Abstract: A back side protective sheet for a solar cell, which is capable of enhancing performance of adhesion to an EVA resin as a filler used to seal solar cell elements, maintaining weather resistance for a long period of time, and reducing weight thereof; and a solar cell module including the back side protective sheet for a solar cell. The back side protective sheet is disposed on a back side of the solar cell module and includes: a first film fixedly attached so as to abut a surface of a filler and containing linear low-density polyethylene having a density greater than or equal to 0.91 g/cm3 and less than or equal to 0.93 g/cm3; and a second film laminated to the first film and disposed in an outermost layer of the back side protective sheet, the second film containing polyvinylidene fluoride and polymethyl methacrylate.

Abstract: Provided are a back side protective sheet for a solar cell, which is capable of enhancing performance of adhesion to an EVA resin as a filler used to seal the solar cell elements, of maintaining weather resistance for a long period of time, and of reducing a weight thereof; and a solar cell module including the back side protective sheet for a solar cell. The back side protective sheet (10) for a solar cell is disposed on a back side of the solar cell module (100) and includes: a first film (11) fixedly attached so as to abut a surface of a filler (7) and containing linear low-density polyethylene having a density greater than or equal to 0.91 g/cm3 and less than or equal to 0.93 g/cm3; and a second film (12) laminated on the first film (11) and disposed in an outermost layer of the back side protective sheet (10) for a solar cell, the second film (12) containing polyvinylidene fluoride and polymethyl methacrylate.

Abstract: An antenna coil for an IC card includes a base material of a resin film having the thickness of at least 15 &mgr;m and at most 70 &mgr;m, and a circuit pattern layer formed on a surface of the base material, having the thickness of at least 7 &mgr;m and at most 60 &mgr;m formed of an aluminum foil containing aluminum by at least 97.5 mass % and at most 99.7 mass %. On the surface of the resin film base material, an aluminum foil containing aluminum is fixed by using a polyurethane based adhesive layer containing an epoxy resin, a resist ink layer having a prescribed pattern is printed on the foil, the foil is etched using the resist ink layer as a mask to form a circuit pattern layer, and the resist ink layer is removed.

Abstract: An antenna coil for an IC card includes a base material of a resin film having the thickness of at least 15 &mgr;m and at most 70 &mgr;m, and a circuit pattern layer formed on a surface of the base material, having the thickness of at least 7 &mgr;m and at most 60 &mgr;m formed of an aluminum foil containing aluminum by at least 97.5 mass % and at most 99.7 mass %. On the surface of the resin film base material, an aluminum foil containing aluminum is fixed by using a polyurethane based adhesive layer containing an epoxy resin, a resist ink layer having a prescribed pattern is printed on the foil, the foil is etched using the resist ink layer as a mask to form a circuit pattern layer, and the resist ink layer is removed.