Patents by Inventor Hidenori YOSHIMURA

Hidenori YOSHIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vascular sap flow speed sensor and method of manufacturing vascular sap flow speed sensor
    Patent number: 10935563
    Abstract: To provide a vascular sap flow speed sensor having a size allowing measurement of the flow speed of vascular sap in a part of a plant such as a stem and capable of being manufactured at low cost. A vascular sap flow speed sensor 1 includes a heater sensor HS and a reference sensor RS. The heater sensor HS includes: a first probe unit 10a including a heat transfer plate 11 and a probe 12; a heater 20; a first temperature sensor 30a; and a first housing 40a in which the heat transfer plate 11, the heater 20, and the first temperature sensor 30a are housed. The reference sensor RS includes: a second probe unit 10b including a heat transfer plate 11 and a probe 12; a second temperature sensor 30b; and a second housing 40b in which the heat transfer plate 11 and the second temperature sensor 30b are housed. Each of the first probe unit 10a and the second probe unit 10b is made of a metallic material.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: March 2, 2021
    Assignee: NATIONAL UNIVERSITY CORPORATION KAGAWA UNIVERSITY
    Inventors: Fusao Shimokawa, Kyosuke Nakada, Hidekuni Takao, Kyohei Terao, Hidenori Yoshimura, Hiroki Ishizuka, Tsuyoshi Kobayashi, Ikuo Kataoka
  • VASCULAR SAP FLOW SPEED SENSOR AND METHOD OF MANUFACTURING VASCULAR SAP FLOW SPEED SENSOR
    Publication number: 20200081026
    Abstract: To provide a vascular sap flow speed sensor having a size allowing measurement of the flow speed of vascular sap in a part of a plant such as a stem and capable of being manufactured at low cost. A vascular sap flow speed sensor 1 includes a heater sensor HS and a reference sensor RS. The heater sensor HS includes: a first probe unit 10a including a heat transfer plate 11 and a probe 12; a heater 20; a first temperature sensor 30a; and a first housing 40a in which the heat transfer plate 11, the heater 20, and the first temperature sensor 30a are housed. The reference sensor RS includes: a second probe unit 10b including a heat transfer plate 11 and a probe 12; a second temperature sensor 30b; and a second housing 40b in which the heat transfer plate 11 and the second temperature sensor 30b are housed. Each of the first probe unit 10a and the second probe unit 10b is made of a metallic material.
    Type: Application
    Filed: March 1, 2018
    Publication date: March 12, 2020
    Inventors: Fusao SHIMOKAWA, Kyosuke NAKADA, Hidekuni TAKAO, Kyohei TERAO, Hidenori YOSHIMURA, Hiroki ISHIZUKA, Tsuyoshi KOBAYASHI, Ikuo KATAOKA