Abstract: A piezoelectric device has an insulated container including a frame portion. Four external connection terminals to be solder-bonded to an external substrate each have a shape with a bent portion in plan view in which the external connection terminal is extending from one of the four corners on a bottom surface of the frame portion in a long-side direction and a short-side direction of an outer peripheral edge of the frame portion. The four external connection terminals are spaced from an opening end of a recess with an electrode-absent region interposed therebetween. The four external connection terminals each have a plurality of angular parts in plan view, and at least one of the plurality of angular parts is in proximity to the inner peripheral edge of the frame portion in an arc shape or a chamfered shape at each of the four corners thereof.

Abstract: A piezoelectric device has an insulated container including a frame portion. Four external connection terminals to be solder-bonded to an external substrate each have a shape with a bent portion in plan view in which the external connection terminal is extending from one of the four corners on a bottom surface of the frame portion in a long-side direction and a short-side direction of an outer peripheral edge of the frame portion. The four external connection terminals are spaced from an opening end of a recess with an electrode-absent region interposed therebetween. The four external connection terminals each have a plurality of angular parts in plan view, and at least one of the plurality of angular parts is in proximity to the inner peripheral edge of the frame portion in an arc shape or a chamfered shape at each of the four corners thereof.

Abstract: A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4, exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47. The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13. The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded.

Abstract: A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4, exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47. The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13. The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded.