mechanism includes a base mounted swingably about a vertical axis, a grip hand mounted on the base movably between an advanced position and a retracted position, for gripping the cartridge, and a tray mounted on the base and under the grip hand movably between an advanced position projecting from the base and a retracted position. The hand mechanism further includes a cartridge gripped condition correcting mechanism for correcting a gripped condition of the cartridge gripped by the grip hand.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: March 28, 1995
    Assignees: Fujitsu Limited, Copal Company Limited
    Inventors: Kengo Yamakawa, Hiroshi Shibuya, Hiroyuki Sugihara, Hidenori Maeda, Kohjiroh Hashimoto
  • Patent number: 4907178
    Abstract: A method of detecting a reference angular position of a rotary body. Two detectable portions are spaced apart from each about the periphery by a predetermined angle in the rotational direction thereof. Two detection signals and produced from two detectors spaced apart from each other by the same angular distance as the detectable portions in the rotational direction of the rotary body in the vicinity of the locus of the detectable portions. It is first detected that at least one of the detectors produces a detection signal and thereafter it is determined that the rotary body takes a reference angular position when both of the detectors produce the detection signals.
    Type: Grant
    Filed: March 14, 1988
    Date of Patent: March 6, 1990
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Shindengen Kogyo Kabushiki Kaisha
    Inventors: Sumitaka Ogawa, Masami Kawabe, Masanori Nakamura, Hidenori Maeda, Yoshio Morita
  • Patent number: 4827891
    Abstract: An ignition apparatus of a capacitor discharge ignition type comprises: an ignition timing signal generator to generate an ignition timing signal synchronized with the rotation of the engine; a capacitor; a blocking oscillator; a rectifier for rectifying the output voltage of the blocking oscillator and applying the rectified voltage to the capacitor thereby charging the capacitor; a switching device which is turned on in response to the ignition timing signal and discharges the stored charges of the capacitor, thereby generating a pulse voltage across the terminals of the primary winding of an ignition coil; and an ignition plug to generate a spark discharge by a high voltage generated in the secondary winding of the ignition coil. The blocking oscillator oscillates concurrently with the engine rotation. When the ignition timing signal is generated, the oscillation of the blocking oscillator is stopped in accordance with a phase of the output voltage of the AC generator.
    Type: Grant
    Filed: August 6, 1987
    Date of Patent: May 9, 1989
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Shindengen Kogyo Kabushiki Kaisha
    Inventors: Nobuo Miura, Hitoshi Nakayama, Nolihisa Ishii, Hidenori Maeda
  • Patent number: D766143
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 13, 2016
    Assignees: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA, MITSUBISHI JIDOSHA ENGINEERING KABUSHIKI KAISHA
    Inventor: Hidenori Maeda
  • Patent number: D767802
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 27, 2016
    Assignees: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA, MITSUBISHI JIDOSHA ENGINEERING KABUSHIKI KAISHA
    Inventor: Hidenori Maeda