Abstract: Provided is a laser processing method for performing laser processing on a printed circuit board by using a carbon dioxide laser oscillator that oscillates a laser by applying an RF pulse, including continuing laser oscillation by restarting an RF pulse application while a laser after completing the RF pulse application is output, cutting off the continuously oscillated laser for a desired time, and performing laser processing on the printed circuit board.

Abstract: A laser processing method includes providing a unit configured to obtain time t0 from a time when the high-frequency pulse RF output is turned on to a time when the laser is actually output in advance and change a traveling direction of the laser in an optical path of the laser, irradiating the workpiece with all the lasers while the high-frequency pulse RF output is turned on, and removing at least a part of the laser from the workpiece simultaneous with turning off the high-frequency pulse RF output.

Abstract: A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 ?m high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.

Abstract: A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 ?m high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.

Abstract: A multi-axis laser machine in which the working efficiency can be improved even when machining positions in respective systems are different from each other. The positioning operation of a laser positioning unit for positioning an optical path of a laser beam in an axis and the positioning operation of another laser positioning unit for positioning another optical path of the laser beam in another axis are performed independently of each other. An arbitration unit monitors the laser positioning units as to whether they have finished positioning or not. The arbitration unit operates a deflection unit (AOM) so as to supply the laser beam to one of the laser positioning units which has finished positioning. Incidentally, when the laser positioning units finish positioning simultaneously, the arbitration unit supplies the laser beam to the laser positioning units in a predetermined sequence.

Abstract: A multi-axis laser machine in which the working efficiency can be improved even when machining positions in respective systems are different from each other. The positioning operation of a laser positioning unit for positioning an optical path of a laser beam in an axis and the positioning operation of another laser positioning unit for positioning another optical path of the laser beam in another axis are performed independently of each other. An arbitration unit monitors the laser positioning units as to whether they have finished positioning or not. The arbitration unit operates a deflection unit (AOM) so as to supply the laser beam to one of the laser positioning units which has finished positioning. Incidentally, when the laser positioning units finish positioning simultaneously, the arbitration unit supplies the laser beam to the laser positioning units in a predetermined sequence.