Abstract: An electrolytic capacitor includes a capacitor element, an exterior body covering the capacitor element, an anode terminal electrically connected to an anode body of the capacitor element, and a cathode terminal electrically connected to a cathode portion of the capacitor element. Each of the anode terminal and the cathode terminal includes a connection portion in contact with the capacitor element, a lead-out portion led out from the connection portion to an outer surface of the exterior body, and an external terminal portion disposed along the outer surface of the external body and having an exposed surface exposed from the external body. At least a part of a covered portion of the lead-out portion, the covered portion being covered with the exterior body, has a cross-sectional shape including a chamfered shape corner portion in a cross section parallel to a surface region of the outer surface of the exterior body where the lead-out portion is led out.

Abstract: An electrolytic capacitor includes a capacitor element, an exterior body covering the capacitor element, an anode terminal electrically connected to an anode body of the capacitor element, and a cathode terminal electrically connected to a cathode portion of the capacitor element. Each of the anode terminal and the cathode terminal includes a connection portion in contact with the capacitor element, a lead-out portion led out from the connection portion to an outer surface of the exterior body, and an external terminal portion disposed along the outer surface of the external body and having an exposed surface exposed from the external body. At least a part of a covered portion of the lead-out portion, the covered portion being covered with the exterior body, has a cross-sectional shape including a chamfered shape corner portion in a cross section parallel to a surface region of the outer surface of the exterior body where the lead-out portion is led out.

Abstract: An electrolytic capacitor includes a capacitor element, an exterior body covering the capacitor element, an anode terminal electrically connected to an anode body of the capacitor element, and a cathode terminal electrically connected to a cathode portion of the capacitor element. Each of the anode terminal and the cathode terminal includes a connection portion in contact with the capacitor element, a lead-out portion led out from the connection portion to an outer surface of the exterior body, and an external terminal portion disposed along the outer surface of the external body and having an exposed surface exposed from the external body. At least a part of a covered portion of the lead-out portion, the covered portion being covered with the exterior body, has a cross-sectional shape including a chamfered shape corner portion in a cross section parallel to a surface region of the outer surface of the exterior body where the lead-out portion is led out.

Abstract: A reactor includes a coil body, an exterior case, and a filler. The coil body includes a core and a coil wound around the core. The exterior case includes a metal structure and a resin frame. The metal structure has a bottom surface and a side wall provided to stand upright from the bottom surface. The bottom surface and the side wall of the metal structure are unitarily formed with each other. The frame is disposed at an opposite side to the bottom surface of the metal structure. The exterior case houses the core and the coil. The filler is filled between the exterior case and the coil body.

Abstract: An electronic component includes a substrate a functional section provided on the substrate, and a sealing body which is provided on the substrate and seals the functional section. In a temperature region having a lowest temperature that is at least as high as the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is greater than the coefficient of linear expansion of the substrate. In a temperature region having a highest temperature that is lower than the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is less than the coefficient of linear expansion of the substrate. The electronic component exhibits superior reliability even upon prolonged use.

Abstract: A reactor includes a coil body, an exterior case, and a filler. The coil body includes a core and a coil wound around the core. The exterior case includes a metal structure and a resin frame. The metal structure has a bottom surface and a side wall provided to stand upright from the bottom surface. The bottom surface and the side wall of the metal structure are unitarily formed with each other. The frame is disposed at an opposite side to the bottom surface of the metal structure. The exterior case houses the core and the coil. The filler is filled between the exterior case and the coil body.

Abstract: A reactor includes a core made of magnetic material and a coil wound around a part of the core. The core includes a first core part having both ends opposite to each other, a second core part having both ends opposite to each other, a third core part having both ends opposite to each other, and a fourth core part having both ends opposite to each other. The coil includes a first coil part wound around a part of the first core part and a second coil part wound around a part of the second core part.

Abstract: An acoustic wave device includes a piezoelectric substrate, comb-shaped electrodes, wires, a sealing body, terminal electrodes, and connection electrodes. The comb-shaped electrodes are disposed on the piezoelectric substrate and are connected to the wires. The sealing body is disposed on the piezoelectric substrate in such a manner that the comb-shaped electrodes are sealed between the piezoelectric substrate and the sealing body. The terminal electrodes are disposed on the sealing body. The connection electrodes penetrate the sealing body so as to electrically connect the wires and the terminal electrodes, respectively. A first linear expansion coefficient in a first temperature range below a first glass transition temperature of the sealing body is larger than a second linear expansion coefficient in a second temperature range above the first glass transition temperature.

Abstract: An electronic component includes a substrate a functional section provided on the substrate, and a sealing body which is provided on the substrate and seals the functional section. In a temperature region having a lowest temperature that is at least as high as the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is greater than the coefficient of linear expansion of the substrate. In a temperature region having a highest temperature that is lower than the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is less than the coefficient of linear expansion of the substrate. The electronic component exhibits superior reliability even upon prolonged use.

Abstract: An acoustic wave device includes a piezoelectric substrate, comb-shaped electrodes, wires, a sealing body, terminal electrodes, and connection electrodes. The comb-shaped electrodes are disposed on the piezoelectric substrate and are connected to the wires. The sealing body is disposed on the piezoelectric substrate in such a manner that the comb-shaped electrodes are sealed between the piezoelectric substrate and the sealing body. The terminal electrodes are disposed on the sealing body. The connection electrodes penetrate the sealing body so as to electrically connect the wires and the terminal electrodes, respectively. A first linear expansion coefficient in a first temperature range below a first glass transition temperature of the sealing body is larger than a second linear expansion coefficient in a second temperature range above the first glass transition temperature.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes an element, a coil formed in the element, terminals electrically connected to the coil, and magnetic layers arranged so as to be substantially parallel to a winding surface of the coil are formed in the element and the entirety of the magnetic layers is covered with a material of which thermal expansion and contraction rate is uniform.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes element (5), coil (6) formed in element (5), terminals (7, 8) electrically connected to coil (6), and magnetic layers (9A, 9B) arranged so as to be substantially parallel to a winding surface of coil (6) are formed in element (5) and entire magnetic layers (9A, 9B) is covered with a material of which thermal expansion and contraction rates are constant.

Abstract: A resonance type transformer has an O-shaped magnetic core, a primary winding, and a secondary winding. The O-shaped magnetic core is formed of a first split magnetic core and a second split magnetic core, and has a first magnetic leg provided with a first magnetic gap therein and a second magnetic leg opposite the first magnetic leg. The primary winding is wound on the outer periphery of the first magnetic so as to cover at least the first magnetic gap. The secondary winding is wound on the outer periphery of the second magnetic leg.

Abstract: There is provided an electronic component formed by adopting an adhesion reinforcement structure to an external electrode or the like, which is embedded in a protecting section made of a resin and part of which is exposed. Even when an external force is applied through the external electrode, the external force can be broadly dispersed all over a connecting section with the protecting section due to the adhesion reinforcement structure, to suppress an influence of the external force on a wiring, and whereby it is possible to omit a substrate that has been one of constitutional elements of a conventional electronic component, so as to realize reduction in height of the electronic component by the height of the substrate.

Abstract: A magnetic element for multi-phase is composed by burying a plurality of coils in a composite magnetic material such that a negative coupling of magnetic fluxes or a positive coupling of magnetic fluxes exists between at least two coils. This structure more miniaturizes inductors, or choke coils as the multi-phase magnetic element suitably used for application of a large current to many kinds of electronic equipment. Such multi-phase magnetic element has an excellent ripple current property.

Abstract: A magnetic element for multi-phase is composed by burying a plurality of coils in a composite magnetic material such that a negative coupling of magnetic fluxes or a positive coupling of magnetic fluxes exists between at least two coils. This structure more miniaturizes inductors, or choke coils as the multi-phase magnetic element suitably used for application of a large current to many kinds of electronic equipment. Such multi-phase magnetic element has an excellent ripple current property.

Abstract: A magnetic element for multi-phase is composed by burying a plurality of coils in a composite magnetic material such that a negative coupling of magnetic fluxes or a positive coupling of magnetic fluxes exists between at least two coils. This structure more miniaturizes inductors, or choke coils as the multi-phase magnetic element suitably used for application of a large current to many kinds of electronic equipment. Such multi-phase magnetic element has an excellent ripple current property.

Abstract: The invention is comprised of a coil group arranging a plurality of terminal-integrated type coils (1), (4) formed by bending a metal sheet in a preset development form and having a predetermined positional relationship, and a magnetic material (7) burying therein the coil group. For example, axes of the plurality of coils (1), (4) constituting the coil group, are arranged in parallel wherein the center point of at least one coil selected from the plurality of coils (1), (4) and the center point of a coil other than the selected coil are in an staggered arrangement. Due to this, an array type choke coil can be realized which is thin overall and operable with a large current in a high frequency band.

Abstract: An inductance part is provided which includes: a coil which is formed by bending a metal plate into a coil shape; a magnetic body in which the coil is buried; and a short ring which faces the coil.

Abstract: The choke coil disclosed comprises: coils incorporated with terminals and intermediate taps manufactured of die cut metal plates; and a magnetic powder in which the coils are embedded.