Patents by Inventor Hideo Ai

Hideo Ai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5019482
    Abstract: A photosensitive composition comprising:(a) a polymer(b) 1 to 20% by weight, based on the weight of polymer (a), of a compound having a terminal ethylenically unsaturated group;(c) 0.1 to 20% by weight, based on the weight of polymer (a), of an oxime ester compound(d) 0.01 to 10% by weight, based on the weight of polymer (a), of a coumarin compound having a wave length of the absorption peak of 330 to 550 nm; has high photosensitivity to an actinic light of a wave length of 400 to 500 nm and is capable of forming heat-resistant images, patterns or films.
    Type: Grant
    Filed: August 5, 1988
    Date of Patent: May 28, 1991
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Nobuhiko Suga, Satoshi Ogitani, Hideaki Takahashi, Akihiko Ikeda
  • Patent number: 4839261
    Abstract: A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR1## and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula--(R.sub.4).sub.nwherein R.sub.4 is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20.degree. C. of from 0.001 to 500 poises.
    Type: Grant
    Filed: September 15, 1987
    Date of Patent: June 13, 1989
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Nobuo Nakazaki, Hideo Ai, Manabu Miyao
  • Patent number: 4778859
    Abstract: A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula ##STR1## wherein, each of X, X.sub.1, X.sub.2, X.sub.3 and X.sub.4 is a tetravalent carbocyclic or heterocyclic residue, each of Y.sub.1, Y.sub.2, and Y.sub.3 is a divalent carbocylic or heterocyclic residue, at least one of Z.sub.1 and Z.sub.2 is a residue having a reactive carbon-carbon double bond, and each of l, m, and n is an integer from 0 to 20, preferably from 0 to 10. The polyimide may include (a) polyacrylate compounds (b) bis-imide compounds (c) photosensitive polyimide precursors (d) oxime initiators (e) a 3 component sensitizer of a phenone compound, a mercapto compound, and an arylamine-alkanol, or mixtures of a,b,c,d, and e.
    Type: Grant
    Filed: April 28, 1986
    Date of Patent: October 18, 1988
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Akihiko Ikeda, Kan-ichi Yokota
  • Patent number: 4767797
    Abstract: A linear polymer having a recurring unit represented by the formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each independently is a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-10 cycloalkyl group, an aryl group, or a halogen atom and the ethynyl group is in either meta position or para position to the main polymer chain;and a weight-average molecular weight of 1,000 to 1,000,000. A resin composition consisting essentially of (i) a polymer having a recurring unit represented by the formula (I) or a polymer having a recurring unit represented by the formula (I) and a recurring unit represented by the formula (II): ##STR2## wherein X and Y each independently is a C.sub.6-20 aryl group, a C.sub.1-10 alkyl group, a C.sub.6-10 cycloalkyl group, a silyl group having a C.sub.1-10 alkyl group or a C.sub.
    Type: Grant
    Filed: August 25, 1986
    Date of Patent: August 30, 1988
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Yohsuke Koizumi, Naohiro Tsuruta
  • Patent number: 4756989
    Abstract: Disclosed is an image-forming material having a high sensitivity to high-energy beams and excellent in dry etching resistance, heat stability and resolution which comprises a copolymer containing a total of 1 to 99 mole-% of at least one of recurring structural units represented by the following formulas [A] and [A'] and 1 to 99 mole-% of at least one recurring structural unit represented by the following formula [B] and having a number-average molecular weight of 500 to 1,000,000: ##STR1## wherein R.sub.1 of the formulas [A] and [A'] represents a hydrogen or halogen atom, or an alkyl group having 1 to 6 carbon atoms, the substituent groups R.sub.
    Type: Grant
    Filed: July 10, 1985
    Date of Patent: July 12, 1988
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Nobuo Nakazaki, Manabu Miyao
  • Patent number: 4754016
    Abstract: A process for preparing a polyamide which comprises polycondensing a dicarboxylic acid and a diamine by using a combination of at least one phosphine and at least one disulfide as the condensing agent.
    Type: Grant
    Filed: June 3, 1986
    Date of Patent: June 28, 1988
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Akihiko Ikeda, Yoshio Matsuoka
  • Patent number: 4702997
    Abstract: A photopolymerizable laminate comprising a photopolymerizable layer and a support layer, said photopolymerizable layer containing;(1) 5 to 95% by weight, based on the total weight of the photopolymerizable layer, of a binder comprising a vinyl polymer or a vinyl copolymer,(2) 95 to 5% by weight, based on the total weight of the photopolymerizable layer, of a monomeric component containing at least 50% by weight of at least one compound selected from the group consisting of the photopolymerizable unsaturated compounds represented by the formulae (A), (B) and (C) shown below and having a value of molecular weight/number of double bonds contained of 1000 or less, and(3) 0.01 to 30% by weight, based on the total weight of the photopolymerizable layer, of a photopolymerization initiator.
