Patents by Inventor Hidenori Taguchi

Hidenori Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10918456
    Abstract: There is provided a protective cover including: an installation section configured to be installed on an arm that supports an imaging device, the arm including a plurality of links joined to each other by one or a plurality of joint sections; and a protective section configured to cover the imaging device.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 16, 2021
    Assignee: SONY OLYMPUS MEDICAL SOLUTIONS INC.
    Inventors: Gakuji Higuchi, Yasuhiro Okabe, Hidenori Taguchi
  • Publication number: 20200407425
    Abstract: The present invention provides a method of stabilizing a protein. The method includes a step of causing a protein contained in a specimen derived from a living body to coexist with an arylboronic acid. The protein contained in the specimen derived from the living body is at least one type selected from the group consisting of hemoglobin, haptoglobin, and a hemoglobin-haptoglobin complex. According to the present invention, it is possible to stabilize a protein such as a blood protein contained in the specimen derived from a living body. The present invention further provides a stabilizing solution for stabilizing a protein contained in a specimen derived from a living body and a method and a kit for detecting a protein contained in a specimen derived from a living body.
    Type: Application
    Filed: February 28, 2019
    Publication date: December 31, 2020
    Applicant: EIKEN KAGAKU KABUSHIKI KAISHA
    Inventors: Nozomi SAKAMAKI, Hidenori TAGUCHI, Mitsuru MAKINODAN, Miyu YAMADA
  • Publication number: 20200015655
    Abstract: A medical observation apparatus includes: an imaging unit which acquires captured video data, the captured video data being data of a captured video obtained by capturing an image of an observation target; a supporting unit which supports the imaging unit; a trigger operation detecting unit which detects a trigger operation, the trigger operation being a predetermined operation associated with an operation of the imaging unit; a surgical tool recognizing unit which recognizes a form of a surgical tool included in the captured video based on the captured video data; and an observation visual field correcting unit which corrects an observation visual field based on the form of the surgical tool recognized by the surgical tool recognizing unit when the trigger operation is detected by the trigger operation detecting unit, the observation visual field being a range of a displayed video on a display device based on the captured video data.
    Type: Application
    Filed: January 15, 2018
    Publication date: January 16, 2020
    Applicant: Sony Olympus Medical Solutions Inc.
    Inventor: Hidenori TAGUCHI
  • Patent number: 10483666
    Abstract: A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways each extending through the housing and having an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on the first surface of the housing that is electrically continuous with the conductive material of the inner wall surface. Each of the contacts includes a contact portion positioned above the first surface of the housing and configured to be elastically deformed by a contact pad electrically connected with the contact, an insertion portion inserted into one of the passageways and configured to be elastically deformed and pressed by the inner wall surface of the passageway, and a joint portion joined to the conductive pad.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 19, 2019
    Assignee: Tyco Electronics Japan G.K.
    Inventor: Hidenori Taguchi
  • Patent number: 10461447
    Abstract: A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways. Each passageway extends through the housing and has an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on a second surface of the housing so as to correspond to one of the passageways. The conductive pad is electrically continuous with the conductive material of the inner wall surface of the passageway and extends from the passageway. The housing also has a solder ball attached to the conductive pad. Each of the contacts corresponds to one of the plurality of passageways and is electrically connected to both the conductive material of the inner wall surface of the passageway and a contact pad of an electronic component.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 29, 2019
    Assignee: Tyco Electronics Japan G.K.
    Inventor: Hidenori Taguchi
  • Publication number: 20180338813
    Abstract: There is provided a medical observation apparatus including: an imaging control section that controls a zoom function of an imaging device on a basis of a first toggle operation that toggles from a mode that controls an optical zoom to a mode that controls an electronic zoom. The imaging control section controls the zoom function so that the electronic zoom is executed on a predetermined region in a medical captured image captured by the imaging device, at an optical magnification of an optical system of the imaging device corresponding to when the first toggle operation was detected.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 29, 2018
    Applicant: Sony Olympus Medical Solutions Inc.
