Patents by Inventor Hidenori Miyakawa
Hidenori Miyakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11293583Abstract: Heat-insulation materials that can be placed along the lines of heat sources, heat-insulation structures using the same, and processes for producing the same. A heat-insulation material, that includes: fiber sheets that each have fibers and an aerogel and that have different sizes; and at least one covering material that covers the fiber sheets, or at least one elastic material that includes the fiber sheets. The at least one covering material may include a first covering material and a second covering material.Type: GrantFiled: February 14, 2018Date of Patent: April 5, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Daido Kohmyohji, Kazuma Oikawa, Takashi Tsuruta, Tooru Wada, Shigeaki Sakatani, Hidenori Miyakawa
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Patent number: 10407604Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 ?m to 20 ?m; and a filler having a grain diameter of 15 ?m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 ?m to 20 ?m.Type: GrantFiled: May 7, 2015Date of Patent: September 10, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Honami Nawa, Hirohisa Hino, Arata Kishi, Naomichi Ohashi, Yasuhiro Suzuki, Hidenori Miyakawa
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Publication number: 20180245731Abstract: Heat-insulation materials that can be placed along the lines of heat sources, heat-insulation structures using the same, and processes for producing the same. A heat-insulation material, that includes: fiber sheets that each have fibers and an aerogel and that have different sizes; and at least one covering material that covers the fiber sheets, or at least one elastic material that includes the fiber sheets. The at least one covering material may include a first covering material and a second covering material.Type: ApplicationFiled: February 14, 2018Publication date: August 30, 2018Inventors: DAIDO KOHMYOHJI, KAZUMA OIKAWA, TAKASHI TSURUTA, TOORU WADA, SHIGEAKI SAKATANI, HIDENORI MIYAKAWA
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Publication number: 20150327393Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 ?m to 20 ?m; and a filler having a grain diameter of 15 ?m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 ?m to 20 ?m.Type: ApplicationFiled: May 7, 2015Publication date: November 12, 2015Inventors: Honami NAWA, Hirohisa HINO, Arata KISHI, Naomichi OHASHI, Yasuhiro SUZUKI, Hidenori MIYAKAWA
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Patent number: 9072204Abstract: An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.Type: GrantFiled: July 15, 2010Date of Patent: June 30, 2015Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Ryo Kuwabara, Atsushi Yamaguchi, Masahiro Ono, Hidenori Miyakawa
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Patent number: 8697237Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.Type: GrantFiled: April 29, 2013Date of Patent: April 15, 2014Assignee: Panasonic CorporationInventors: Hirohisa Hino, Taro Fukui, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi
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Patent number: 8679635Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.Type: GrantFiled: September 14, 2012Date of Patent: March 25, 2014Assignee: Panasonic CorporationInventors: Atsushi Yamaguchi, Kazuhiro Nishikawa, Hidenori Miyakawa
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Publication number: 20130344369Abstract: A secondary battery unit arranged within a heat source unit that is internally provided with a heat source. The secondary battery unit comprises: a secondary battery; a heat transfer material layer which is arranged so as to contact the outer peripheral surface of the secondary battery; a heating device which is arranged to heat the secondary battery with the heat transfer material layer therebetween; a heat insulation material layer which is arranged on the outer peripheries of the heat transfer material layer and the heating device so as to face the heat source and which has a lower thermal conductivity and a shorter length than the heat transfer material layer; and a heat dissipation part which contacts the heat transfer material layer and an external heat dissipation part of the heat source unit and dissipates the heat from the secondary battery to the outside of the heat source unit.Type: ApplicationFiled: October 29, 2012Publication date: December 26, 2013Applicant: PANASONIC CORPORATIONInventors: Hidenori Miyakawa, Masahiro Ono, Tsuyoshi Nomura
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Patent number: 8540903Abstract: Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.Type: GrantFiled: November 21, 2008Date of Patent: September 24, 2013Assignee: Panasonic CorporationInventors: Takayuki Higuchi, Hidenori Miyakawa, Atsushi Yamaguchi, Arata Kishi, Naomichi Ohashi
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Publication number: 20130237645Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.Type: ApplicationFiled: April 29, 2013Publication date: September 12, 2013Applicant: PANASONIC CORPORATIONInventors: Hirohisa Hino, Taro Fukui, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi
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Patent number: 8482931Abstract: A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.Type: GrantFiled: December 7, 2009Date of Patent: July 9, 2013Assignee: Panasonic CorporationInventors: Ryo Kuwabara, Koso Matsuno, Atsushi Yamaguchi, Hidenori Miyakawa
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Patent number: 8481629Abstract: A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 ?m, and the second filler has a largest particle size of 1 to 100 ?m, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.Type: GrantFiled: April 28, 2009Date of Patent: July 9, 2013Assignee: Panasonic CorporationInventors: Ryo Kuwabara, Atsushi Yamaguchi, Hidenori Miyakawa
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Patent number: 8450859Abstract: A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.Type: GrantFiled: October 27, 2009Date of Patent: May 28, 2013Assignee: Panasonic CorporationInventors: Naomichi Ohashi, Shigeaki Sakatani, Arata Kishi, Atsushi Yamaguchi, Hidenori Miyakawa
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Patent number: 8410377Abstract: A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.Type: GrantFiled: October 29, 2008Date of Patent: April 2, 2013Assignee: Panasonic CorporationInventors: Atsushi Yamaguchi, Hidenori Miyakawa, Shigeaki Sakatani, Koso Matsuno
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Patent number: 8378472Abstract: In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.Type: GrantFiled: October 16, 2008Date of Patent: February 19, 2013Assignee: Panasonic CorporationInventors: Koso Matsuno, Atsushi Yamaguchi, Shigeaki Sakatani, Hidenori Miyakawa, Mikiya Ueda
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Publication number: 20130037314Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.Type: ApplicationFiled: September 14, 2012Publication date: February 14, 2013Inventors: Atsushi Yamaguchi, Kazuhiro Nishikawa, Hidenori Miyakawa
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Patent number: 8345444Abstract: A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.Type: GrantFiled: October 21, 2008Date of Patent: January 1, 2013Assignee: Panasonic CorporationInventors: Shigeaki Sakatani, Koso Matsuno, Atsushi Yamaguchi, Hidenori Miyakawa, Mikiya Ueda
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Patent number: 8344268Abstract: An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.Type: GrantFiled: July 1, 2009Date of Patent: January 1, 2013Assignee: Panasonic CorporationInventors: Hideyuki Tsujimura, Hidenori Miyakawa, Atsushi Yamaguchi, Hiroe Kowada, Koso Matsuno
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Patent number: 8293370Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.Type: GrantFiled: August 3, 2007Date of Patent: October 23, 2012Assignee: Panasonic CorporationInventors: Atsushi Yamaguchi, Kazuhiro Nishikawa, Hidenori Miyakawa
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Patent number: 8217275Abstract: A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ?E/?T in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ?E/?T represents a ratio of change (?E) in storage elastic modulus (E) relative to a temperature change (?T) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.Type: GrantFiled: December 3, 2007Date of Patent: July 10, 2012Assignee: Panasonic CorporationInventors: Atsushi Yamaguchi, Hidenori Miyakawa, Kousou Matsuno