    Type: Grant
    Filed: February 6, 1986
    Date of Patent: October 27, 1987
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Akihiko Ideda, Jiro Sato
  • Patent number: 4667006
    Abstract: A linear polymer having a recurring unit represented by the formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each independently is a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-10 cycloalkyl group, an aryl group, or a halogen atom and the ethynyl group is in either meta position or para position to the main polymer chain; and a weight-average molecular weight of 1,000 to 1,000,000.
    Type: Grant
    Filed: August 25, 1986
    Date of Patent: May 19, 1987
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Yohsuke Koizumi, Naohiro Tsuruta
  • Patent number: 4645823
    Abstract: A process for preparing polyamides which comprises polycondensing dicarboxylic acids having the following general formula and diamines by using carbodiimides as the condensing agent. ##STR1## wherein X is a group having a valence of (m+2), and C.sub.6-20 carbocyclic group, C.sub.3-20 heterocyclic group, C.sub.2-20 alkyl group, or C.sub.2-20 alkenyl group, the group having at least one carbon-carbon double bond in the position of conjugating to carboxylic acid radical or the group having an .alpha.,.beta.-unsaturated ketone structure;Y is --OR or --NRR' wherein R and R' each independently is C.sub.5-20 carbocyclic group, C.sub.1-20 heterocyclic group, C.sub.1-20 alkyl group or substituted group thereof having at least one substituent selected from the group consisting of --OW (wherein W is C.sub.1-12 alkyl group), C.sub.2-12 saturated acyl group, C.sub.2-12 saturated acyloxy group, C.sub.2-12 saturated acylamino group, C.sub.2-12 dialkylamino group, --SW (wherein W is the same as defined above), C.sub.
    Type: Grant
    Filed: September 10, 1985
    Date of Patent: February 24, 1987
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Akihiko Ikeda, Yoshio Matsuoka
  • Patent number: 4528332
    Abstract: Novel copolymers having a weight average molecular weight of 500 to 5,000,000 and comprising 1 to 99% by weight of a recurring unit represented by the formula (I), 1 to 99% by weight of a recurring unit represented by the formula (II) and 0 to 98% by weight of a recurring unit represented by the formula (III): ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group; X is a hydrogen atom, a methyl group or a phenyl group; Y is a hydrogen atom, a halogen atom, a methyl group, a phenyl group or a cyano group; and Z is a phenyl group, a phenyl group substituted by at least one alkyl group having 1 to 8 carbon atoms, a polycyclic aromatic hydrocarbon group having 10 to 20 carbon atoms, a cyano group, --COOR.sup.2 (in which R.sup.2 is an alkyl group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms), --COR.sup.3 (in which R.sup.
    Type: Grant
    Filed: January 3, 1984
    Date of Patent: July 9, 1985
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Akihiko Ikeda, Yoshio Matsuoka
  • Patent number: 4447580
    Abstract: A resin composition comprising (A) a polymer having, in the molecule, at least two groups represented by the following structural formula (I): ##STR1## wherein R.sub.1 is isopropyl, sec-butyl, tert-butyl, a C.sub.5-20 alkyl group, a C.sub.3-20 cycloalkyl group, a C.sub.5-20 alkenyl group, a C.sub.3-20 hydroxyalkyl group, a C.sub.5-20 alkoxyalkyl group, a C.sub.3-20 aminoalkyl group, a C.sub.6-20 aryl group or a C.sub.6-20 arylalkyl group, and n is 0, 1 or 2, and (B) a polymer having an electron attractive group and an .alpha.,.beta.-ethylenic double bond adjacent thereto. Though said composition is stable at room temperature, it is crosslinked and cured at high temperatures because the amino group of the polymer (A) adds to the double bond of the polymer (B). Accordingly, said resin composition is suitable for use as a cathodic electrocoating material.
    Type: Grant
    Filed: November 12, 1981
    Date of Patent: May 8, 1984
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Hideo Ai, Naohiro Tsuruta
  • Patent number: 4122269
    Abstract: 1,3,6-Tris(4,6-diamino-1,3,5-triazine-2-yl)hexane, and a flame retardant resin composition comprising (A) about 5 to about 100 parts by weight of 1,3,6-tris(4,6-diamino-1,3,5-triazine-2-yl)hexane and (B) 100 parts by weight of a thermosetting resin or a thermoplastic resin.
    Type: Grant
    Filed: July 26, 1977
    Date of Patent: October 24, 1978
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Masazumi Chono, Hideo Ai, Michihiro Aboshi, Yoshikazu Suda, Naoji Yoshii
  • Patent number: D303673
    Type: Grant
    Filed: September 10, 1986
    Date of Patent: September 26, 1989
    Assignee: Amada Company, Limited
    Inventor: Hideo Ai