    Inventor: Hidenori TAGUCHI
  • Publication number: 20180287279
    Abstract: A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways each extending through the housing and having an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on the first surface of the housing that is electrically continuous with the conductive material of the inner wall surface. Each of the contacts includes a contact portion positioned above the first surface of the housing and configured to be elastically deformed by a contact pad electrically connected with the contact, an insertion portion inserted into one of the passageways and configured to be elastically deformed and pressed by the inner wall surface of the passageway, and a joint portion joined to the conductive pad.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 4, 2018
    Applicant: Tyco Electronics Japan G.K.
    Inventor: Hidenori Taguchi
  • Publication number: 20180287276
    Abstract: A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways. Each passageway extends through the housing and has an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on a second surface of the housing so as to correspond to one of the passageways. The conductive pad is electrically continuous with the conductive material of the inner wall surface of the passageway and extends from the passageway. The housing also has a solder ball attached to the conductive pad. Each of the contacts corresponds to one of the plurality of passageways and is electrically connected to both the conductive material of the inner wall surface of the passageway and a contact pad of an electronic component.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 4, 2018
    Applicant: Tyco Electronics Japan G.K.
    Inventor: Hidenori Taguchi
  • Publication number: 20180221106
    Abstract: There is provided a protective cover including: an installation section configured to be installed on an arm that supports an imaging device, the arm including a plurality of links joined to each other by one or a plurality of joint sections; and a protective section configured to cover the imaging device.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 9, 2018
    Applicant: Sony Olympus Medical Solutions Inc.
    Inventors: Gakuji HIGUCHI, Yasuhiro OKABE, Hidenori TAGUCHI
  • Patent number: 8152553
    Abstract: A socket contact that makes contact with a lead pin is provided on a mating electronic component, wherein this socket contact comprises a retention section that is press-fit in a contact cavity provided in a housing, a base section that extends downward from this retention section, and a pair of resilient contact pieces that extend from either side edge of this base section in mutually facing directions. The paired resilient contact pieces respectively comprise end sections that extend backward from the side edges of the base section, and lead pin contact sections that extend upward and forward at an inclination from the rear ends of the base section and that are also formed with an inclination so as to approach each other toward the tip ends thereof, and after the lead pin is inserted into the contact cavity toward the rear ends of the base end parts, the lead pin moves forward so as to contact the lead pin contact section in a position to the rear side of the retention section.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: April 10, 2012
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Hidenori Taguchi, Shinichi Hashimoto
  • Patent number: 7883352
    Abstract: An integrated circuit socket includes an insulating housing having a plurality of contact openings arranged in rows and a recess that receives an integrated circuit package. A plurality of contacts arranged in a first contact group and a second contact group in the insulating housing. Each of the contacts has a flat plate fixing member fixed in the contact opening, a connecting member extending from a lower portion of the fixing member, and a spring member extending diagonally upward from an upper portion of the fixing member. The spring member has a contact member extending into the recess. The contacts are arranged in the contact openings such that the spring members are arranged at an angle offset from a direction of arrangement of the rows and the spring arms of the first contact group are arranged in a direction opposing the spring arms of the second contact group.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: February 8, 2011
    Assignee: Tyco Electronics Japan G. K.
    Inventors: Hidenori Taguchi, Shinichi Hashimoto
  • Patent number: 7744396
    Abstract: An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: June 29, 2010
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Hidenori Taguchi, Shinichi Hashimoto
  • Publication number: 20090286417
    Abstract: An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.
    Type: Application
    Filed: July 3, 2006
    Publication date: November 19, 2009
    Inventors: Hidenori Taguchi, Shinichi Hashimoto
  • Publication number: 20090280690
    Abstract: An integrated circuit socket includes an insulating housing having a plurality of contact openings arranged in rows and a recess that receives an integrated circuit package. A plurality of contacts arranged in a first contact group and a second contact group in the insulating housing. Each of the contacts has a flat plate fixing member fixed in the contact opening, a connecting member extending from a lower portion of the fixing member, and a spring member extending diagonally upward from an upper portion of the fixing member. The spring member has a contact member extending into the recess. The contacts are arranged in the contact openings such that the spring members are arranged at an angle offset from a direction of arrangement of the rows and the spring arms of the first contact group are arranged in a direction opposing the spring arms of the second contact group.
    Type: Application
    Filed: September 12, 2006
    Publication date: November 12, 2009
    Applicant: TYCO ELECTRONICS AMP K.K.
    Inventors: Hidenori Taguchi, Shinichi Hashimoto
  • Publication number: 20090215291
    Abstract: A socket contact that makes contact with a lead pin is provided on a mating electronic component, wherein this socket contact comprises a retention section that is press-fit in a contact cavity provided in a housing, a base section that extends downward from this retention section, and a pair of resilient contact pieces that extend from either side edge of this base section in mutually facing directions. The paired resilient contact pieces respectively comprise end sections that extend backward from the side edges of the base section, and lead pin contact sections that extend upward and forward at an inclination from the rear ends of the base section and that are also formed with an inclination so as to approach each other toward the tip ends thereof, and after the lead pin is inserted into the contact cavity toward the rear ends of the base end parts, the lead pin moves forward so as to contact the lead pin contact section in a position to the rear side of the retention section.
    Type: Application
    Filed: February 20, 2009
    Publication date: August 27, 2009
    Inventors: Hidenori Taguchi, Shinichi Hashimoto
  • Patent number: 7189087
    Abstract: A card connector comprises a main body having a first card accommodating space and a first spring attachment member. An ejection mechanism includes a push block, an ejection bar, and a positioning block. The push block has a second spring attachment member and an abutment member. The abutment member extends into the first card accommodating space for engagement with a card. The positioning block has first and second guide grooves. The ejection bar has a first end attached to the push block and a second end positioned in the first or second guide groove. The second end is capable of following the first and second guide grooves to move the positioning block relative to the push block during insertion and ejection of the card. A spring extends between the first and spring attachment members and biases the push block during insertion and ejection of the card.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: March 13, 2007
    Assignee: Tyco Electronics AMP K.K.
    Inventor: Hidenori Taguchi
  • Patent number: 7005463
    Abstract: A simulated wood product is molded by either extrusion or injection molding. This product has pulverized powders obtained from recycled building members. These members include recycled wooden members made of wooden materials and recycled resinous members also made of wooden materials. The pulverized powders include recycled wooden members and recycled resinous members in a mixed state by mixing and pulverizing the recycled wooden members and recycled resinous members together.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: February 28, 2006
    Assignee: Misawa Homes Co., Ltd.
    Inventors: Hidenori Taguchi, Keishiro Umemura
  • Publication number: 20050287855
    Abstract: A card connector comprises a main body having a first card accommodating space and a first spring attachment member. An ejection mechanism includes a push block, an ejection bar, and a positioning block. The push block has a second spring attachment member and an abutment member. The abutment member extends into the first card accommodating space for engagement with a card. The positioning block has first and second guide grooves. The ejection bar has a first end attached to the push block and a second end positioned in the first or second guide groove. The second end is capable of following the first and second guide grooves to move the positioning block relative to the push block during insertion and ejection of the card. A spring extends between the first and spring attachment members and biases the push block during insertion and ejection of the card.
    Type: Application
    Filed: June 24, 2005
    Publication date: December 29, 2005
    Inventor: Hidenori Taguchi
  • Patent number: 6976888
    Abstract: A land grid array socket contact has a resilient contact that extends parallel to a base plate and is attached to at least one side walls of the base plate by a curved section angled approximately 180 degrees from the at least one side wall. The resilient contact has a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board. In another embodiment, the land grid array socket contact has a resilient contact extending from an upper end of a base plate. The resilient contact has an elongated slit substantially in a center of the resilient contact with respect to a direction of width and a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: December 20, 2005
    Assignee: Tyco Electronics AMP K.K.
    Inventors: Hiroshi Shirai, Shinichi Hashimoto, Hidenori Taguchi
  • Publication number: 20040058580
    Abstract: A land grid array socket contact structured so that the size of a resilient contact in a direction perpendicular to a base plate in a vicinity of a root of the resilient contact is minimized so that an arrangement pitch in this direction may be reduced and the resilient contact may be displaced by a large amount to minimize connection resistance. The land grid array socket contact has a base plate with side walls. A resilient contact extends parallel to the base plate. The resilient contact is attached to at least one of the side walls of the base plate by a curved section angled approximately 180 degrees from the at least one side wall. The resilient contact has a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board.
    Type: Application
    Filed: September 12, 2003
    Publication date: March 25, 2004
    Inventors: Hiroshi Shirai, Shinichi Hashimoto, Hidenori Taguchi